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    INGAAS-300L Search Results

    INGAAS-300L Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-107401300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54112-109401300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54121-407061300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54121-811262300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54112-107241300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    INGAAS-300L Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    InGaAs-300L UDT Sensors Photodiode, Diffused Module, 0.9A/W Sensitivity, 4nSec, 0.1nA Original PDF