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    JEDEC TRAY STANDARD 17 X 17 Search Results

    JEDEC TRAY STANDARD 17 X 17 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSSMDB15MF-005 Amphenol Cables on Demand Amphenol CS-DSSMDB15MF-005 15-Pin (DB15) Standard Shielded D-Sub Cable - Male / Female 5ft Datasheet
    CS-DSSMDB25MF-005 Amphenol Cables on Demand Amphenol CS-DSSMDB25MF-005 25-Pin (DB25) Standard Shielded D-Sub Cable - Male / Female 5ft Datasheet
    CS-DSSMDB37MF-010 Amphenol Cables on Demand Amphenol CS-DSSMDB37MF-010 37-Pin (DB37) Standard Shielded D-Sub Cable - Male / Female 10ft Datasheet
    CS-DSSMDB9MF0-050 Amphenol Cables on Demand Amphenol CS-DSSMDB9MF0-050 9-Pin (DB9) Standard Shielded D-Sub Cable - Male / Female 50ft Datasheet
    CS-DSSMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSSMDB15MM-025 15-Pin (DB15) Standard Shielded D-Sub Cable - Male / Male 25ft Datasheet

    JEDEC TRAY STANDARD 17 X 17 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm


    Original     		ES/SMM5141XZ -12dB 22dBm 30dBc ES/SMM5141XZ PDF

    Untitled

    Abstract: No abstract text available
    Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		SMM5142XZ SMM5142XZ PDF

    LQFP Package tray

    Abstract: JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)


    Original     		LQFP12 64-pin 80-pin SSD-A-H7503 LQFP Package tray JEDEC TRAY DIMENSIONS PDF

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    erni 41612

    Abstract: Ge Spice ERNI 753
    Text: 074533_Umschlag_A5_2010_d 17.10.2010 11:01 Uhr Seite U4U11 Katalog ERNI Electronics Das Technologiezentrum ERNI Electronics GmbH Seestrasse 9 73099 Adelberg/Germany Tel +49 71 66 50-0 Fax +49 71 66 50-282 [email protected] Europa Südamerika ERNI Electronics, Inc.


    Original     		U4U11 23230/USA erni 41612 Ge Spice ERNI 753 PDF

    Untitled

    Abstract: No abstract text available
    Text: SXA10 SERIES Single output • • • • • • • • • • • • Pinout Diagram SXA10 Single Output 1 20 NC VO- 2 19 NC VO+ 3 18 NC VO- 4 17 TRIM VO- 5 16 NC NC 6 15 NC NC 7 14 NC NC 8 13 NC NC 9 12 UV/REM Vin+ 10 11 Vin- Registered design Patents pending


    Original     		SXA10 5-75V PDF

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    ELCO Edge Connectors

    Abstract: 1.27mm 10 pin box header connector right angle 14 pin pcb connector 2mm pitch SD Card Package tray DIN41612 Battery angle Connector, Pitch 2.5mm, 4 pin 38 PIN ELCO Connector AVX label DETAIL SD Card Package JEDEC tray
    Text: A KYOCERA GROUP COMPANY ELCO Memory Card Connectors Memory Card Connectors Contents Introduction .2 Series 5611/5612 How To Order. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PCMCIA PC MEMORY CARD CONNECTORS


    Original     		S-MCC0M907-C ELCO Edge Connectors 1.27mm 10 pin box header connector right angle 14 pin pcb connector 2mm pitch SD Card Package tray DIN41612 Battery angle Connector, Pitch 2.5mm, 4 pin 38 PIN ELCO Connector AVX label DETAIL SD Card Package JEDEC tray PDF

    Untitled

    Abstract: No abstract text available
    Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA


    Original     		SMM5722XZ 16GHz 50ohm SMM5722XZ PDF

    MIL202F

    Abstract: No abstract text available
    Text: SXA10 SERIES Single output • • • • • • • • • • • • Pinout Diagram SXA10 Single Output 1 20 NC VO- 2 19 NC VO+ 3 18 NC VO- 4 17 TRIM VO- 5 16 NC NC 6 15 NC NC 7 14 NC NC 8 13 NC NC 9 12 UV/REM Vin+ 10 11 Vin- Made in Ireland VO+ [ 5 YEAR WARRANTY ]


    Original     		SXA10 5-75V MIL202F PDF

    Untitled

    Abstract: No abstract text available
    Text: SXA10 SERIES Single output • • • • • • • • • • • • Pinout Diagram SXA10 Single Output 1 20 NC VO- 2 19 NC VO+ 3 18 NC VO- 4 17 TRIM VO- 5 16 NC NC 6 15 NC NC 7 14 NC NC 8 13 NC NC 9 12 UV/REM Vin+ 10 11 Vin- Made in Ireland VO+ Surface mount isolated DC/DC converter


