INTEL STACKED CSP Search Results

INTEL STACKED CSP Result Highlights (5)

Part	Manufacturer	Description
EN80C188XL-12	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
EN80C188XL-20	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
MD82C288-10/R	Rochester Electronics LLC	Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics.
MD87C51/BQA	Rochester Electronics LLC	Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics.
MG87C196KC/B	Rochester Electronics LLC	Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics.

INTEL STACKED CSP Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
252633 Abstract: INTEL STRATAFLASH 1.8V Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash	Original	PDF	256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit 48F3300L0YDQ0 48F3300L0ZDQ0 252633 INTEL STRATAFLASH 1.8V
l18scsp Abstract: 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash	Original	PDF	256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit l18scsp 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH
28F6408J3 Abstract: 28F6408J3A Intel SCSP Text: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	PDF	28F6408J3 64-Mbit 64-Kword 128-bit AP-663 AP-660 AP-646 28F6408J3 28F6408J3A Intel SCSP
Intel Stacked CSP Abstract: transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160 Text: 3 Volt Intel Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	PDF	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Intel Stacked CSP transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160
Intel Stacked CSP Abstract: transistor 2N 5551 28F160C3 28F320C3 252636 RD28F1604C3BD70 2N2728 Text: 3 Volt Intel Advanced+ Boot Block Flash Memory C3 Stacked-Chip Scale Package Family Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked-Chip Scale Package (StackedCSP) Technology	Original	PDF	16Mbit 32Mbit RD38F1010C0ZTL0 RD38F1010C0ZBL0 RD28F3208C3T90 RD38F1020C0ZTL0 RD28F3208C3B90 Intel Stacked CSP transistor 2N 5551 28F160C3 28F320C3 252636 RD28F1604C3BD70 2N2728
Intel Stacked CSP Abstract: Stacked CSP 1999 Text: E PRELIMINARY Mechanical Specification for Intel Stacked-Chip Scale Package April 1999 Revision: 1.0 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original	PDF	128-Mbit 32-Mbit 16-Mbit 72-Ball Intel Stacked CSP Stacked CSP 1999
128W18 Abstract: 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp Text: 128-Mbit 1.8 Volt Intel Wireless Flash Memory W18 + 32-Mbit PSRAM Stacked-CSP Family Datasheet Product Features • ■ ■ ■ Flash Architecture — Flexible, Multiple-Partition, DualOperation: Read-While-Write / ReadWhile-Erase — 32 Partitions, 4 Mbits each	Original	PDF	128-Mbit 32-Mbit --32-Kword 128W18 RD48F3000W0YBQ0 RD48F3000W0YTQ0 128W18 32PSRAM RD38F3040W0YBQ0 RD38F3040W0YTQ0 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp
rd33708 Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3 Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	PDF	28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3
Migration Guide for Intel StrataFlash Memory J Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3 Text: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst	Original	PDF	W18/W30) K3/K18) 128-bit Migration Guide for Intel StrataFlash Memory J Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
VCC166 Abstract: 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb Text: L-71001-0D MITSUBISHI ELECTRIC REV Mitsubishi Memory Module Technical Direction Large Capacity 64MB 128MB 256MB 512MB 1GB High Speed EDO SDRAM Small outline DDR SDRAM RDRAMTM 72pin S.O.DIMM Memory Module 144pin S.O.DIMM 200pin DDR S.O. DIMM 72pin x36 168pin	Original	PDF	L-71001-0D 128MB 256MB 512MB 72pin 144pin 200pin 168pin VCC166 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb
28F3202C3 Abstract: 29066 Text: PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 16-Mbit Flash + 4-Mbit SRAM - 28F1604C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 32-Mbit Flash + 2-Mbit SRAM - 28F3202C3 ! Flash Memory Plus SRAM	Original	PDF	16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1604C3 28F3202C3 16-Mb 32-Mb 28F3202C3 29066
AP-657 Abstract: Intel Stacked CSP 28F1602C3 28F3204C3 29066 Text: E PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 n n n n n Flash Memory Plus SRAM  Reduces Board Design Complexity n Stacked Die, Chip Scale Package  Smallest Possible Memory	Original	PDF	16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1602C3, AP-657 Intel Stacked CSP 28F1602C3 28F3204C3 29066
PF38F3040 Abstract: PF38F4050 PF38F4050L0 3144* intel l18scsp Text: Intel StrataFlash Wireless Memory L18 SCSP 768-Mbit L18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 128 or 256-Mbit — PSRAM Die Density: 32 or 64-Mbit — x16 Non-Mux or ADMux I/O Interface Option	Original	PDF	768-Mbit 256-Mbit 64-Mbit 11x13 PF38F3040 PF38F4050 PF38F4050L0 3144* intel l18scsp
3076* intel Abstract: 3098* intel Text: Intel StrataFlash Cellular Memory M18 2048-Mbit M18 Family with Synchronous PSRAM Product Features Datasheet Device Architecture Flash Performance — Flash Die Density: 256 or 512-Mbit — 96 ns Initial Read Access; 15 ns Asynchronous Page-Mode Read — PSRAM Die Density: 64 or 128-Mbit	Original	PDF	2048-Mbit 512-Mbit 128-Mbit 133MHz 3076* intel 3098* intel

