hyperlynx
Abstract: VeriBest Intusoft
Text: R Chapter 4: PCB Design Considerations • • • • • • Hyperlynx Mentor Microsim Intusoft Veribest Viewlogic Xilinx IBIS Advantages Xilinx provides preliminary IBIS files before working silicon has been verified before tape out , as well as updated versions of IBIS files after the ICs are verified. Preliminary IBIS
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FF672
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Intusoft
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CMOS spice model
Abstract: XAPP475 hyperlynx
Text: Application Note: Spartan-3 FPGA Family R Using IBIS Models for Spartan-3 FPGAs XAPP475 v1.0 June 21, 2003 Summary Input/Output Buffer Information Specification (IBIS) models are industry-standard descriptions used to simulate I/O characteristics in board-level design simulation. IBIS models for
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CMOS spice model
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Virtex-II
Abstract: No abstract text available
Text: R DataSource CD-ROM Q2-01 Virtex Products — More Technical Information Virtex-II Pinouts for Packages Text Files see “pinout_text_files” on root directory of DataSource CD Virtex-II Platform FPGA User Guide Virtex-II IBIS Files (zip format) Virtex-II IBIS files (tar format)
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MA6050
Abstract: XC4000XLA XAPP150 XC4000 XC4000E XC4000XL XC4000XV XC9500 XC9500XL
Text: Application Note: FPGA, CPLD R XAPP150 v1.1 May 15, 2001 I/V Curves for Xilinx FPGA and CPLD Families These typical curves describe the output sink and source current for average processing, nominal supply voltage and room temperature. For additional data see the Xilinx IBIS files at:
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MA6050
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XAPP150
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IBIS
Abstract: UG588 AMI encoding ibis bc SIS 900 A-18 UG198 virtex 5 VIRTEX-5 GTX
Text: Virtex-5 FPGA RocketIO GTX Transceiver IBIS-AMI Signal Integrity Simulation Kit User Guide for SiSoft Quantum Channel Designer UG588 v1.1 February 12, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development
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Abstract: 3p75G ami 98 UG196
Text: Virtex-5 FPGA RocketIO GTP Transceiver IBIS-AMI Signal Integrity Simulation Kit User Guide for SiSoft Quantum Channel Designer UG587 v1.0 March 2, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development
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ami 98
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hyperlynx
Abstract: PIN diode SPICE model
Text: Application Note AC292 IBIS Models: Background and Usage Introduction For better understanding of the signal integrity on printed circuit boards PCBs , hardware designers often need to simulate the design with I/O characteristic models. The designer must carefully consider signal
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Abstract: No abstract text available
Text: R IBIS Models The need for higher system performance leads to faster output transitions. Signals with fast transitions cannot be considered purely digital; it is important to understand their analog behavior for signal integrity analysis. To simulate the signal integrity on printed circuit boards PCB accurately and solve design
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CMOS spice model
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Abstract: No abstract text available
Text: Te c h n i c a l B r i e f IBIS Models: Background and Usage I n tro du ct i on For better understanding of the signal integrity on printed circuit boards PCBs , hardware designers often need to simulate the design with I/O characteristic models. The designer must carefully consider signal integrity issues such
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System Software Writers Guide
Abstract: QII53020-7 hyperlynx
Text: 11. Signal Integrity Analysis with Third-Party Tools QII53020-7.1.0 Introduction As FPGA devices are used in more high-speed applications, signal integrity and timing margin between the FPGA and other devices on the printed circuit board PCB become increasingly important
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Abstract: hspice System Software Writers Guide QII53020-7 SIGNAL INTEGRITY AND TIMING SIMULATION
Text: Section IV. Signal Integrity As FPGA usage expands into more high-speed applications, signal integrity becomes an increasingly important factor to consider for an FPGA design. Signal integrity issues must be taken into account as part of FPGA I/O planning and assignments, as well as in the design and layout of the
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Abstract: Quartus II Handbook version 9.1 volume Design and IBIS Models QII53020-9 EP2S60F1020C3
Text: 7. Signal Integrity Analysis with Third-Party Tools QII53020-9.1.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the board must be within specification and tolerance before a single PCB is built. If the
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Quartus II Handbook version 9.1 volume Design and
IBIS Models
EP2S60F1020C3
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Abstract: No abstract text available
