pc cooler fan
Abstract: intel 80486 k6-2 500 intel pentium mmx 80486 pentium mmx PENTIUM k6III pentium 200 mmx Pentium MMX MODULE
Text: Hola1 H A H Passive heatsinks for processors B art. no. Rth [K/W] suitable for processor type 6.1 4.5 DEC Alpha-AXP DEC Alpha-AXP ICK A 10 ICK A 20 C dim. [mm] A 10 20 D E art. no. Rth [K/W] suitable for processor type 8.1 Power PC ICK PPC 51 F fixing method:
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Heatsinks
Abstract: BGA16
Text: Dissipateurs pour BGA 6 RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W] 35 35 1,8 ICK BGA 35 x 35
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Untitled
Abstract: No abstract text available
Text: Dissipateurs pour BGA RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 6 Kühlkörper für BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W]
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Abstract: No abstract text available
Text: Kühlkörper für BGA’s Dissipateurs pour BGA – convient particulièrement pour les Ball Grid Arrays – dimensions du dissipateur correspondent au type de BGA respectif – à coller directement sur le composant BGA RW 35 [K/W] 30 10 10 25 1,8 ICK BGA 10 x 10
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Abstract: No abstract text available
Text: 4 16,51 50,8 50,8 1:1 Schutzvermerk gemäß DIN ISO 16016 beachten Fischer Elektronik GmbH & Co. KG 2005 Freimasstoleranz Oberfläche DIN ISO 2768m SA Datum Erst. 25.07.2005 Bearb. 25.07.2005 Werkstoff / Material AlMgSi0,5 F22 (EN AW 6060 T66) Z. Änderungen
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2768m
20x20
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Untitled
Abstract: No abstract text available
Text: Heatsinks for PGA art. no. ICK PGA 20 x 20 x 8 W L F . 5 0 x 5 0 art. no. ICK PGA 2 0 x 2 0 x 8 K W L F . 5 0 x 5 0 with fixing clam p for socket 7 and socket 3 7 0 art. no. ICK PGA 2 0 x 2 0 x 1 0 W L F . 4 8 x 4 8 art. no. ICK PGA 2 0 x 2 0 x 1 2 W L F . 5 0 x 5 0
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Untitled
Abstract: No abstract text available
Text: ADVANCED INTERCONNECTIONS Molded Standoff for LIF PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401 -823-5200 • FAX 401-823-8723 Molded Standoff for LIF PGA Sockets Standard Sockets SOS or SIS - Standard Molded Standoff Sockets
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Untitled
Abstract: No abstract text available
Text: ADVANCED INTERCONNECTIONS RTV Sealed PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 RTV Sealed PGA Sockets • Tel. 401-823-5200 • FAX 401-823-8723 Now Available in Low Profile .015” Above Board RTV Seal IVpe ÄTtwrrinai Shown Features:
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Untitled
Abstract: No abstract text available
Text: ADVANCED INTERCONNECTIONS Tape Sealed PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401-8 2 3 -5 20 0 • FAX 401-823-8723 Tape Sealed PGA Sockets Features: Terminal Information • Removable tape seal protects plated contact in harsh environments.
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footprint 8M1-A
Abstract: No abstract text available
Text: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62
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rtv 159
Abstract: textool socket TE zip socket rtv 157 TEXTOOL
Text: Table of Contents ADVANCED INTERCONNECTIONS 5 Energy Way, P.O. Box 1019, W est Warw ick, Rl 02893 • Tel. 4 0 1 -823-5200 • FAX 401-823-8723 D I P S e c t i o n Pages 8 through 43 Description Open Frame DIP Sockets . S e rie s . Page #
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fc pga
Abstract: Intel Mendocino
Text: Passive heatsinks for processors Rth [K/W] suitable for processor type PEN 38 F 4.0 Intel Pentium®/ M M X /A M D ® K6-2/ AM D ® Kó-lll/ IDT C 6 / ID T W 2 A 4 9.5 4 9.5 38 5.0 ICK PEN 38 K 4.0 Intel® Pentium®/ M M X /A M D ® K6-2/ AM D ® Kó-lll/ IDT C 6 / ID T W 2 A
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ICKS 45
Abstract: MMX intel fc pga SLOT PGA 370
Text: Heatsinks for IC processor a rt. n o . page ^th [K/W ] dissipation m ounting method socket suitable fo r processor type conductive fo il/ cond. adhesive conductive fo il/ cond. adhesive universal universal universal universal loss IC K P G A 6 x 6 x 1 4 B 10
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we dsp32
Abstract: xlxxx DSP32C FZL 101 DSP32C-SL pir 815
Text: WE DSP32C Digital Signal Processor Description The WE DSP32C Digital Signal Processor is a 32-bit, high-speed, programmable integrated circuit. The CMOS device is packaged in a standard 133-pin square pin-grid-array PGA package. Two execution units, the control arithmetic
