Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 3 2 20 LOC ALL RIGHTS RESERVED. BY - 4 1 2 D GP MATERIAL: CAGE ASSEMBLY: 0.25mm THICK NICKEL SILVER ALLOY EMI SPRINGS: COPPER ALLOY HEAT SINK: ALUMINUM HEAT SINK CLIP: STAINLESS STEEL.
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ECO-12-013192
27SEP2012
ECO-13-014600
12SEP2013
ECO-14-008488
06MAY2014
SFF-8433
06OCT2011
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2010 RELEASED FOR PUBLICATION 6 5 4 3 2 2010 LOC GP ALL RIGHTS RESERVED. BY - CAGE ASSEMBLY MATERIAL: NICKEL SILVER, 0.25 THICK HEAT SINK MATERIAL: ALUMINUM HEAT SINK CLIP MATERIAL: STAINLESS STEEL EMI SPRING MATERIAL: COPPER ALLOY
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ECR-11-018214
02SEP2011
ECO-12-003841
14MAR2012
ECO-12-005533
05APR2012
ECR-13-019963
5NOV2013
18MAR2010
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AMPLIFIER 5W
Abstract: NTE1116
Text: NTE1116 Integrated Circuit Audio Power Amplifier, 5W Description: The NTE1116 is a monolithic integrated circuit designed for use as a low frequency class B amplifier. The external cooling tabs enable 2.5 watts of output power to be achieved without the use of an external heat sink and 5 watts of output power using a small area of the P.C. board copper as a heat sink.
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NTE1116
NTE1116
100Hz,
22kHz
AMPLIFIER 5W
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Thermal Management
Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
Text: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION BY - 6 4 3 2 20 LOC GP ALL RIGHTS RESERVED. FIN TYPE HEAT SINK 1 MATERIAL: CAGE ASSEMBLY - NICKEL-SILVER ALLOY. EMI SPRINGS - COPPER ALLOY. HEATSINK - ALUMINUM. HEATSINK CLIP - STAINLESS STEEL.
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ECO-11-019224
09JAN2012
ECO-12-021462
10DEC2012
26FEB201ETAIL
6AUG2007
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PDF
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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PDF
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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PDF
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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PDF
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mosfet SOA testing
Abstract: AN9409 RFP70N06 RFD3055 mosfet transistor checking and testing 407 transistor
Text: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated junction temperature. The circuits to maintain a fixed current
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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AN9409
Abstract: transistors 9409 477J mosfet SOA testing Harris Semiconductor to220 power transistor RFD3055 RFP70N06 DB233 transistors+9409
Text: Harris Semiconductor No. AN9409 Harris Power MOSFETs August 1994 SAFE OPERATING AREA TESTING WITHOUT A HEAT SINK Authors: Wally Williams and Stan Benczkowski Introduction package at a very predictable rate since constant power circuits are usually used in SOA testing. There is also heat flow
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AN9409
1-800-4-HARRIS
AN9409
transistors 9409
477J
mosfet SOA testing
Harris Semiconductor to220 power transistor
RFD3055
RFP70N06
DB233
transistors+9409
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mosfet SOA testing
Abstract: AN-7516 RFD3055 RFP70N06 TO-251 fairchild
Text: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Title N94 bt AFE ERING REA STG THUT AT NK utho eyrds er ) OCI O frk geode setes OCEW frk Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated
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ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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mosfet SOA testing
Abstract: AN-7516 RFD3055 RFP70N06 TO-251 fairchild
Text: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Title N75 ubct AFE PERTING REA ESTG ITHUT EAT NK) utho ) eyords reor ) OC FO fark ageode seute OCEW fark Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated
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ebonol
Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
215CB
647-25ABP
217-36CT6
230-75AB-10
MO-169
205-CB
281-2AB
204CB
1134 sot dm
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PDF
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AMPLIFIER 5W TBA800
Abstract: TBA800 TBA-800 tba 396
Text: L I NEAR I N T E G R A T E D C I R C U I T TBA 800 AUDIO POWER AMPLIFIER The TBA 800 is an m on olith ic integrated pow er am p lifie r in a 12-lead quad in -lin e plastic package. The external coo lin g tabs enable 2.5 W ou tput pow er to be achieved w ith out external he a t-sin k and 5 W ou tput pow er using a sm all area of the P.C.
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OCR Scan
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12-lead
AMPLIFIER 5W TBA800
TBA800
TBA-800
tba 396
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PDF
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Untitled
Abstract: No abstract text available
Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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Original
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O-220,
OT-223,
SOL-20
217-36CTR6
1-866-9-OHMITE
217-36CTT6
O-263
MO-169
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SIL-PAD to-247
Abstract: ASTM-A228 SIL-PAD 1000 TO 247 SIL-PAD density Tgon 800 A228 A366 MV102
Text: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type
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O-247
O-264
6063T5
MV-102-55E
MA-102-55E
1-866-9-OHMITE
SIL-PAD to-247
ASTM-A228
SIL-PAD 1000 TO 247
SIL-PAD density
Tgon 800
A228
A366
MV102
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SIL-PAD density
Abstract: ASTM-A228 A228
Text: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type
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O-247
O-264
6063T5
MV-102-55E
MA-102-55E
1-866-9-OHMITE
SIL-PAD density
ASTM-A228
A228
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TO-268
Abstract: No abstract text available
Text: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion
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O-263)
O-268)
O-263
O-268
1-866-9-OHMITE
TO-268
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PDF
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pcb board of miniskiip 2
Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones
Text: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm
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Untitled
Abstract: No abstract text available
Text: HEATSINK Heatsink with clips for TO-264 and TO-247 F E AT U R E S • Minimum assembly cost and labor. Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs. • Maximum Thermal Transfer. Maximum surface area per unit volume, efficient cooling fins & consistent
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O-264
O-247
MV-102-55E
MV-102-55Eà
MA-102-55Eà
MV-101-27Eà
MA-101-27Eà
MV-302-55Eà
MA-302-55Eà
MV-301-27Eà
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to-268
Abstract: No abstract text available
Text: HEATSINK D Series THERMAL MANAGEMENT Heatsink For SMT devices F e at u r e s • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum
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O-263)
DV-T263-101E
DA-T263-101E
DV-T263-101E-TR
DA-T263-101E-TR
DV-T268-101E
DA-T268-101E
DV-T268-101E-TR
DA-T268-101E-TR
1-866-9-OHMITE
to-268
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