thermal camera
Abstract: cameras infrared temperature measure flir system
Text: 62-2012:QuarkCatalogTempNew 8/13/12 6:57 PM Page 62 Thermal Imaging Why Thermal Imaging is Heating Up You'll be excited to know thermography services are in high demand. But first a few of the basics in case you want a quick refresher on how infrared technology works.
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raychem cv-1981
Abstract: raychem cv-1983 raychem
Text: RAYCHEM Tubing Products Table of Contents Application Equipment HL1910E/HL2010E Light duty heating tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 2-4 ThermoGun HG Medium duty heating tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-5, 2-6
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HL1910E/HL2010E
CV-1981
CV-1983
IR-1891
VBH-1-BED-HTR-220V-3WR
CJ1047-000
VBH-1-BED-HTR-TRACK-10FT
VBH-1-BED-HTR-TRACK-15FT
CJ1494-000
CM6819-000
raychem cv-1981
raychem cv-1983
raychem
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RBK-ILS-processor
Abstract: raychem "hot air" cv 1981 raychem cv-1981 RBK-ILS HL1910E cv-1981 DC gear motor raychem cv-1983 PR-25D-REFLECTOR thermogun
Text: RAYCHEM Tubing Products Table of Contents Application Equipment HL1910E/HL2010E Light duty heating tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-3, 2-4 ThermoGun HG Medium duty heating tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-5, 2-6
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HL1910E/HL2010E
CV-1981
CV-1983
IR-1891
VBH-1-BED-HTR-220V-3WR
VBH-1-BED-HTR-TRACK-10FT
VBH-1-BED-HTR-TRACK-15FT
CJ1047-000
CJ1494-000
CM6819-000
RBK-ILS-processor
raychem "hot air" cv 1981
raychem cv-1981
RBK-ILS
HL1910E
DC gear motor
raychem cv-1983
PR-25D-REFLECTOR
thermogun
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Steinel hl1802e manual
Abstract: raychem AD-1377 Calibration RBK-ILS-processor raychem ir-550 ED-7-001-MK2-230V-50HZ raychem AD-1386 raychem termination manual Infrared Heating Tool IR-1759 MiniRay IR1759-MK3 IR-1891
Text: Application Equipment Table of Contents Raychem application equipment is designed and engineered specifically for installation of Raychem heat-shrinkable products. These tools provide the optimal heating temperatures, performance, and control features for maximum production efficiency.
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AA-400
AD-1319-9
AD-1377,
AD-1522
AD-3050-SEAL-TEST-EQUIP
Steinel hl1802e manual
raychem AD-1377 Calibration
RBK-ILS-processor
raychem ir-550
ED-7-001-MK2-230V-50HZ
raychem AD-1386
raychem termination manual
Infrared Heating Tool IR-1759 MiniRay
IR1759-MK3
IR-1891
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Untitled
Abstract: No abstract text available
Text: OS950 Series Digital Infrared Scanner MADE IN USA High Accuracy–Certified NIST Traceability OS950 Series Infrared Scanners from OMEGA provide the highest accuracy available anywhere! The OS950 Series is an entirely different type of instrument than conventional temperature
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OS950
OS951
OS955
RS232
OS956
-RS232
RS232
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heraeus pd944
Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed
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MLC742
heraeus pd944
heraeus pd945
Amicon d125f
D125F3
PD945
PD944
AMICON
D125F
AmiconD125F
TSSOP footprint
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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IPC-SM-780
Abstract: No abstract text available
Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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ANSI/IPC-SM-786)
IPC-TM-650)
JESD22-A112)
IPC-SM-780
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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all ic data
Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as
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all ic data
Intel reflow soldering profile BGA
infrared heating gun
82425EX
intel 80486 DX4
hot air bga
land pattern for TSOP
TSOP infrared
80c196kb 1988
land pattern QFP 208
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IPC-SM-786A
Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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Untitled
Abstract: No abstract text available
Text: Mounting Conditions Date: 2013.10.03 The following information is used for the reflow conditions of Lyontek Products, and please follows the package type to choose the suitable conditions. All the conditions are compliant with JEDEC J-STD-020 and IPC-1066.
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J-STD-020
IPC-1066.
