DIP42-P-600-2
Abstract: No abstract text available
Text: 42P4Z Plastic 42pin 600mil DIP JEDEC Code – Lead Material Alloy 42 22 1 21 E 42 e1 c EIAJ Package Code DIP42-P-600-2.54 Weight g 6.06 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51
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Original
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42P4Z
42pin
600mil
DIP42-P-600-2
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PDF
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32P4
Abstract: JEDEC 600Mil dip
Text: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51
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Original
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32pin
600mil
DIP32-P-600-2
32P4
JEDEC 600Mil dip
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PDF
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24pin
Abstract: 24P4
Text: 24P4 Plastic 24pin 600mil DIP Lead Material Alloy 42/Cu Alloy 24 13 1 12 c Weight g 3.3 JEDEC Code – Symbol A1 L A A2 D SEATING PLANE e b1 e1 E EIAJ Package Code DIP24-P-600-2.54 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5
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Original
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24pin
600mil
42/Cu
DIP24-P-600-2
24P4
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PDF
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30P4
Abstract: DIP30-P-600-2
Text: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5
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Original
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30pin
600mil
DIP30-P-600-2
30P4
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PDF
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28P4
Abstract: JEDEC 600Mil dip "lead material" DIP
Text: SEATING PLANE EIAJ Package Code DIP28-P-600-2.54 e b1 D b 14 1 Lead Material Alloy 42 15 Weight g 3.8 28 JEDEC Code – A L 28P4 A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 28pin 600mil DIP c Dimension in Millimeters Min Nom Max – – 5.5 0.51 – –
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Original
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DIP28-P-600-2
28pin
600mil
28P4
JEDEC 600Mil dip
"lead material" DIP
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PDF
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JEDEC 600Mil dip
Abstract: DIP40 package
Text: 40P4 Plastic 40pin 600mil DIP JEDEC Code – Weight g 5.4 Lead Material Alloy 42 21 1 20 E 40 e1 c EIAJ Package Code DIP40-P-600-2.54 Symbol L A1 A A2 D SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51 –
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Original
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40pin
600mil
DIP40-P-600-2
JEDEC 600Mil dip
DIP40 package
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PDF
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JEDEC 600Mil dip
Abstract: "lead material" DIP 32P4
Text: EIAJ Package Code DIP32-P-600-2.54 32P4 e b 16 1 D 17 Lead Material Alloy 42 32 JEDEC Code – Weight g 4.08 SEATING PLANE b1 A L E A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 32pin 600mil DIP c Mar.’98 Dimension in Millimeters Min Nom Max – – 5.1
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Original
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DIP32-P-600-2
32pin
600mil
JEDEC 600Mil dip
"lead material" DIP
32P4
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PDF
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28P4
Abstract: No abstract text available
Text: 28P4 Plastic 28pin 600mil DIP Lead Material Alloy 42 28 15 1 14 c Weight g 3.8 e1 JEDEC Code – E EIAJ Package Code DIP28-P-600-2.54 D A A2 Symbol L A1 SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51 –
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Original
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28pin
600mil
DIP28-P-600-2
28P4
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PDF
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SSOP42-P-450-0
Abstract: No abstract text available
Text: APPENDIX 3.6 Package outline 3.6 Package outline MMP 42P4B EIAJ Package Code SDIP42-P-600-1.78 Plastic 42pin 600mil SDIP Weight g 4.1 Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c JEDEC Code – Symbol L A1 A A2 D e b1 b2 b SEATING PLANE A A1 A2 b b1
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Original
