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    IERC HEAT SINKS Search Results

    IERC HEAT SINKS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ISL78444EVAL1Z Renesas Electronics Corporation 100V 3A Source, 4A Sink Half-Bridge Drivers Evaluation Board Visit Renesas Electronics Corporation
    ISL78424EVAL3Z Renesas Electronics Corporation 100V 3A Source, 4A Sink Half-Bridge Drivers Evaluation Board Visit Renesas Electronics Corporation
    ISL78434EVAL1Z Renesas Electronics Corporation 100V 3A Source, 4A Sink Half-Bridge Drivers Evaluation Board Visit Renesas Electronics Corporation
    ISL88550AIRZ-T Renesas Electronics Corporation Synchronous Step Down Controller with Sourcing and Sinking LDO Regulator Visit Renesas Electronics Corporation
    ISL88550AIRZ Renesas Electronics Corporation Synchronous Step Down Controller with Sourcing and Sinking LDO Regulator Visit Renesas Electronics Corporation

    IERC HEAT SINKS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TE 555

    Abstract: 10X10 13X13 14X14 BDN14-6CB 11X11
    Text: Peel and Stick Heat Dissipators NOTES: • Thermal resistance of adhesive tape is included • Thermal resistance values based on power densityof 3 watts/in². • Part numbers listed for standard black anodized heat sinks with IERC adhesive tapes. SIZE HEAT SINK


    Original     		BDN09-3CB/A01 BDN12-3CB/A01 BDN12-5CB/A01 BDN13-3CB/A01 BDN13-5CB/A01 BDN14-3CB/A01 BDN14-6CB/A01 BDN15-3CB/A01 BDN15-5CB/A01 BDN16-3CBA/01 TE 555 10X10 13X13 14X14 BDN14-6CB 11X11 PDF

    TX0522B

    Abstract: APR27-27-20CB TXBF 032025B
    Text: Heat Sinks IERC HEAT SINKS Figure 1 FIGURE 1 Figure FIGURE 2 FIGURE 3 2 FIGURE 4 FIGURE 5 Figure FIGURE 6 3 FIGURE 7 4 Figure FIGURE 8 5 6 7 8 Description Dimensions - Inches LxWxH BDN09-3CB/A01 BDN10-3CB/A01 BDN10-5CB/A01 BDN11-3CB/A01 BDN12-3CB/A01 BDN12-5CB/A01


    Original     		BDN09-3CB/A01 BDN10-3CB/A01 BDN10-5CB/A01 BDN11-3CB/A01 BDN12-3CB/A01 BDN12-5CB/A01 BDN13-3CB/A01 BDN14-3CB/A01 BDN15-3CB/A01 BDN15-5CB/A01 TX0522B APR27-27-20CB TXBF 032025B PDF

    CU1100

    Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
    Text: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights


    Original     		CPR19-19-12U CPR19-19-15U CPR19-19-20U CPR19-19-25U CU1100 CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts PDF

    C2121M

    Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
    Text: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights


    Original     		APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T C4343T C4545T C2121M APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S PDF

    Chomerics Thermattach

    Abstract: T412 T411 APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB T410 Chomerics
    Text: Series APF Low Height Thin-Fin Forged Heat Sinks Technical Data Features • Precision Forging Technology for High Power Applications • Low Profile Thin Fins • Designed for BGA and Other Surface Mount Packages • Select from Multiple Fin Heights • Improved Thermal Performance


    Original     		APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB APF30-30-10CB APF30-30-13CB APF40-40-06CB APF40-40-10CB APF40-40-13CB APF19-19-10CB/A01 Chomerics Thermattach T412 T411 APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB T410 Chomerics PDF

    AER25-25-12CB

    Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
    Text: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights


    Original     		AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB AER19-19-23CB AER19-19-28CB AER19-19-33CB C4040T C4343T C4545T AER25-25-12CB AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M PDF

    elina fan

    Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
    Text: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of


    Original     		VSC870, VSC880 AN-36 VSC870 VSC880 G53034-0, elina fan 3dfx heat sink for 304 point BGA 2319B 658-35AB 100C G53034-0 192 BGA PACKAGE thermal resistance PDF

    AN1010

    Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
    Text: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and