    Original     		SXA10 5-75V PDF

    Untitled

    Abstract: No abstract text available
    Text: SXA10 SERIES Single output • • • • • • • • • • • • Pinout Diagram SXA10 Single Output 1 20 NC VO- 2 19 NC VO+ 3 18 NC VO- 4 17 TRIM VO- 5 16 NC NC 6 15 NC NC 7 14 NC NC 8 13 NC NC 9 12 UV/REM Vin+ 10 11 Vin- Made in Ireland VO+ [ 5 YEAR WARRANTY ]


    Original     		SXA10 7-75V PDF

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		SMM5139XZ SMM5139XZ PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet December 17, 2012 QBVW033A0B Series Power Modules; DC-DC Converters 36-75Vdc Input; 12Vdc Output; 33A Output Current BARRACUDA SERIES Features • •      RoHS Compliant Applications      Distributed power architectures


    Original     		QBVW033A0B 36-75Vdc 12Vdc 2002/95/EC 12Vdc, 33Adc Re1-972-244-WATT ds10-018 PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet December 17, 2012 QBVW025A0B Series Power Modules; DC-DC Converters 36-75Vdc Input; 12Vdc Output; 25A Output Current BARRACUDA SERIES Features • •      RoHS Compliant Applications      Distributed power architectures


    Original     		QBVW025A0B 36-75Vdc 12Vdc 2002/95/EC 12Vdc, 25Adc 1-888-LINEAGE 1-972-244-WATT ds11-002 PDF

    elco power supply

    Abstract: rf-microwave components ELCO Edge Connectors 20-5069-068-003-871 56 PIN ELCO Connector cd 5411 ELCO 5638 Straddle-Mount 54 Elco header pcb mounted 120 position
    Text: A KYOCERA GROUP COMPANY ELCO Memory Card Connectors Memory Card Connectors Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PCMCIA PC MEMORY CARD CONNECTORS Features/Benefits Series 5025, 5027, 5069, 9170 . . . . . . . . . . . . . . . . . . . 3


    Original     		Assembl496 5M1001-C elco power supply rf-microwave components ELCO Edge Connectors 20-5069-068-003-871 56 PIN ELCO Connector cd 5411 ELCO 5638 Straddle-Mount 54 Elco header pcb mounted 120 position PDF

    Memory Card Connectors

    Abstract: 1.27mm 10 pin box header connector MO-160 Battery angle Connector, Pitch 2.5mm, 4 pin 5612
    Text: A KYOCERA GROUP COMPANY ELCO Memory Card Connectors Memory Card Connectors Contents Introduction .2 Series 5611/5612 How To Order. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PCMCIA PC MEMORY CARD CONNECTORS


    Original     		S-MCC0M907-C Memory Card Connectors 1.27mm 10 pin box header connector MO-160 Battery angle Connector, Pitch 2.5mm, 4 pin 5612 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5143XZ 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm


    Original     		ES/SMM5143XZ 30GHz -12dB 24dBm ES/SMM5143XZ PDF

    IPC-J-STD-001

    Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
    Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures


    Original     		PDF

    BB 509 varicap diode

    Abstract: BLF6G22L ON503 tea6849 bf1107 spice model PIN diode ADS model ULTRA FAST DIODES SANYO catalog RF MANUAL diode varicap BB 112 adi cmos bipolar SiGe
    Text: UNLEASH RF RF Manual 17 edition th Application and design manual for High Performance RF products June 2013 NXP enables you to unleash the performance of next-generation RF and microwave designs NXP's RF Manual is one of the most important reference tools on the market for today’s


    Original     		PDF

    DAEWON JEDEC TRAY 10 X 10

    Abstract: DAEWON JEDEC TRAY DAEWON tray drawing JEDEC tray standard 17 x 17 TRAY JEDEC DAEWON DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
    Text: 06/09/8000 SA CHUNG • 322.6 - -6.35 SEE DETAIL 'D' V A C U U M PICKUP CELLS 14 PLACES (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 PLACES 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9 010.20®! Al Z ®


    OCR Scan     		JCL-6575-0 DAEWON JEDEC TRAY 10 X 10 DAEWON JEDEC TRAY DAEWON tray drawing JEDEC tray standard 17 x 17 TRAY JEDEC DAEWON DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10 PDF

    DAEWON JEDEC TRAY

    Abstract: DAEWON JEDEC TRAY 10 X 10 JEDEC tray standard 17 x 17 JEDEC tray standard 13 jedec tray scale TRAY DAEWON MPSU DAEWON JEDEC TRAY CABGA 7 X 7 JEDEC TRAY 10 X 10
    Text: 06/09/8000 SA CHUNG • 3 2 2 .6 - -6.35 SEE DETAIL 'D' VACUUM PICKUP C E L L S 14 P L A C E S (IE CENTER CELLS, 2 SIDE CELI ■0.20 A Xd -7.62 V BUMPS \17 P L A C E S 0IO.2O®IAIZ®I - 132.08- +0.25 -0.13 ♦ +H+0 * +0.25 -0.13 - 132.59- - XaESAlrií5,9


    OCR Scan     		PDF