INTEL FCBGA PACKAGE THERMAL RESISTANCE Search Results

INTEL FCBGA PACKAGE THERMAL RESISTANCE Result Highlights (5)

Part	Manufacturer	Description
PQU650M-F-COVER	Murata Manufacturing Co Ltd	PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH9R00CQ5	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N)
TPH1R306PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N)
TPHR8504PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N)

INTEL FCBGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
fcbga package weight Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749 Text: Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	EID-LPT-ALX-003 EID-LPT-ALX-004 EID-LPP3-ALX-001 fcbga package weight Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749	PDF
INTEL fcBGA PACKAGE thermal resistance Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide" Text: Ultra Low Voltage Intel Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide October 2002 Order Number: 273802-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN	Original	PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"	PDF
mPGA479M Abstract: fcBGA PACKAGE thermal resistance pioneer corporation T725 479-pin heat sink Text: Low Voltage Intel Pentium® III Processor 512K Thermal Design Guide September 2002 Order Number: 273675-002 Low Voltage Intel® Pentium® III Processor 512K INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	PL1664-65) mPGA479M fcBGA PACKAGE thermal resistance pioneer corporation T725 479-pin heat sink	PDF
bcp 846 Abstract: 100C PCM45 PCM45F HT 7002 Text: Intel 413808 and 413812 SAS/ SATA I/O Controllers Thermal Design Considerations Application Note July 2007 Order Number: 315052-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR	Original	SU200-250513 54MCP mm01x05x05 etaC--218314 bcp 846 100C PCM45 PCM45F HT 7002	PDF
100C Abstract: PCM45 PCM45F moc 7002 Text: Intel 81341 and 81342 I/O Processors Thermal Design Considerations Application Note July 2007 Order Number: 315051-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS	Original	SU200-150513 etaC--24318 100C PCM45 PCM45F moc 7002	PDF
B1969 Abstract: IXP2800 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28 Text: Intel IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note August 2004 Order Number: 278844-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS	Original	IXP2800 B1969 IXP2850 STRAIN GAUGE IXP2400 BGA heatsink compressive force B1975 IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification IXP28	PDF
IXP2400 Abstract: BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel Text: Intel IXP2400 Network Processor Electrical, Mechanical, and Thermal Specification EMTS Application Note March 2003 Document Number: 301146-001 IXP2400 Network Processor EMTS INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	IXP2400 BGA heatsink compressive force BGA Solder Ball compressive force diode B1205 FCBGA STRAIN GAUGE rosette strain gauge fcBGA PACKAGE thermal resistance INTEL fcBGA PACKAGE thermal resistance thermal test vehicle -intel	PDF
BGA heatsink compressive force Abstract: E7520 HB96030-DW E7520 Chipset Platform Design Guide 6700PXH TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320 Text: Intel E7520/E7320 Chipset Memory Controller Hub MCH and Intel® 6700PXH 64-Bit PCI Hub Thermal/Mechanical Design Guide for Embedded Applications February 2007 Reference Number: 304387-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELR PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS	Original	E7520/E7320 6700PXH 64-Bit BGA heatsink compressive force E7520 HB96030-DW E7520 Chipset Platform Design Guide TMDG INTEL MOTHERBOARD Chip Level MANUAL pcm45 C19228-001 E7320	PDF
sl624 Abstract: pentium II 2d matrix mark SL622 298642 0F29h SL623 249678 252135 pentium4 2.4 GHz 512 533 SL74T Text: Intel Xeon® Processor Specification Update December 2006 Notice: The Intel® Xeon® processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification update.	Original	IA-32 sl624 pentium II 2d matrix mark SL622 298642 0F29h SL623 249678 252135 pentium4 2.4 GHz 512 533 SL74T	PDF
845GL Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard	PDF
ipx2800 Abstract: IXP2400 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance Text: Intel IXP2400 Network Processor Thermal and Mechanical Design Guideline Application Note March 2003 Document Number: 301148-001 IXP2400 Network Processor Thermal/Mechanical Design INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	IXP2400 ipx2800 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance	PDF
thermal design guide -intel Abstract: 82801CA E7500 E7501 E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset Text: Intel E7500 and Intel® E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number: 273819-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN	Original	E7500 E7501 E7501 thermal design guide -intel 82801CA E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset	PDF
transistor c1419 Abstract: MIL-C-26704 IXP2850 Fujikura fhp-3408 c1419 transistor IXP2800 c1419 INTEL fcBGA PACKAGE thermal resistance Fujikura IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification Text: Intel IXP2800 Network Processor Thermal/Mechanical Design Guideline Application Note August 2004 Order Number: 278895-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS	Original	IXP2800 C20895 B2455-01 transistor c1419 MIL-C-26704 IXP2850 Fujikura fhp-3408 c1419 transistor c1419 INTEL fcBGA PACKAGE thermal resistance Fujikura IXP2800 Network Processor Electrical, Mechanical, and Thermal Specification	PDF
hall 503 Abstract: AH 503 hall 82801CA 82870P2 ATA-33 E7500 P64H2 T-710 foxconn motherboard Text: R Intel E7500 Chipset Design Guide E7500 Memory Controller Hub MCH Thermal and Mechanical Design Guidelines February 2002 Document Number: 298647-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	E7500 hall 503 AH 503 hall 82801CA 82870P2 ATA-33 P64H2 T-710 foxconn motherboard	PDF

