MO-153-AE
Abstract: RU-28 MO-153AE JEDEC TSSOP 28 LEAD PACKAGE
Text: a 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.65 BSC 0.15 0.05 COPLANARITY 0.10 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 COMPLIANT TO JEDEC STANDARDS MO-153AE
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28-Lead
RU-28)
MO-153AE
MO-153-AE
RU-28
MO-153AE
JEDEC TSSOP 28 LEAD PACKAGE
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MO-153
Abstract: JEDEC MO-153 MO-153-AE JEDEC TSSOP 28 LEAD PACKAGE coplanarity RU-28
Text: 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters a 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.15 0.05 COPLANARITY 0.10 0.65 BSC 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AE
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28-Lead
RU-28)
MO-153-AE
MO-153
JEDEC MO-153
MO-153-AE
JEDEC TSSOP 28 LEAD PACKAGE
coplanarity
RU-28
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Untitled
Abstract: No abstract text available
Text: Package Information Vishay Siliconix TSSOP: 8-LEAD POWER IC ONLY JEDEC Part Number: MO-153 R 0.10 Corners) e A1 A A2 D 0.25 (Gage Plane) E1 MILLIMETERS E C B Document Number: 72803 28-Jan-04 L R 0.10 (4 Corners) L1 oK1 Dim A A1 A2 B C D E E1 e L L1 Y oK1
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MO-153
28-Jan-04
S-40079--Rev.
02-Feb-04
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CERAMIC LEADLESS CHIP CARRIER LCC 24
Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)
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Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)
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DS571J
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MO-153
Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
Text: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research
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JEDEC MO-153
Abstract: 78 mo 5 MO-153 tip55 JEDEC MO-187
Text: LEADFRAME data sheet TSSOP/MSOP Features Thin Shrink Small Outline Package, Micro Small Outline Package TSSOP/MSOP : TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.
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DS351)
MO-153
MO-194
JEDEC MO-153
78 mo 5
tip55
JEDEC MO-187
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MO-153
Abstract: JEDEC MO-153 38 MO-187 MO-194
Text: LEADFRAME data sheet ExposedPad TSSOP Features: ExposedPad TSSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages. The ExposedPad TSSOP can increase heat dissipation
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JEDEC MO-153
Abstract: MO-153 JEDEC MO-153 38
Text: PACKAGE OUTLINES PLASTIC THIN, SHRINK SMALL OUTLINE PACKAGE TSSOP 4.4 mm width, 38 leads Package Designator LD 9.8 9.6 38 .386 .378 8º 0º A B 0.20 .008 0.09 .004 Preliminary dimensions, for reference only Dimensions in millimeters U.S. Customary dimensions (in.) in brackets, for reference only
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MO-153
JEDEC MO-153
JEDEC MO-153 38
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JEDEC MO-187
Abstract: JEDEC MO-153
Text: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic
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DS350N
JEDEC MO-187
JEDEC MO-153
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CERAMIC LEADLESS CHIP CARRIER LCC 24
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)
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SOT23W-3
Abstract: MS-018-AC tssop 38 footprint PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW PUB26013 transistor crossreference DUAL ROW QFN leadframe MS-018AC
Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:
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PUB26013
SOT23W-3
MS-018-AC
tssop 38 footprint
PLCC 44 pin through hole
MO-220WGGC
SOT23 MARK EW
transistor crossreference
DUAL ROW QFN leadframe
MS-018AC
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SOT23W-3
Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW
Text: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number:
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PUB26013
SOT23W-3
transistor crossreference
footprint soic
16 soic pcb footprint
DFN 10 socket
EK QFN
MS-018AC
qfn 44 PACKAGE footprint
qsop 16 pcb footprint
SOT23 MARK EW
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93c46ln
Abstract: 93s46 eprom marking codes fairchild 24U02 93S46 eeprom FAIRCHILD SEMICONDUCTOR PRODUCT MARKING CODES F46L 24C02 code example assembly 93S46 24C02LN
Text: Non-Volatile Memory - EEPROM Physical Dimensions Contents Tape and Reel . 2 Part Marking . 3 Package Outlines M08A .
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MTC08
VBH48A
VEH64A
93c46ln
93s46 eprom
marking codes fairchild
24U02
93S46 eeprom
FAIRCHILD SEMICONDUCTOR PRODUCT MARKING CODES
F46L
24C02 code example assembly
93S46
24C02LN
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SNJ54HC365
Abstract: 5962-86812012A 5962-8681201EA 5962-86828012A 5962-8682801EA 8500101EA 8500201EA SN54HC365J Level-1-260C-UNLIM
Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8681201EA ACTIVE CDIP J 16 1 TBD
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26-Sep-2005
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5962-86828plifiers
SNJ54HC365
5962-86812012A
5962-8681201EA
5962-86828012A
5962-8682801EA
8500101EA
8500201EA
SN54HC365J
Level-1-260C-UNLIM
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CD4067BE
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003 The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR
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SCHS052B
CD4067B
CD4097B
24-lead
9-Oct-2007
CD4067BE
CD4067BEE4
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Ablebond 8390
Abstract: ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG/03/380 DSG-DISCRETES & STANDARD IC s- LEADFREE PLATING FOR SOP, TSSOP, SSOP, QSOP PACKAGES. 2003/11/28 PCN DSG/03/380 Product Family /Commercial Product All products in SOP, TSSOP, SSOP, QSOP PACKAGES. Type Of Change
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DSG/03/380
24-Feb-2004
28-Nov-2003
Ablebond 8390
ESDA6V2HPRL
CLP190ERL
LM358DT
ESDA6V2HP
CLP190
LM324DT
M74HC14RM13TR
LM2904DT
16 g700
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
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29-Jun-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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PDF
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1 TBD
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6-Feb-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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PDF
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1
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12-Jan-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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PDF
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
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18-Jul-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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PDF
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
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6-Dec-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
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PDF
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8681201EA ACTIVE CDIP J 16 1 TBD
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6-Feb-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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PDF
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SNJ54HC365
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86812012A ACTIVE LCCC FK 20 1 TBD 5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
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6-Dec-2006
962-86812012A
5962-8681201EA
962-86828012A
5962-8682801EA
5001012A
SNJ54HC365
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