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    K7I641882M-FC30 Search Results

    K7I641882M-FC30 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    L717SDB25PVFC309 Amphenol Communications Solutions D-Sub Standard Density Connector, Input Output Connectors, Stamped Signal 3A, Straight Solder Cup, 25 Position Plug, 0.76um (29.921u\\) Gold Plating Visit Amphenol Communications Solutions
    L77SDAH15SVFC309 Amphenol Communications Solutions D-Sub Standard Density Connector, Input Output Connectors, Stamped Signal 3A, Straight Solder Cup, 15 Position Receptacle, 0.76um (29.921u\\) Gold Plating Visit Amphenol Communications Solutions
    L717SDC37P1ACH3FC309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 37 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, M3 Front Screwlock, Ground Tab with Boardlock Visit Amphenol Communications Solutions
    L717SDC37PA4CH4FC309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 37 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock Visit Amphenol Communications Solutions
    L77SDB25S1ACH3FC309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 25 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Boardlock Visit Amphenol Communications Solutions

    K7I641882M-FC30 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    K7I641882M-FC30 Samsung Electronics 72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant) Original PDF