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    JEDEC TRAY DIMENSIONS SSOP 20 Search Results

    JEDEC TRAY DIMENSIONS SSOP 20 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ISL28433TSSOPEVAL1Z Renesas Electronics Corporation Quad Micropower, Chopper Stabilized, RRIO Op Amp Evaluation Board Visit Renesas Electronics Corporation
    ISL28414TSSOPEVAL1Z Renesas Electronics Corporation Quad General Purpose Micropower, RRIO Op Amp Evaluation Board Visit Renesas Electronics Corporation
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    R8A66156SP Renesas Electronics Corporation I/O Expander, SSOP, / Visit Renesas Electronics Corporation

    JEDEC TRAY DIMENSIONS SSOP 20 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


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    JEDEC TRAY DIMENSIONS ssop

    Abstract: SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 PPE NEC 135°C MAX. A' 8.4 12.75 135.9 300mil20p SSOP 10.58 114.75 10x24=240 A 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 6.40 Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (1.2 mm thick)


    Original     		PDF 300mil20p 20-pin 300mil20pSSOP SSD-A-H6455-1 JEDEC TRAY DIMENSIONS ssop SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645

    SJ 38

    Abstract: qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14
    Text: Revised February 2004 Logic and Switch Products Ordering Information Ordering Information TinyLogic is a trademark of Fairchild Semiconductor Corporation. CROSSVOLT, FACT, FACT Quiet Series, FAST, FASTr, and MicroPak are trademarks of Fairchild Semiconductor Corporation.


    Original     		PDF MS012540 SJ 38 qsc 1110 MicroPak-10 dqfn8 SJ38 mac010a M14D M16D jedec sot-23 6 lead MTC14

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


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    300mil20p

    Abstract: SOP JEDEC tray JEDEC TRAY DIMENSIONS ssop 300mil JEDEC TRAY DIMENSIONS JEDEC tray standard 20pin SOP JEDEC TRAY DIMENSIONS ssop 20
    Text: UNIT : mm 8.4 A' 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 (6.35) 6.4 7.62 135.9 PPE 7 HEAT PROOF NEC 135°C MAX. 12.75 10.58 300mil20p SSOP 114.75 10x24=240 A Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (300mil)(1.2mm thick)


    Original     		PDF 300mil20p 20-pin 300mil) 300mil20pSSOP SOP JEDEC tray JEDEC TRAY DIMENSIONS ssop 300mil JEDEC TRAY DIMENSIONS JEDEC tray standard 20pin SOP JEDEC TRAY DIMENSIONS ssop 20

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    JEDEC qfn tray

    Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
    Text: Packaging Product Specification PS007230-0812 Copyright 2012 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE THESE PRODUCTS IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


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    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    Untitled

    Abstract: No abstract text available
    Text: ASM3P4201A July 2006 rev 0.2 Multi-Output Custom Clock Generator Features clock generator. The five high frequency Clock outputs are generated using an inexpensive 20MHz Crystal or • Generates five clock outputs from an inexpensive external reference clock. The accuracy of the 20MHz


    Original     		PDF 20MHz 20-pin ASM3P4201A 50ppm.

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    JEDEC TRAY DIMENSIONS ssop

    Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)


    Original     		PDF 375mil48p 48-pin 375mil48pSSOP SSD-A-H6495-1 JEDEC TRAY DIMENSIONS ssop H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard

    jrc 2100 audio amplifier

    Abstract: HA13166 HA17324A LM324 HA13165 M51995AFP M51995P ha13168 HA17555 equivalent HA13164A IC ha17555
    Text: 2004.4 Management Linear ICs/ Renesas Standard Linear ICs Power Multi-Purpose Linear ICs Status List Topic 1—Series of Small Multi-Purpose Linear ICs for Low-Voltage Operation •··················································2


    Original     		PDF M62249FP HA17431UPA M5295AP M51945AL M51945BL M51952AL M51952BL M51955AL M51955BL M51958AL jrc 2100 audio amplifier HA13166 HA17324A LM324 HA13165 M51995AFP M51995P ha13168 HA17555 equivalent HA13164A IC ha17555

    Untitled

    Abstract: No abstract text available
    Text: ASM3P4200A July 2006 rev 0.2 Multi-Output Custom Clock Generator Features Product Description • Generates seven clock outputs from an inexpensive The ASM3P4200A is a versatile multi output custom clock generator. The seven high frequency Clock outputs 20MHz crystal or external reference clock.


    Original     		PDF 20MHz 28-pin ASM3P4200A ASM3P4200A 50ppm.

    TS 4999

    Abstract: ASM3I2111AF-08SR ASM3I2111AF-08ST ASM3P2111A ASM3P2111AF-08SR ASM3P2111AF-08ST TSOT23 EMI Solution
    Text: ASM3P2111A March 2005 rev 1.3 Peak EMI Reducing Solution Features The ASM3P2111A allows significant system cost savings by reducing the number of circuit board layers and Generates an EMI optimized clocking signal at shielding that are required to pass EMI regulations. The


    Original     		PDF ASM3P2111A ASM3P2111A TS 4999 ASM3I2111AF-08SR ASM3I2111AF-08ST ASM3P2111AF-08SR ASM3P2111AF-08ST TSOT23 EMI Solution