    Original     		AN1010 BCM8320 AN1010 BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BDN14-6CB EXTRUDED ALUMINUM PDF

    AN1018

    Abstract: heat sink Chomerics Thermattach T412 APF19-19-13CB APF30-30-06CB APF19-19-06CB APF19-19-10CB
    Text: Technical Brief AN1018 Low Height Thin-Fin Forged Heat Sink Introduction Board space constraints and increased demands for thermal management control are challenges that engineers must consider with each new application. Unused input power is lost as heat, which can destroy


    Original     		AN1018 /T410, AN1018 heat sink Chomerics Thermattach T412 APF19-19-13CB APF30-30-06CB APF19-19-06CB APF19-19-10CB PDF

    to66 socket

    Abstract: 66s 66 HP1-436-B to66 T0-66s dissipator LM25775 TO-66 SOCKET transistor t06 19 HP1-000-B
    Text: Series HP1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss.


    Original     		HP1-000-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO15-U HP1-420-U HP1-000-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB to66 socket 66s 66 HP1-436-B to66 T0-66s dissipator LM25775 TO-66 SOCKET transistor t06 19 HP1-000-B PDF

    diode t03

    Abstract: transistor t06 19 dissipator T066 HP3-000-B HP3-000-CB HP3-000-U HP3-T03-33U HP3-T03-U T0-66s
    Text: Series HP3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP3 Series for Single TO-3 or Stud Mount DESCRIPTION OF CURVES A. B. C. D. E. • • N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss.


    Original     		HP3-000-U HP3-T03-U HP3-T03-33U HP3-000-CB HP3-T03-CB HP3-T03-33CB HP3-000-B HP3-T03-B HP3-T03-33B T0-36s. diode t03 transistor t06 19 dissipator T066 HP3-000-B HP3-000-CB HP3-000-U HP3-T03-33U HP3-T03-U T0-66s PDF

    Untitled

    Abstract: No abstract text available
    Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical


    Original     		2002/95/EC 2002/95/EC. PDF

    TX0522B

    Abstract: TXP0508B TX0506-1B VME card cage TXP0503B TX050 TX0547 TXP0508ND tx1807b-1b TXB2P-055-037B
    Text: HEAT FRAMES GENERAL DESCRIPTION Custom aluminum heat frames are designed for ruggedized military and industrial circuit card applications in harsh environments. These frames can be sized to fit small daughter cards up to 9U VME and may be used with a bottom plate to stiffen circuit


    Original     		O-18mium TXBE-050-028 TXB2P-050-037 TXBE-045-028B TXB2P-045-037B TXBE-050-028B TXB2P-050-037B TXBE-055-028B TXB2P-055-037B TXBE-045-028ND TX0522B TXP0508B TX0506-1B VME card cage TXP0503B TX050 TX0547 TXP0508ND tx1807b-1b TXB2P-055-037B PDF

    BA 7277

    Abstract: No abstract text available
    Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical


    Original     		2002/95/EC 2002/95/EC. BA 7277 PDF

    dissipator

    Abstract: No abstract text available
    Text: Series UP10 for TO-3 Dual Mount Applications Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP10 Series for TO-3 Dual Mount Applications Natural Conv. °C/W : 7.7 Forced Air (°C/W): 2 Mounting Envelope: 3.38" x 1.40" x .44" DESCRIPTION OF CURVES A. B.


    Original     		UP10-TO3-2U UP10-426-2U UP10-428-2U UP10-TO-3-2CB UP10-TO3-2B UP10-426-2B UP10-426-2CB UP10-428-2CB UP10-428-2B dissipator PDF

    TO-66 SOCKET

    Abstract: to66 TO-66 dissipator to66 socket weight TO66 UP-TO66-47B IERC heat sinks
    Text: Series UP for TO-66 Outline Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP Series for TO-66 Outline Natural Conv. °C/W : 7.1 Forced Air (°C/W): 2.5 Mounting Envelope: 1.78" x 1.78" x 1.00" DESCRIPTION OF CURVES A. B. C. D. E. • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.


