R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.
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PC-ZIP/DIP20-01
PC-ZIP/DIP28-01
PC-ZIP/DIP28-02
PC-ZIP20/DIP18-01
R50-E2Y2-24
sk 8085
84 pin plcc ic base
Aromat TQ2E-24V
UT1553BCRTM
INTEL 486 dx2
soic40
plcc44 pinout numbers
XE4006E
68hc001
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80386SL
Abstract: No abstract text available
Text: 1C Test Clips Pomona JEDEC PQFP Test Clips Pomona's JEDEC QFP test clips are designed to fit on surface-mounted plastic and ceramic JEDEC chips. Choose from three clip types designed to give you optimum func tionality and ease of use for testing, troubleshooting
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XCS3201FN
Abstract: ATT92020 80386SL MC68HC11A1FU
Text: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable
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132 pin PGA socket
Abstract: INTEL 132 QFP land pattern QFP 132 80960JA SF-QFJ132SA-G-02 Cobra
Text: Relative orientations top views 0.100" typ. PGA A1 1.450" Pin 1 QFP Pin 1 ( TRST ) A1 Top view Target PCB 80960JA QFP Land Pattern 1.450" The Surface mount foot (QFP Base) is symmetrical and can solder to the Target PCB in any of 4 90° rotations. The PGA top,
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80960JA
SF-QFJ132SA-G-02
FR4/G10
PC-PGA/QFP80960JA-G-01
PC-PGA/QFP-80960JA-G-01
132 pin PGA socket
INTEL 132 QFP
land pattern QFP 132
80960JA
Cobra
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D431000
Abstract: INTEL 87C196 USER MANUAL D75304GF AIC6360Q d431000agw aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054
Text: IC Test Clips Test Clip Selection Made Easy To select the Pomona IC Test Clip specifically designed for your chip, find the table for your chip type and follow the selection procedure outlined in this section. SSOP/QSOP JEDEC QFP Pomona IC Test Clips are uniquely designed to provide
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SN74F32D,
EPM5032,
TMC1171
TMPN3120,
HM628128,
D431000AGW
D431000
INTEL 87C196 USER MANUAL
D75304GF
AIC6360Q
aic-6360
INTEL PLCC 68 dimensions
AIC-6360Q
d431000ag
NEC uPD71054
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132 pin PGA socket
Abstract: 80960JA SF-QFJ132SA-L-01
Text: Relative orientations top views 0.100" typ. PGA A1 1.450" Pin 1 QFP Pin 1 ( TRST ) Target PCB 80960JA QFP Land Pattern A1 Top view 1.450" 0.321" 1 2 The Surface mount foot (QFP Base) is symmetrical and can solder to the Target PCB in any of 4 90° rotations. The PGA top,
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80960JA
SF-QFJ132SA-L-01
FR4/G10
100shell
PC-PGA/QFP80960JA-L-01
PC-PGA/QFP-80960JA-L-01
132 pin PGA socket
80960JA
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d431000agw
Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002
Text: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and
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ABT16244,
ACT16245
FCT16223,
FCT162511
d431000agw
D75304GF
AIC6360Q
Actel a1280
intel 80386dx
HG62G027
AIC-6360Q
CL-SH260
L1A9349
5252 F 1002
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TSOP 56 socket
Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the
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68-Pin
iMC00XFLKA
iNC110XX
TSOP 56 socket
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
ic packages
QFP 64 Cavity dip
QFP 64 Cavity package
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
80SM
50 mil pitch ceramic package
240817
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intel packaging
Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than
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CH01WIP
intel packaging
CERAMIC PIN GRID ARRAY CPGA lead frame
CERAMIC CHIP CARRIER LCC 68 socket
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
PLCC 68 intel package dimensions
68 CERAMIC LEADLESS CHIP CARRIER LCC
INTEL CDIP 40 PIN
INTEL PLCC 68 dimensions tape
tsop Shipping Trays
QFP Shipping Trays
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AP-368
Abstract: 82557 82557 user manual intel 82557 82557 specification update CRC-16 and CRC-32 CX 879 intel 82596 CRC-16 CRC-32
Text: AP-368 APPLICATION NOTE 82557 10 100 Mbps PCI LAN Controller A Guide to 82596 Compatibility Technical Marketing Network Products Division November 1995 Order Number 644126-001 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in
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AP-368
AP-368
82557
82557 user manual
intel 82557
82557 specification update
CRC-16 and CRC-32
CX 879
intel 82596
CRC-16
CRC-32
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CERAMIC CHIP CARRIER LCC 68 socket
Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a
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9020 eeprom
Abstract: adapter block diagram 9020 eprom 82596CA 9060ES 9036
Text: PCI 9036 T E April 1995 Version 1.3 FOR NEW DESIGNS USE PCI 9060ES PCI Bus Master Interface Chip for Intel 82596CA LAN Controller Features_ _ General D escrip tio n _ • PCI Bus Master Interface for Intel 82596CA Ethernet
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9060ES
82596CA
9020BV,
9060ES
bfiS514T
9020 eeprom
adapter block diagram
9020 eprom
9036
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Untitled
Abstract: No abstract text available
Text: PCI 9036 T E C H N D L D E Y April 1995 Version 1 3 FOR NEW DESIGNS USE PCI 9060ES PCI Bus Master Interface Chip for Intel 82596CA LAN Controller Features General Description • PCI Bus Master Interface for Intel 82596CA Ethernet Controllers and other intelligent I/O controllers and