29066 Abstract: No abstract text available Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	PDF	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/8-Mbit 32-Mbit/4-Mbit, 29066
28F1602C3 Abstract: 28F1604C3 28F3204C3 28F3208C3 Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	PDF	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/4-Mbit, 16-Mbit/4-Mbit 28F1602C3 28F1604C3 28F3204C3 28F3208C3
IMC016FLSC Abstract: 28F320C3 IMC008FLSC PLCC 44 intel package dimensions 28F800C3a 28f800b5 3 Volt Intel StrataFlash Memory 28F160S5 28F400B5 28F008B3 Text: Flash Memory Quick Reference Guide ion 9 Vers ’99 April Intel package and tools lineup Intel Package and Tools Lineup • Software Builder–Application software for Intel Flash memory products. • Online Utilities–Understand how Intel® Flash memory products will	Original	PDF	USA/0499/10K/MS IMC016FLSC 28F320C3 IMC008FLSC PLCC 44 intel package dimensions 28F800C3a 28f800b5 3 Volt Intel StrataFlash Memory 28F160S5 28F400B5 28F008B3
PF38F4060 Abstract: PF38F4060M SCSP M18 PF38F4050 PF38F4060M0y 3076* intel 3098* intel tba 790 Text: Intel StrataFlash Cellular Memory M18 SCSP 2048-Mbit M18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 256, 512 Mbit, or 1 Gbit — PSRAM Die Density: 64 or 128 Mbit — x16 Non-Mux or AD-Mux I/O Interface	Original	PDF	2048-Mbit 11x13 307654-005US PF38F4060 PF38F4060M SCSP M18 PF38F4050 PF38F4060M0y 3076* intel 3098* intel tba 790
29066 Abstract: 28f3204 Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	PDF	28F1602C3, 28F1604C3, 28F3204C3 16-Mbit 32-Mbit 29066 28f3204
L24002 Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities	Original	PDF	L-11002-01 64MDRAM 64MSDRAM 128MSDRAM 256MSDRAM 144MRDRAM L24002 NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
PH28F640W30BD70 Abstract: ge28f640w30td70 8857H 28F128W30 28F320W30 28F640W30 intel DOC GE28F640W30-B Text: Intel Wireless Flash Memory W30 28F640W30, 28F320W30, 28F128W30 Datasheet Product Features • ■ ■ ■ High Performance Read-While-Write/Erase — Burst Frequency at 40 MHz — 70 ns Initial Access Speed — 25 ns Page-Mode Read Speed — 20 ns Burst-Mode Read Speed	Original	PDF	28F640W30, 28F320W30, 28F128W30 GE28F320W30BD70 GE28F320W30TD70 GE28F320W30BD85 GE28F320W30TD85 PH28F320W30BD70 PH28F320W30TD70 PF48F1000W0ZBQ0 PH28F640W30BD70 ge28f640w30td70 8857H 28F128W30 28F320W30 28F640W30 intel DOC GE28F640W30-B
NEC stacked MCP 1999 Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a	Original	PDF
1gb pc133 SDRAM DIMM 144pin Abstract: 54-PIN PC100 gm72v66841 Text: 2 . PRODUCT QUICK REFERENCE PRODUCT QUICK REFERENCE HY XX X XX XX X X X X X X - xx x .L HYNIX MEMORY : SDRAMs PROCESS & POWER SUPPLY : CMOS, 3.3V DENSITY & REFRESH 64M 4K Refresh 64M 8K Refresh 128M 4K Refresh 256M 8K Refresh 64 65 28 56 12 512M 8K Refresh	OCR Scan	PDF	200MHz 183MHz 166MHz 143MHz PC133 125MHz PC100, 100MHz 1gb pc133 SDRAM DIMM 144pin 54-PIN PC100 gm72v66841
PC100 Abstract: PC133 54-PIN HYM71V653201 Text: 2 . PRODUCT QUICK REFERENCE X XX XX X X XX X X - X - X X£ HYNIX MEMORY PRODUCT Q U IC K REFERENCE HY XX I : Industrial Temperature E: Extended Temperature SPEED s 200MHz 183MHz 55 6 7 PRODUCT GROUP 57 : SDRAMs PROCESS & POWER SUPPLY : CMOS, 3.3V DENSTTY& REFRESH	OCR Scan	PDF	200MHz 183MHz 166MHz 143MHz PC133 125MHz PC100, 100MHz PC100 54-PIN HYM71V653201

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INTEL STACKED CSP Search Results

INTEL STACKED CSP Result Highlights (5)

INTEL STACKED CSP Datasheets Context Search

252633

l18scsp

28F6408J3

Intel Stacked CSP

Intel Stacked CSP

Intel Stacked CSP

128W18

rd33708

Migration Guide for Intel StrataFlash Memory J

VCC166

28F3202C3

AP-657

PF38F3040

3076* intel

29066

28F1602C3

IMC016FLSC

PF38F4060

29066

L24002

PH28F640W30BD70

NEC stacked MCP 1999

1gb pc133 SDRAM DIMM 144pin

PC100