AEC-Q100-004
Abstract: JESD22-A113 HDJD-J822
Text: HDJD-J822 Color Management System Feedback Controller Data Sheet Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC. Avago
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HDJD-J822
AEC-Q100-004
/-100mA)
JESD22-A113-A
5989-4106EN
AEC-Q100-004
JESD22-A113
HDJD-J822
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jesd 51-7
Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs
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SZZA040
54BGA
54-ball
MO-205,
16-bit
jesd 51-7
63 ball Vfbga thermal resistance
56DL
metcal apr 5000
MO-205
56ZQL
BGA Ball Crack
054UG08C127
APR-5000
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Untitled
Abstract: No abstract text available
Text: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry
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THS1408-EP
14-BIT,
SGLS129B
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Untitled
Abstract: No abstract text available
Text: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry
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THS1408-EP
14-BIT,
SGLS129B
14-Bit
TMS320C6000
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Untitled
Abstract: No abstract text available
Text: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry
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THS1408-EP
14-BIT,
SGLS129B
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Untitled
Abstract: No abstract text available
Text: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry
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THS1408-EP
14-BIT,
SGLS129B
14-Bit
TMS320C6000
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LV 1084 73
Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA
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SZZA028A
20-Ball,
65-mm
20-ball
LV 1084 73
LV 373A
BGA PACKAGE thermal profile
LV 1084
land pattern for tvSOP
90 ball VFBGA
micro pitch BGA
VA244
VFBGA
LVTH2245
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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48 ball VFBGA
Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated
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SZZA029B
16-Bit
56-Ball,
65-mm
56-ball
MO-225,
48-pin
56-pin
48 ball VFBGA
90 ball VFBGA
LVTH162
micro pitch BGA
tSSOP 56 socket
TSSOP YAMAICHI SOCKET
ALVCH16373
LVCH16244A
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Untitled
Abstract: No abstract text available
Text: TL16C752B-EP www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 3.3 V DUAL UART WITH 64-BYTE FIFO Check for Samples: TL16C752B-EP FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and
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TL16C752B-EP
SGLS153B
64-BYTE
ST16C2550
24-MHz
48-MHz
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Untitled
Abstract: No abstract text available
Text: TL16C752B-EP www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 3.3 V DUAL UART WITH 64-BYTE FIFO Check for Samples: TL16C752B-EP FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and
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TL16C752B-EP
SGLS153B
64-BYTE
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TLV3701-EP
Abstract: TLV3701 TLV3701-Q1 TLV3701QDBVREP
Text: TLV3701ĆEP SGLS170 − JUNE 2003 NANOPOWER PUSHĆPULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701EP
SGLS170
TLV3701-EP
TLV3701
TLV3701-Q1
TLV3701QDBVREP
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lathes
Abstract: ST16C2550 TL16C752B TL16C752B-EP TL16C752BLPTREP TL16C752BTPTREP MCR-3
Text: TL16C752B-EP 3.3 V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an
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TL16C752B-EP
64-BYTE
SGLS153B
lathes
ST16C2550
TL16C752B
TL16C752B-EP
TL16C752BLPTREP
TL16C752BTPTREP
MCR-3
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TLV3701-EP
Abstract: No abstract text available
Text: TLV3701ĆEP SGLS170 − JUNE 2003 NANOPOWER PUSHĆPULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701EP
SGLS170
OT-23
SLOU060
TLV3701-EP
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SLOU060
Abstract: TLV3701-EP
Text: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701-EP
SGLS170
OT-23
SLOU060
100ved.
TLV3701-EP
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TLV3701-EP
Abstract: No abstract text available
Text: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701-EP
SGLS170
OT-23
SLOU060
TLV3701-EP
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TLV3701-EP
Abstract: No abstract text available
Text: TLV3701ĆEP SGLS170 − JUNE 2003 NANOPOWER PUSHĆPULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701Ä
SGLS170
TLV3701-EP
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RX2 pin DIAGRAM
Abstract: No abstract text available
Text: TL16C752B-EP 3.3-V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153A – FEBRUARY 2003 – REVISED MARCH 2007 FEATURES • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an
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TL16C752B-EP
64-BYTE
SGLS153A
ST16C2550
24-MHz
48-MHz
RX2 pin DIAGRAM
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TLV3701-EP
Abstract: No abstract text available
Text: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701-EP
SGLS170
OT-23
SLOU060
100ments
TLV3701-EP
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Untitled
Abstract: No abstract text available
Text: TL16C752B-EP 3.3 V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an
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TL16C752B-EP
64-BYTE
SGLS153B
ST16C2550
24-MHz
48-MHz
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TLV3701-EP
Abstract: No abstract text available
Text: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly
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TLV3701-EP
SGLS170
OT-23
SLOU060
TLV3701-EP
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KM23V32205
Abstract: No abstract text available
Text: Preliminary Synch. MROM KM23SV32205T 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode)
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KM23SV32205T
33MHz
50MHz
66MHz
86TSOP2
KM23SV32205T
KM23V32205
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Untitled
Abstract: No abstract text available
Text: CY7C1331 CY7C1332 ADVANCED INFORMATION 64K x 18 Synchronous Cache 3.3 V RAM Direct interface with the processor and external cache controller Asynchronous output enable JEDEC-standard pinout 52-pin PLCC and PQFP packaging Features • Supports 66-MHz Pentium proces
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CY7C1331
CY7C1332
66-MHz
7C1331)
7C1332)
52-pin
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hh 004 f
Abstract: 2SA1194
Text: HITACHI 2SA1194 SILICO N PNP EP ITAXIAL 1 1 ¡S o 12 HIGH GAIN AM PLIFIER 1. Em itter 2. C o li m a r V Hast D im ensions in m m (JEDEC TO-126 MOD.) M AXIM UM C O LLEC TO R DISSIPATION CURVE ABSO LU TE M AXIM UM RATING S (Ta=25°C) Item Symbol 2 S A I19 4 ®
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2SA1194Â
O-126
2SAI194Â
-500mA
hh 004 f
2SA1194
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