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9060ES
82596CA
9020BV,
9060ES
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VCC166
Abstract: 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb
Text: L-71001-0D MITSUBISHI ELECTRIC REV Mitsubishi Memory Module Technical Direction Large Capacity 64MB 128MB 256MB 512MB 1GB High Speed EDO SDRAM Small outline DDR SDRAM RDRAMTM 72pin S.O.DIMM Memory Module 144pin S.O.DIMM 200pin DDR S.O. DIMM 72pin x36 168pin
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L-71001-0D
128MB
256MB
512MB
72pin
144pin
200pin
168pin
VCC166
128m simm 72 pin
ddr 200pin SO DIMM
L-71001-0D
72 pin 128mb
L7105
L-71051-0C
72 simm edo dram 64mb
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82596
Abstract: 82557
Text: intei A P ' 3 6 8 APPLICATION NOTE 82557 10/100 Mbps PCI LAN Controller A Guide to 82596 Compatibility November 1995 Order Number: 644126-001 305 AP-368 1.0 INTRODUCTION Over the last few years, the networking environment has evolved to account for the needs of high-bandwidth. Fast Ethernet,* otherwise known as IEEE
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AP-368
82557ch
82596
82557
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Side Brazed Ceramic Dual-In-Line Packages
Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year
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c4460
Abstract: trans C3150 BC518 TI486DX4-100 LC51-50 C5380 TM2SP64GPU TMS320C2X TMS320C204 seagate
Text: EXTENDING YOUR REACHTM NORTH AMERICAN EDITION INTEGRATION AN UPDATE ON TEXAS INSTRUMENTS SEMICONDUCTORS VOL. 13 ▼ NO. 2 ▼ MARCH 1996 ThunderSWITCH meets bandwidth demands Spurred by rapid growth in the use of networked applications such as the Internet, groupware, client/server and
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SFY49LXX603R
100-MIPS
c4460
trans C3150
BC518
TI486DX4-100
LC51-50
C5380
TM2SP64GPU
TMS320C2X
TMS320C204
seagate
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Intel 1702 eprom
Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC
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CH02LINK
Intel 1702 eprom
231369
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Side Brazed Ceramic Dual-In-Line Packages
PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC PIN GRID ARRAY CPGA lead frame
CERAMIC PIN GRID ARRAY CPGA lead frame 325
Intel 2164
Side Brazed Ceramic Dual-In-Line Packages 28
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dec 21140
Abstract: intel 82557 intel 21140 AP-373 digital 21140 intel EPROM parallel scrambler PCI 21140
Text: in t e i* AP-373 APPLICATION NOTE Replacing the DEC 21140 with the Intel 82557 Controller for LAN Designs November 1996 Order Number: 645006-002 339 AP-373 1.0. INTRODUCTION This application note provides information on the differences between the DEC 21140 and the Intel 82557
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AP-373
AP-373
10Mbps
10Mbps
dec 21140
intel 82557
intel 21140
digital 21140
intel EPROM
parallel scrambler PCI
21140
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PDF
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intel 82557
Abstract: dec 21140 INTEL application notes digital 21140 dec21140 LS373 intel DOC Intel AP 82557 intel EPROM
Text: E AP-373 APPLICATION NOTE Replacing the DEC 21140 with the Intel 82557 Controller for LAN Designs November 1996 Order Number: 645006-002 12/6/96 11:05 AM 64500602.DOC INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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AP-373
10Mbps
10Mbps
intel 82557
dec 21140
INTEL application notes
digital 21140
dec21140
LS373
intel DOC
Intel AP
82557
intel EPROM
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Untitled
Abstract: No abstract text available
Text: Æ L T E C H N O L D PCI 9060 B Y PCI Bus Master Interface Chip for Adapters and Embedded Systems December, 1995 VERSION 1.2 Features General Description_ • PCI Bus Master Interface supporting adapters and embedded systems • Two independent DMA channels for local
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PCI9060
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puma 6 intel
Abstract: 72bits DIMM SDRAM 144 Socket puma 5 "intel"
Text: Preliminary October 1998 PUMA 64D8000E 8M x 64/72 Synchronous DRAM Features • Unbuffered synchronous DRAM module organized as 2 banks of 4Mx64 or 72-bits. • Space-saving 28mm square 160-pin QFP package 0.65mm lead pitch . • PC-100 compatible operation.
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64D8000E
4Mx64
72-bits.
160-pin
PC-100
4k/64ms)
64D8000E
puma 6 intel
72bits
DIMM SDRAM 144 Socket
puma 5 "intel"
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UG3D6464D7B8
Abstract: No abstract text available
Text: UG3D6464D7B8 512K Bytes 64K x 64 160 Pin SRAM DIMM based on 64K x 32 Features General Description The UG3D6464D7B8 is a 524,038 bits by 64 Sync Burst SRAM module. The UG3D6464D7B8 is assembled using 2 pcs of 64K x 32 Sync Burst SRAMs in 100-pin QFP packages and
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UG3D6464D7B8
UG3D6464D7B8
100-pin
32Kx8
66MHz
1130mil)
64Kx32
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Untitled
Abstract: No abstract text available
Text: UG3D3264C7B8 256K Bytes 32K x 64 160 Pin SRAM DIMM based on 32K x 32 Features General Description The UG3D3264C7B8 is a 262,019 bits by 64 Sync Burst SRAM module. The UG3D3264C7B8 is assembled using 2 pcs of 32K x 32 Sync Burst SRAMs in 100-pin QFP packages and
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UG3D3264C7B8
UG3D3264C7B8
100-pin
32Kx8
66MHz
1130mil)
32Kx32
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