Text: 6. Signal Integrity Analysis with Third-Party Tools November 2013 QII53020-13.1.0 QII53020-13.1.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the
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Abstract: hyperlynx ep2s60f1020c System Software Writers Guide EP2S60F1020C3 QII53020-10 713N S
Text: 7. Signal Integrity Analysis with Third-Party Tools QII53020-10.0.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the board must be within specification and tolerance before a single PCB is built. If the
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EP2S60F1020C3
713N S
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Abstract: F1020 SSTL-18 Altera source-synchronous EP2S60F1020 package and silicon
Text: White Paper Signal Integrity Comparisons Between Stratix II and Virtex-4 FPGAs Introduction Signal integrity has become a critical issue in the design of high-speed systems. Poor signal integrity can mean increased engineering costs, delayed product releases, and even lost revenues. The opportunity cost
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Abstract: XC3S500E-FT256 simulation model electrolytic capacitor XC3S500E FG256 FT256 UG112 XAPP489 hyperlynx PCB echo sound
Text: Application Note: Spartan-3E Family R Four- and Six-Layer, High-Speed PCB Design for the Spartan-3E FT256 BGA Package XAPP489 v1.0 October 31, 2006 Summary This application note addresses low-cost, four- to six-layer, high-volume printed circuit board (PCB) layout for a Spartan -3E FPGA in the FT256 1 mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also
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altera EP1C6F256 cyclone
Abstract: Allegro part numbering ep1c6f256 ibis file download ir object counter project ORCAD PCB LAYOUT BOOK pcb layout guide differential ohms stackup System Software Writers Guide AN90 EP2S30
Text: Section II. I/O and PCB Tools This section provides an overview of the I/O planning process, Altera FPGA pin terminology, as well as the various methods for importing, exporting, creating, and validating pin-related assignments using the Quartus II software. This section also
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Abstract: hyperlynx Device Reliability report XILINX
Text: R XPower XPower XPower is the first graphic power-analysis software available for programmable logic design. Earlier than ever in the design flow you can analyze total device power, power per net, routed, or partially routed or unrouted designs. You can also receive graphical or
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SMV-R010
Abstract: schematic diagram lcd monitor samsung xc5vlx50tffg1136 4433 mosfet DISPLAYTECH* 64128 Micron TN-47-01 smv r010 mosfet 4433 ML561 370HR
Text: Virtex-5 FPGA ML561 Memory Interfaces Development Board User Guide UG199 v1.2.1 June 15, 2009 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Micron TN-47-01
smv r010
mosfet 4433
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Abstract: RS-644 standard intel FPGA SPARTAN XC2S50 FG256 FG676 FT256 PCI33 PQ208 RS-644
Text: Application Note: Spartan-II and Spartan-IIE Families R Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs XAPP179 v2.1 August 23, 2004 Summary The Spartan -II and Spartan-IIE FPGA families simplify high-performance design by offering SelectIO™ inputs and outputs. The Spartan-II devices can support 16 different I/O standards
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Abstract: No abstract text available
Text: R XPower XPower XPower is the first graphic power-analysis software available for programmable logic design. Earlier than ever in the design flow you can analyze total device power, power per net, routed, or partially routed or unrouted designs. You can also receive graphical or
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Ethernetblaster
Abstract: fpga altera cable "Memory Interfaces" Decoupling And Layout Of Digital Printed Circuits fpga altera usb to sata cable schematic OPDN1100 ibis sata altera board
Text: AN 597: Getting Started Flow for Board Designs AN-597-1.1 March 2010 This application note provides an overview of the Altera FPGA design flow. Introduction In many system designs, the typical design flow begins with a Marketing Requirements Document MRD that specifies both the high-level business
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"Memory Interfaces"
Decoupling And Layout Of Digital Printed Circuits
fpga altera
usb to sata cable schematic
OPDN1100
ibis sata
altera board
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Abstract: XC4000EX XC4000XL XC4000XLT XC4000XV XC4028XL XAPP
Text: APPLICATION NOTE 1 I/O Characteristics of the ‘XL FPGAs XAPP 088 November 24, 1997 Version 1.0 1 13* Application Note by PETER ALFKE and BOB CONN Summary Data sheets describe I/O parameters in digital terms, providing tested and guaranteed worst-case values. This application
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c code for convolution
Abstract: powersi Kramer vhdl code for lte channel coding Kuznetsov PP1052 linear convolution advantages 77KB transistor a1m
Text: DesignCon 2006 Fast Time-Domain Simulation of 200+ Port S-Parameter Package Models Vadim Heyfitch, Altera Corporation [email protected], 408 544-6914 (Vladimir Dmitriev-Zdorov, Mentor Graphics Corporation) ([email protected], (720) 494-1196)
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