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42P4B
SDIP42-P-600-1
42pin
600mil
42/Cu
42P2R-A/E
450mil
SSOP42-P-450-0
42S1B-A
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PDF
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Untitled
Abstract: No abstract text available
Text: 52S1B-B Metal seal 52pin 600mil DIP EIAJ Package Code WDIP52-C-600-1.78 Weight g JEDEC Code – 1 26 e1 27 E 52 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.4 – – 1.0 3.9 – –
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Original
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52S1B-B
52pin
600mil
WDIP52-C-600-1
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PDF
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42-PIN
Abstract: No abstract text available
Text: 42S1B-A Metal seal 42pin 600mil DIP EIAJ Package Code WDIP42-C-600-1.78 JEDEC Code – Weight g 1 21 e1 22 E 42 c D A1 L A A2 Symbol Z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.0 – – 1.0 3.44 – –
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Original
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42S1B-A
42pin
600mil
WDIP42-C-600-1
42-PIN
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PDF
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gy-27
Abstract: CY27C010-45PC CY27C010-150ZC CY27C010-120PC
Text: fax id: 3022 CY27C010 pyp: v « *1 X X - 128K x 8 CMOS EPROM available in windowed packages 32-pin hermetic DIP and LCC which allow the device to be erased with UV light for 100% reprogrammability. Features • Very Fast Read Access Time: (45 - 200 ns) • 5V ± 10% Power Supply
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OCR Scan
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CY27C010
200mA
32-pin
32-pin,
600-mil
CY27C010
gy-27
CY27C010-45PC
CY27C010-150ZC
CY27C010-120PC
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PDF
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CY27C256A-45WMB
Abstract: w16 06 CY27C256A-45JC CY27C256A-45PC CY27C256A-45QMB CY27C256A-45WC CY27C256A-45ZC CY27C256A-55JC CY27C256A-70WC CY27C256A-90JC
Text: fax id: 3026 CY27C256A 1-Megabit 32K x 8 CMOS EPROM Features • • • • • • windowed packages (28-pin hermetic DIP and 32-pin LCC) which allow the device to be erased with UV light for 100% reprogrammability. Very fast read access time: (45−200 ns)
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Original
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CY27C256A
28-pin
32-pin
CY27C256A
CY27C256A-45WMB
w16 06
CY27C256A-45JC
CY27C256A-45PC
CY27C256A-45QMB
CY27C256A-45WC
CY27C256A-45ZC
CY27C256A-55JC
CY27C256A-70WC
CY27C256A-90JC
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PDF
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CY27C256A-45JC
Abstract: CY27C256A-45PC CY27C256A-45QMB CY27C256A-45WC CY27C256A-45WMB CY27C256A-45ZC CY27C256A-55JC
Text: fax id: 3026 1CY 27C2 56 A CY27C256A 32K x 8 CMOS EPROM Features • • • • • • windowed packages 28-pin hermetic DIP and 32-pin LCC which allow the device to be erased with UV light for 100% reprogrammability. Very fast read access time: (45−200 ns)
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Original
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CY27C256A
28-pin
32-pin
CY27C256A
CY27C256A-45JC
CY27C256A-45PC
CY27C256A-45QMB
CY27C256A-45WC
CY27C256A-45WMB
CY27C256A-45ZC
CY27C256A-55JC
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PDF
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LC 7258
Abstract: No abstract text available
Text: fax id: 3026 CY27C256A 32Kx8 CMOS EPROM Featu res windowed packages 28-pin hermetic DIP and 32-pin LCC which allow the device to be erased with UV light for 100% reprogrammability. • Very fa s t read a cce ss tim e : (45-200 ns) • 5 V ± 1 0 % p o w e r s u p p ly
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OCR Scan
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CY27C256A
32Kx8
28-pin
28-pin,
600-m
32-pin,
32-pin
LC 7258
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PDF
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FJ032-P-R450
Abstract: No abstract text available
Text: CMOS 1M 128K x 8 M ask-Program m able ROM FEATURES PIN CONNECTIONS • 131,072 words x 8 bit organization 32-PIN DIP 32-PIN SOP • Access time: 150 ns (MAX.) TOP VIEW N 32 I ] Vcc f ' • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 \x\N (MAX.)