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DSP32C
32-bit,
133-pin
24-bit
32-bit
40-bit
RS42898
J32562
DS88-92DMOS
we dsp32
xlxxx
FZL 101
DSP32C-SL
pir 815
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dsp16
Abstract: No abstract text available
Text: Advance Data Sheet WE DSP16 Digital Signal Processor for Military Applications Description The WE DSP16 Digital Signal Processor is a 16-bit high-speed programmable integrated circuit. The device is fabricated in low-power CMOS technology and is available in a
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DSP16
16-bit
133-pin
36-bit
RS42898
J32562
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14X14-1
Abstract: 544132-3
Text: AMP Products for Surface M ount A ssem bly Catalog 65230 Revised 11-95 • T h ro u g h -H o le Screw Machine Sockets Continued DIP Sockets (Continued) Closed Frame ~ r .175 (4 .4 5 ] .115 [2 .9 2 ] .020 [ 0 .5 1 ] Dia. Dimensional Data Printed Circuit Board Thickness—
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013to
17x17168
003232b
14X14-1
544132-3
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544196-3
Abstract: No abstract text available
Text: Products for Surface Mount Assembly Catalog 65230 • Through-Hole Revised 11-95 Screw Machine Sockets Continued SIP and ZIP Sockets m SIP Sockets r - r .175 [4.45] i ■i t .115 j[2.92] P W - .0 [0. ! ? , ■ * Printed Circuit Board Thickness— .062 to .093 [1.57 to 2.36]
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07T7312
544196-3
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Untitled
Abstract: No abstract text available
Text: WE DSP32 Digital Signal Processor Features • 16-MHz and 25-MHz parts are available ■ 2048 bytes ROM, 4096 bytes RAM on-chip ■ Memory can be addressed as 8-, 16-, or 32-bits ■ Four 40-bit accumulators ■ Interfaces to a microprocessor without any
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DSP32
16-MHz
25-MHz
32-bits
40-bit
DSP32-SL
DSP32-AL
DSP32-DS
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DIE PRODUCTS BURR-BROW N« i B B PGA102 DIE l Digitally-Controlled Programmable Gain/Fast-Settling AMPLIFIER DESCRIPTION The PGA102 is a precision monolithic digitallyprogram m able gain block designed for compactness and high reliability. The user can select one of three
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PGA102
18VDC
PGA102
MIL-STD-883,
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we dsp32
Abstract: No abstract text available
Text: Data Sheet WE DSP32 Digital Signal Processor Description The WE DSP32 Digital Signal Processor integrated circuit is a 32-bit high-speed programmable digital signal processor. The device is available in two versions, at 16 MHz or 25 MHz. Both 16-MHz and 25-MHz parts are
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DSP32
32-bit
16-MHz
25-MHz
40-pin
100-pin
13-pin
16-bit
32-bit
we dsp32
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FPQ-132-0
Abstract: XC3020-CQ100 XC3020
Text: XC3020B Military Logic Cell Array Product Specification. S ee Note 1. FEATURES Part Number • M IL-S T D -883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array • Low power CMOS static memory technology Logic Capacity
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XC3020B
XC3020
TSC0085
FPQ-132-0
XC3020-CQ100
XC3020
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PGA478B
Abstract: No abstract text available
Text: 4 3 THIS DRAWING IS U NPUBLISHED. RELEASED FOR PUBLICATION 2 0 0 4 ,2 0 0 4 . R E V IS IO N S ALL RIGHTS RESERVED. ^ COPYRIGHT 2004 J BY TYCO ELECTRONICS CORPORATION. A DESCRIPTION R EVISED CO VER NATUR AL COLOR, HOUSING BLACK, BOTH P O LYEST ER , U L 9 4 V - 0 j
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280CT08
HP0A478I
PGA478B
AR2000
PGA478B
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Untitled
Abstract: No abstract text available
Text: DRAWING MADE IN THIRD ANGLE PROJECTION THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION COPYRIGHT 19 AMP BY INCORPORATED. 7 6 5 3 4 2 LOC ,19 DIST AG ALL INTERNATIONAL RIGHT5 RESERVED. 1 REVISIONS 24 ZONE LTR DESCRIPTION DATE REV PER 0 1 6 0 - 3 7 1 6 - 9 4
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AMPT1074
DV208A
DEPT2339
AMPT1074XJ
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Untitled
Abstract: No abstract text available
Text: Y p o n q n o Military Logic Cell Array Product Specification. See Note 1. F E A TU R ES Part Number • M IL-S T D -883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array XC3090 Logic Capacity gates 9000 Configurable
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XC3090
TSC0097
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