1001 dl pwm
Abstract: etri converter SC1188 Si4410 CS16 IRL2203 IRLR024N SC1188CS bst03 DL 1416
Text: SC1188 Programmable Synchronous DC/DC Converter, Dual Low Dropout Regulator Controller POWER MANAGEMENT Description Features u Synchronous design, enables no heatsink solution u 95% efficiency switching section u 4 bit DAC for output programmability u 1.8V, 2.5V short circuit protected linear controllers
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SC1188
SC1188
IRLR024N
SC1188CS
SO-16
1001 dl pwm
etri converter
Si4410
CS16
IRL2203
IRLR024N
SC1188CS
bst03
DL 1416
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF AD AB Y V T P M K H F D B AJ AG e AE AC AA W heatsink U e2 R N L
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HBGA584:
OT707-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J
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HBGA600:
OT605-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N
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HBGA672:
OT835-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA504: plastic thermal enhanced ball grid array package; 504 balls; body 35 x 35 x 0.9 mm; heatsink B D SOT604-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AF AB T F D B heatsink R M H e AA U P K AE AC W V y ∅w M C AG AD Y y1 C
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HBGA504:
OT604-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x
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HBGA520:
OT1088-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 b e AC AB AA Y W V U T R P N M L K J H G F E D C B A e heatsink e2 1 shape
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HBGA329:
OT714-1
OT71XP
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF Y AE e AC AA W V heatsink U T e2 R P N M L K J H G F E D C B A 1
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HBGA552:
OT706-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-2 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2
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HBGA324:
OT1123-2
sot1123-2
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA352: plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm B D SOT546-2 A ball A1 index area A2 E A1 A A3 detail X e1 b e AE AC AA W U R N L J G E C A C v M B ZD1 ∅w M y y1 C v M A AF AD AB e Y heatsink V T P e1
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HBGA352:
OT546-2
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2
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HBGA324:
OT1123-1
sot1123-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA360: plastic, thermal enhanced ball grid array package; 360 balls; heatsink SOT1163-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2
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HBGA360:
OT1163-1
sot1163-1
MS-034
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d0311
Abstract: Schottky 2,1A 40v MTBF
Text: Technical Specification IQ1BxxxHPXxx 66-160V 3.3-48V 255W 3000V dc Half-brick Continuous Input Outputs Max Power REINFORCED INSULATION DC-DC Converter A N @ 48 T U PC 5V O IN V -1 IQ 66 High efficiency, 91% at full rated load current Delivers full power with minimal derating - no heatsink required
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6-160V
d0311
Schottky 2,1A 40v MTBF
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dc-dc converter step up 12v t0 48v
Abstract: IQ72120HPx21
Text: Technical Specification IQ72xxxHPXxx 42-110V 1.8-48 V 255 W 3000 V dc Half-brick Continuous Input Outputs Max Power REINFORCED INSULATION DC-DC Converter R 46 N @ 46 T U PC 5V O 0H IN V 10 IQ High efficiency, 91% at full rated load current Delivers full power with minimal derating - no heatsink required
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IQ72xxxHPXxx
2-110V
dc-dc converter step up 12v t0 48v
IQ72120HPx21
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Untitled
Abstract: No abstract text available
Text: Package outline Ceramic single-ended flat package; heatsink mounted; 2 mounting holes; 12 in-line tin Sn plated leads SOT347B D y U q A P F S U1 G E L 1 12 e Z b c v A w M Q A 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D E e F G
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OT347B
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Untitled
Abstract: No abstract text available
Text: Package outline Ceramic single-ended flat package; heatsink mounted; 1 mounting hole; 11 in-line gold-metallized leads SOT451A D y U A p F S U1 G E L 1 11 e b c v A w M Q A 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D E e F G L p
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OT451A
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA456: plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink SOT900-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB Y AE AC AA e W V U T R
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HBGA456:
OT900-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA736: plastic thermal enhanced ball grid array package; 736 balls; heatsink SOT1035-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e C ∅v ∅w b 1/2 e AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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HBGA736:
OT1035-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; heatsink SOT1095-1 B D D1 A ball A1 index area j E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D
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HBGA624:
OT1095-1
sot1095-1
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Untitled
Abstract: No abstract text available
Text: l e l u o m Semiconductor, Inc. TC622 TC624 LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR FEATURES • ■ ■ ■ Temperature Set Point Easily Programs with a Single External Resistor Operates with 2.7V Power Supply TC624 TO-220 Package for Direct Mounting to Heatsink
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TC622
TC624
TC624)
O-220
TC622XAT)
TC622
TC624
TC622Vxx,
TC624Vxx)
O-220
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JDS9-1Y
Abstract: No abstract text available
Text: DS9 Series High Performance Solid State Belays Electronics « li AC solid state relay for loads up to 1A @ 250Vrms 2A with heatsink P ro d u c t Fa c ts • Qualified to M ÍI-R-28750C (M il p/Ji M 28750/9-001Y). m Optically coupled all solid state relay.
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I-R-28750C
28750/9-001Y)
250Vrms
500Vrms
DS9-TBD-PDF-KRG-1-04
JDS9-1Y
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PC1215
Abstract: BPC35
Text: :m ic q n d u c to r T m GBPC 12,15, 25, 35 SERIES H O L E FOR # 1 0 S C R E W Features 0.22 5.59i • Integrally m olded heatsink provided very low therm al resistance for maximum heat dissipation. GBPC 0.25(6.35 • Surge overload rartings from 300 am peres to
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LT 5320 DIODE
Abstract: LT 5320
Text: NEC 400m w ZENER DIO DE ELECTRON DEVICE 1N746A— 1N759A 1 N 7 4 6 A ~ 1 N 7 5 9 A are D H D {Double Heatsink Diode construction planar type O U T L IN E D R A W IN G zener diodes possessing an allowable power dissipation of 400 m watt. FEATURES Unit : mm)
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OCR Scan
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1N746A--
1N759A
1N746A
1N747A
1N748A
1N749A
1N750A
1N751A
1N752A
1N753A
LT 5320 DIODE
LT 5320
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Zener diode 224
Abstract: RD24E RD22E RD2.4E zener rd9.1esb2
Text: NEC 5 0 0 m w ZENER D IO D E ELECTRON DEVICE R D 2.0E —RD 100E Outline Drawing U nit: mm NEC Type RD l“ J E Series are DHD (Double Heatsink Diode) construction planar type zener diodes possessing an allowable power dissipation of 500 m watt. T FEA TU R E S
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DO-35
RD100E
Zener diode 224
RD24E
RD22E
RD2.4E
zener rd9.1esb2
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