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OCR Scan
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LH530800A
32-pin,
600-mil
525-mil
450-mil
072x8
32-PIN
FJ032-P-R450
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PDF
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Untitled
Abstract: No abstract text available
Text: LH53259 C M O S 256K 3 2 K x 8 M ROM FEATURES PIN CONNECTIONS • 32,768 words x 8 bit organization 28-PIN DIP 28-PIN SOP • Access time: 150 ns (MAX.) TOP VIEW . • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 p.W (MAX.) NCd 1• 28 □ VCC
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OCR Scan
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LH53259
28-pin,
600-mil
450-mil
28-PIN
28TSOP
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PDF
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TSOP028-P-0813
Abstract: LH53259 LH53259D
Text: LH53259 CMOS 256K 32K x 8 Mask-Programmable ROM FEATURES • 32,768 words × 8 bit organization • Access time: 150 ns (MAX.) • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 µW (MAX.) PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SOP NC
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Original
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LH53259
28-PIN
28-pin,
600-mil
450-mil
28TSOP
TSOP028-P-0813
LH53259
LH53259D
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PDF
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32DIP
Abstract: 32-PIN LH530800A a7529 lh5308
Text: LH530800A CMOS 1M 128K x 8 Mask-Programmable ROM FEATURES • 131,072 words × 8 bit organization • Access time: 150 ns (MAX.) PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 µW (MAX.) NC
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Original
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LH530800A
32-PIN
32QFJ450
32-pin,
450-mil
600-mil
DIP032-P-0600)
32DIP
LH530800A
a7529
lh5308
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PDF
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sharp mask rom
Abstract: No abstract text available
Text: LH530800A FEATURES CMOS 1M 128K x 8 MROM PIN CONNECTIONS • 131,072 words x 8 bit organization • Access time: 150 ns (MAX.) 32-PIN DIP 32-PIN SOP TOP VIEW NCZ 1• s 32 □ Vcc A i aC 2 31 □ NC / • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 [iW (MAX.)
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OCR Scan
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LH530800A
32-pin,
600-mil
525-mil
450-mil
32-PIN
530800A39]
sharp mask rom
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PDF
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A14C
Abstract: LH53259 sharp mask rom
Text: LH53259 CMOS 256K 32K x 8 M ask-Program m able ROM FEATURES PIN CONNECTIONS • 32,768 words x 8 bit organization • Access time: 150 ns (MAX.) 28-PIN DIP 28-PIN SOP TOP VIEW • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 n-W (MAX.)
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OCR Scan
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LH53259
28-pin,
600-mil
450-mil
LH53259
28-pin
28TSOP
A14C
sharp mask rom
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PDF
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LH530800A
Abstract: 32DIP 32-PIN LH53
Text: LH530800A FEATURES • 131,072 words x 8 bit organization • Access time: 150 ns MAX. CMOS 1M (128K × 8) MROM PIN CONNECTIONS 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 µW (MAX.) NC 1 32 Vcc A16 2 31
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Original
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LH530800A
32-PIN
32-pin,
32QFJ450
450-mil
600-mil
LH530800A
32DIP
LH53
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PDF
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LH53259
Abstract: LH53259D TSOP028-P-0813
Text: LH53259 FEATURES • 32,768 words x 8 bit organization • Access time: 150 ns MAX. • Low-power consumption: Operating: 137.5 mW (MAX.) Standby: 550 µW (MAX.) CMOS 256K (32K × 8) MROM PIN CONNECTIONS TOP VIEW 28-PIN DIP 28-PIN SOP NC 1 28 VCC A12 2
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Original
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LH53259
28-PIN
28-pin,
600-mil
450-mil
LH53259
28TSOP
LH53259D
TSOP028-P-0813
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PDF
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sharp mask rom
Abstract: No abstract text available
Text: CM O S 1 M 1 2 8 K x 8 M R O M FEATURES PIN CONNECTIONS • 131,072 words x 8 bit organization • Access time: 150 ns (MAX.) 32-PIN DIP 32-PIN SOP TOP VIEW • Power consumption: Operating: 192.5 mW (MAX.) Standby: 550 (iW (MAX.) NCC 1• \ 32 A-^IZ A15Z
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OCR Scan
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32-pin,
600-mil
525-mil
450-mil
32-PIN
sharp mask rom
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PDF
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