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    JEDEC TRAY MQFP Search Results

    JEDEC TRAY MQFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSP50214BVI Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    HSP50214BVC Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    ISL54100CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    ISL54102CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    HSP50415VI Renesas Electronics Corporation Wideband Programmable Modulator (WPM), MQFP-HS, /Tray Visit Renesas Electronics Corporation

    JEDEC TRAY MQFP Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    240-pin

    Abstract: LA-3522A-1
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.


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    LA-3522A-1 P240GN-50-LMU, 240-pin PDF

    NEC 2701

    Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.


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    LA-3519A-1 LA-0519A-1 S144GJ-50-3EN-3 SC-596-A* NEC 2701 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3 PDF

    QFP40

    Abstract: P304GL-50-NMU JEDEC TRAY mQFP
    Text: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of


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    LA-A41A SC-601-C* P304GL-50-NMU, QFP40 P304GL-50-NMU JEDEC TRAY mQFP PDF

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of


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    LA-3508A-1 S256GD-40-LMV, PDF

    2701 NEC

    Abstract: nec 2701
    Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension


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    LA-2244A-1 LA-1244A-1 LA-044A-1 S80GF-80-3B9-4 2701 NEC nec 2701 PDF

    NEC 2701

    Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524
    Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension


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    LA-2244A-1 LA-1244A-1 LA-044A-1 P80GF-80-3B9-4 SC-581-A NEC 2701 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524 PDF

    3eb data

    Abstract: S120GJ-50-3EB-2
    Text: Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm Mounting Pad 120 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 90 61 91 60 Q R D C S detail of lead end 31 F 120 1 30 G H I M J M P K N L NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of


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    LA-3519A-1 LA-0519A-1 SC-596-A* S120GJ-50-3EB-2 3eb data S120GJ-50-3EB-2 PDF

    P120GD-80-LBB

    Abstract: No abstract text available
    Text: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of


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    LA-3508A-1 OT-001T-01 P120GD-80-LBB, P120GD-80-LBB PDF

    LA-0518A-1

    Abstract: S160GM-50-JMD
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 detail of lead end C D S Q 160 1 F G R 41 40 H I M J K P M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of


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    LA-3529A-1 LA-0518A-1 S160GM-50-JMD, S160GM-50-JMD PDF

    LA-0518A-1

    Abstract: TRAY JEDEC
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 176 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C S D Q 176 1 R 45 44 F G H I J M K M P N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of


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    LA-3529A-1 LA-0518A-1 S176GM-50-3EU, TRAY JEDEC PDF

    Untitled

    Abstract: No abstract text available
    Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 JEDEC Tray MQFP 14x20 2.7mm LA-044A-1 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S Q R 31 30 100 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.15 mm (0.006 inch) of


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    LA-2244A-1 LA-1244A-1 LA-044A-1 S100GF-65-3BA-3 PDF

    nec 2701

    Abstract: JEDEC tray dimension 2701 NEC LA-0518A-1 QFP JEDEC tray
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 S C D R Q 41 40 160 1 F G H I J M P K S N S L NOTE ITEM 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm (0.004 inch) of


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    LA-3529A-1 LA-0518A-1 S160GM-50-3ED, nec 2701 JEDEC tray dimension 2701 NEC QFP JEDEC tray PDF

    S100GF-65-JBT-1

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 detail of lead end C S D R Q 31 30 100 1 F G H I M J K P M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of


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    LA-2244A-1 LA-1244A-1 LA-044A-1 S100GF-65-JBT-1 S100GF-65-JBT-1 PDF

    NEC 2701

    Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
    Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of


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    LA-2244A-1 LA-1244A-1 LA-044A-1 SC-582-A P64GF-100-3B8, P64GF-100-3B8 NEC 2701 NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M PDF

    S64GF

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of


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    LA-2244A-1 LA-1244A-1 LA-044A-1 039ch) S64GF-100-3B8, S64GF PDF

    JEDEC MS-026

    Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


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    MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A PDF

    MO-112

    Abstract: MS-022 MS-029 DS250G JEDEC standard 033
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,


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    MO-112

    Abstract: MS-029 MATRIX TRAY MS-022 LD240
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced


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    lqfp 7x7 tray

    Abstract: MS-026 7X748LD amkor
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


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    MS-026 lqfp 7x7 tray MS-026 7X748LD amkor PDF

    LD 337

    Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
    Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material


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    outline of the heat slug for JEDEC

    Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


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    MS-029/022 outline of the heat slug for JEDEC heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor PDF

    MS-026

    Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
    Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is


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    MS-029

    Abstract: 144 QFP body size amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


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    out029 MS-029/022 MS-029 144 QFP body size amkor PDF

    MS-029

    Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
    Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through


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