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all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
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RPIP-824-00
Abstract: RAY5103 H54335 raychem aa-400 steinel hl 1802e raychem cv-5000 RAYCHEM thermogun CV-5300 AA-400 mark 3 super heat CV-5000 RAYCHEM thermogun CV-5000
Text: Tyco Electronics Corporation 300 Constitutional Drive Menlo Park, CA 94025 USA No: RPIP-824-00 Rev: D Date: May 2, 2003 Page: 1 of 11 SolderSleeve One-Step Wire And Cable Terminators Installation Procedures For CWT Products 1. Introduction SolderSleeve one-step terminators provide electrical termination in a wide variety of
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RPIP-824-00
RPIP-824-00
RAY5103
H54335
raychem aa-400
steinel hl 1802e
raychem cv-5000
RAYCHEM thermogun CV-5300
AA-400 mark 3 super heat
CV-5000
RAYCHEM thermogun CV-5000
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induction furnace circuit diagram
Abstract: INCOMING RAW MATERIAL INSPECTION REPORT FOR COLD FORGING
Text: THE ELECTROMAGNET Visible Micro Gamma Rays Wavelength Frequency, Hz: 0.1Å X-Rays U.V. Infrared EHF 10Å 100Å 0.1µ 1Å 1µ 10µ 100µ 0.1cm 1cm 3x1019 3x1018 3x1017 3x1016 3x1015 3x1014 3x1013 3x1012 3x1011 3x1 cycles per second VISIBLE SHORT WAVELENGTH
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3x1018
3x1017
3x1016
3x1015
3x1014
3x1013
3x1012
3x1011
induction furnace circuit diagram
INCOMING RAW MATERIAL INSPECTION REPORT FOR COLD FORGING
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RCPS-100-70
Abstract: Raychem installation procedure rcps-100-70 RAY5103
Text: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 U.S.A. Raychem Devices No: Rev: Date: Page RCPS-100-70 G August 7, 2007 1 of 10 Installation Procedure for Standard SolderSleeve Shield Terminators 1.0 Scope: This standard covers the installation procedure and inspection requirements for
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SO175,
D-108,
B-023.
RCPS-100-70
Raychem installation procedure rcps-100-70
RAY5103
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BGA and QFP Altera Package mounting profile
Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine
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Untitled
Abstract: No abstract text available
Text: Handheld Infrared Thermometers for All Applications The new OS520/OS530 series handheld infrared thermometers from OMEGA Engineering adapt to virtually all remote temperature measurement applications. These universal instruments combine the features found in many specialized units into one
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OS520/OS530
through0/OS530
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wsp80
Abstract: weller wsd81 WRS3000 weller MT1500 WSD81 WQB3000 weller soldering tip wsd81 weller wsp80 WHA2000 WES50
Text: CooperTools Weller ELECTRONIC SOLDERING AND DESOLDERING TOOLS 1 Weller® Soldering Table of Contents Founded in 1945, Weller® has become the world’s leading supplier of professional quality soldering equipment, including the famous Weller® temperature controlled irons and soldering guns. Weller® also makes advanced
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WSD81
WSD161
MT1500
CT02-9564/AC/12181/25M/Printed
wsp80
weller wsd81
WRS3000
weller MT1500
WSD81
WQB3000
weller soldering tip wsd81
weller wsp80
WHA2000
WES50
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infrared heating gun
Abstract: gyrotron TEM00
Text: CPI gyrotrons were the first commercially available high-power, long-pulse/CW, high-frequency devices for plasma fusion experiments and other scientific and industrial applications. CPI-MPP provides an extensive line of gyrotrons that cover frequencies from 28-140 GHz with power levels ranging from 10 kW to 1.3 MW.
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TEM00
infrared heating gun
gyrotron
TEM00
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solder paste 63sn alpha metal
Abstract: failure of heating element in hot air gun making hot air gun 63SN 37PB SOLDER reworking guidelines
Text: Document 362-1 Soldering Surface Mount Components Types of Solder Concerns regarding the use of water-soluble flux Water soluble fluxes can leave weak organic acid WOA residues that must be thoroughly removed from all pc board components. All fine wire components, like many
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FLIR Systems
Abstract: No abstract text available
Text: FLIR Thermal Imaging Cameras E-Series i-Series T-Series A Thermography Hero’s Welcome from FLIR Patrol officers, security personnel, and American troops use FLIR infrared technology to protect lives and resources every day. In many ways, you as a thermographer do,
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supercapacitor
Abstract: robotic arm pick and place robotic arm supercapacitors
Text: CAP-XX Supercapacitors - Loading & Assembly Instructions CAP-XX supercapacitor products are heat sensitive. Overheating of the supercapacitor may result in degradation of performance and useful life. Please observe the following precautions to assure life-of-product reliability:
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50psi.
supercapacitor
robotic arm
pick and place robotic arm
supercapacitors
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LCD Monitor Inverter
Abstract: walsin ceramic capacitor walsin capacitor
Text: Walsin Technology Corporation NP0, 1808/1812, 3000V MLCC HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Why High Voltage MLCCs? n High voltage MLCCs for power systems Switching power supplies, DC to DC converters and DC to AC inverters are widely used in many
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