    Original     		UP-TO66-U UP-TO66-47U UP-TO66-52U UP-TO66-CB UP-T66-B UP-TO66-47CB UP-TO66-47B UP-TO66-52CB UP-TO66-52B TO-66 SOCKET to66 TO-66 dissipator to66 socket weight TO66 UP-TO66-47B IERC heat sinks PDF

    CTS Electronic Components

    Abstract: No abstract text available
    Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical


    Original     		2002/95/EC 2002/95/EC. CTS Electronic Components PDF

    Untitled

    Abstract: No abstract text available
    Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical


    Original     		2002/95/EC 2002/95/EC. PDF

    Untitled

    Abstract: No abstract text available
    Text: TM International Electronic Research Corporation A CTS Company 413 N. Moss St., Burbank, CA 91502 Tel: 818-842-7277 Fax: 818-848-8872 RoHS Certification Letter This letter certifies the component identified is compliant to EU Directive 2002/95/EC regarding the restriction on the use of certain hazardous substances RoHS in electrical


    Original     		2002/95/EC 2002/95/EC. PDF

    dissipator

    Abstract: LA000B3B LA000B3CB LA000B3U LAT03B3U LAIC3B3B IERC heat sinks FPM Series
    Text: Series LA-B3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-B3 Natural Conv. °C/W : 12 Forced Air (°C/W): 3.7 Mounting Envelope: 1.63" x 1.29" x .75" DESCRIPTION OF CURVES A. B. C. D. E. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.


    Original     		LA000B3U LAT03B3U LA407B3U LA394B3U LA000B3CB LAT03B3CB LA407B3CB LA394B3CB LA000B3B LAT03B3B dissipator LA000B3B LA000B3CB LA000B3U LAT03B3U LAIC3B3B IERC heat sinks FPM Series PDF

    dissipator

    Abstract: LB-Series LAD66A1U LAIC66A1U LA000A1B LA000A1CB LA000A1U IERC heat sinks
    Text: Series LA-A1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-A1 Natural Conv. °C/W : 28.9 Forced Air (°C/W): 8.1 Mounting Envelope: 1.31" x .90" x .25" DESCRIPTION OF CURVES A. B. C. D. E. • • • N.C. Horiz. Device Only Mounted to G-10.


    Original     		LA000A1U LAD66A1U LAIC66A1U LA000A1CB LA000A1B LAD66A1CB LAD66A1Bg dissipator LB-Series LAD66A1U LAIC66A1U LA000A1B LA000A1CB LA000A1U IERC heat sinks PDF

    LAT03B7B

    Abstract: LA394B5CB JE3055 LA394B2CB LAIC3B2B HP3-T0127-CB insultek 445 TBA810 semi catalog LA394B2B
    Text: WE STOP HEAT COLD MEOT SINK/DISSIPATOR PRODUCTS AND THERMAL MANAGEMENT GUIDE 5672 M cAdam Road Mississauga, O ntario L4Z 1T2 Telephone 416 890-0221 Fax (416) 890-1628 UliHWT I UfUUfW-Mi fr z r r r T ] , INTERNATIONAL ELECTRONIC RESEARCH CORPORATION The most comprehensive line


    OCR Scan     		PDF

    dell

    Abstract: Dell Dimension 28 pin zif socket
    Text: 1 2 3 ZONE REY A B C 4 DESCRIPTION INITIAL DRAWING RELEASE PROVIDED TWO SOLDER TAIL LENGTHS. ADDED NOTE 5 & 6 PROVIDED FOUR CUT-OUT RELIEF ON THE COVER: ADDED NEW PART NO. ECO. NO. DATE 1655 1735 2072 11/28/94 4/12/95 9/5/95 18 EQUAL SPACES 82.54*0.13=45.72


    OCR Scan     		SPACES82 OWUMX33 dell Dell Dimension 28 pin zif socket PDF

    Dell L

    Abstract: No abstract text available
    Text: ZONE RET A B C DESCRIPTION INITIAL DRAWING RELEASE PROVIDED TWO SOLDER TAIL LENGTHS. ADDED NOTE 5 k 6 PROVIDED FOUR CUT-OUT RELIEF ON THE COVER: ADDED NEW PART NO. ECO. NO. HATS 1655 11/28/94 1735 4/12/85 2072 9/5/95 18 EQUAL S P A C E S ? § L 4N&l-ACf?UM8


    OCR Scan     		10/14/M Dell L PDF