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    Infineon Technologies AG IGC142T120T6RMX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC142T120T6RMX1SA)
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    Avnet Americas IGC142T120T6RMX1SA2 Waffle Pack 26
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    IGC142T120T6RM Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IGC142T120T6RM Infineon Technologies IGBT Chips; Package: --; Technology: IGBT 4 Medium Power; VDS (max): 1,200.0 V; IC (max): 150.0 A; VCE(sat) (max): 2.05 V; VGE(th) (min): 5.0 V; Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: IGC142T120T6RM IGBT4 Medium Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • soft turnoff • positive temperature coefficient • easy paralleling Chip Type VCE ICn IGC142T120T6 RM 1200V 150A This chip is used for:


    Original     		IGC142T120T6RM IGC142T120T6 L7693B, PDF

    Untitled

    Abstract: No abstract text available
    Text: IGC142T120T6RM IGBT4 Medium Power Chip Features: • 1200V Trench + Field stop technology • low switching losses • soft turnoff • positive temperature coefficient • easy paralleling Chip Type VCE ICn IGC142T120T6 RM 1200V 150A This chip is used for:


    Original     		IGC142T120T6RM IGC142T120T6 L7693B, PDF

    IGC142T120T6RM

    Abstract: No abstract text available
    Text: IGC142T120T6RM IGBT4 Medium Power Chip Features: • 1200V Trench + Field stop technology • low switching losses • soft turnoff • positive temperature coefficient • easy paralleling Chip Type VCE ICn IGC142T120T6RM 1200V 150A This chip is used for:


    Original     		IGC142T120T6RM IGC142T120T6RM L7693B, PDF