Intel reflow soldering profile BGA Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710 Text: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS	Original		PDF
intel 775 motherboard diagram Abstract: celeron MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD intel 815 circuit diagram BGA PACKAGE TOP MARK intel Intel 865 F Chipset intel celeron Block Diagram 273804 BP 109 ir sensor datasheet celeron processor intel p4 motherboard power supply circuit diagram Text: Ultra-Low Voltage Intel Celeron® Processor 0.13 µ in the Micro FC-BGA Package at 650 MHz and 400 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Ultra-Low Voltage Intel® Celeron® Processor (0.13µ) with the following processor core/bus speeds:	Original	16-Kbyte 256-Kbyte) intel 775 motherboard diagram celeron MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD intel 815 circuit diagram BGA PACKAGE TOP MARK intel Intel 865 F Chipset intel celeron Block Diagram 273804 BP 109 ir sensor datasheet celeron processor intel p4 motherboard power supply circuit diagram	PDF
diagram motherboard Abstract: free circuit diagram of intel 865 motherboard microprocessors architecture of 8151 intel 775 motherboard diagram intel celeron Block Diagram PC intel 865 MOTHERBOARD CIRCUIT diagram 82443MX CK-408 MLF2012A4R7KT Text: Ultra-Low Voltage Intel Celeron® Processor 0.13 µ in the Micro FC-BGA Package at 650 MHz and 400 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Ultra-Low Voltage Intel® Celeron® Processor (0.13µ) with the following processor core/bus speeds:	Original	16-Kbyte 256-Kbyte) diagram motherboard free circuit diagram of intel 865 motherboard microprocessors architecture of 8151 intel 775 motherboard diagram intel celeron Block Diagram PC intel 865 MOTHERBOARD CIRCUIT diagram 82443MX CK-408 MLF2012A4R7KT	PDF
P64H2 Abstract: flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934 Text: R Intel E7500/E7501/E7505 Chipset Thermal Design Guide For the Intel® E7500/E7501/E7505 Chipset Memory Controller Hub MCH December 2002 Document Number: 298647-003 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	E7500/E7501/E7505 E7500/E7501/E7505 P64H2 flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934	PDF
intel 82801DB Abstract: 82801CA 82801DB 82870P2 ATA-33 E7500 E7505 P64H2 chipset reflow profile Chomerics T710 Text: R Intel E7500/E7505 Chipset Thermal Design Guide Intel® E7500/E7505 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 298647-002 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY	Original	E7500/E7505 E7500 intel 82801DB 82801CA 82801DB 82870P2 ATA-33 E7505 P64H2 chipset reflow profile Chomerics T710	PDF
C40682-002 Abstract: BGA Ball Crack honeywell pcm45hd intel 3001 processor cross reference honeywell pcm45 B2567-02 B3541 INTEL application notes 80333 Text: Intel 80333 I/O Processor Thermal Design Guidelines Application Note May 2005 Document Number: 306630002US Intel® 80333 I/O Processor INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS	Original	306630002US rights100% C40682-002 BGA Ball Crack honeywell pcm45hd intel 3001 processor cross reference honeywell pcm45 B2567-02 B3541 INTEL application notes 80333	PDF
Loctite 7452 Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001 Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS	Original	631xESB/632xESB Loctite 7452 PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001	PDF
E7221 Abstract: 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD Text: R Intel E7221 Memory Controller Hub MCH Thermal/Mechanical Design Guide September 2004 Document Number: 303632-001 R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.	Original	E7221 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD	PDF
thermal test vehicle -intel Abstract: PCM45F honeywell thermocouple Text: Intel 3100 Chipset Thermal Design Guide November 2008 Order Number: 313457-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS	Original	313457-004US thermal test vehicle -intel PCM45F honeywell thermocouple	PDF
PCM45 Abstract: INTEL 5520 honeywell 95C TCONTROL PCM45F honeywell pcm45 foxconn motherboard la 7630 Text: Intel 5520 and Intel® 5500 Chipsets Thermal/Mechanical Design Guidelines November 2009 Document Number: 321330, Revision: -003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS	Original		PDF

INTEL FCBGA PACKAGE THERMAL RESISTANCE Search Results

INTEL FCBGA PACKAGE THERMAL RESISTANCE Result Highlights (5)

INTEL FCBGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

fcbga package weight

INTEL fcBGA PACKAGE thermal resistance

mPGA479M

bcp 846

100C

B1969

IXP2400

BGA heatsink compressive force

sl624

845GL

ipx2800

thermal design guide -intel

transistor c1419

hall 503

Intel reflow soldering profile BGA

intel 775 motherboard diagram

diagram motherboard

P64H2

intel 82801DB

C40682-002

Loctite 7452

E7221

thermal test vehicle -intel

PCM45