200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
|
Original
|
IPC-SM-782)
200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
|
PDF
|
1206 land pattern
Abstract: NOMCA MPMA HTRN
Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin
|
Original
|
IPC-SM-782
M/D55342
12-Jun-15
1206 land pattern
NOMCA
MPMA
HTRN
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2510-10 package SOT1165-1 Hx P C Hy Ay By 0.05 D D1 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
|
Original
|
DFN2510-10
OT1165-1
sot1165-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DFN Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 5 x 5 mm DFN packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.
|
Original
|
13-Oct-08
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2626-10 package SOT1197-1 Hx Gx D P 0.025 0.025 Ay Gy By SPy SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit
|
Original
|
DFN2626-10
OT1197-1
sot1197-1
|
PDF
|
TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
|
Original
|
TB389
|
PDF
|
J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
|
PDF
|
J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
|
PDF
|
IPC-7351A
Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
|
Original
|
IPC-7351A
DFN1006-2
DFN1006H4-2
OD-323
OD-123
OD-523
DFN1006H4-2
OD-123
OD-323
IPC-7351A
MiniMELF land pattern
land pattern for TSsOP 16
land pattern for TSSOP
sot89 land pattern
PowerDI3333-8
SOD-323 land pattern
y1 SOT23
DFN2020
SOD523 land pattern
|
PDF
|
SOT-563 SOT-666
Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
|
Original
|
IPC-7351A
DFN1006-2
DFN1006H4-2
OD-323
OD-123
OD-523
DFN1006H4-2
OD-123
OD-323
SOT-563 SOT-666
SOD523 land pattern
IPC-7351A
IPC SOD 323F
SOT-95
SOD-323 land pattern
SOT-353 G5
Y3 SOT23
DFN1006-3
|
PDF
|
IPC-7351A
Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Text: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35
|
Original
|
IPC-7351A
DFN1006-2
OD-323
OD-123
OD-523
DFN1006-3
DFN1310H4-6
DFN1612-6
IPC-7351A,
AP02001
IPC-7351A
DFN1616-8
DFN2018-6
ipc SMB SMC
MELF pad layout
MiniMELF land pattern
MELF "Land Pattern"
DFN1411-3
land pattern for SOP
|
PDF
|
Y1 SOT-23
Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
|
Original
|
IPC-7351A
DFN1006-2
DFN1006H4-2
OD-323
OD-123
OD-523
DFN1006H4-2
OD-123
OD-323
Y1 SOT-23
MELF pad layout
DFN2020-3
ipc SMB SMC
land pattern for TSsOP 16
IPC-7351A
SOT-353 G5
SOD-323 land pattern
SOD523 land pattern
land pattern for msOP 8
|
PDF
|
MMA7660
Abstract: SURFACE MOUNT CAPACITORS footprint land pattern AN3839 MMA7660FC accelerometer sensor land pattern for DFN
Text: Freescale Semiconductor Application Note AN3839 Rev 2, 9/2009 MMA7660FC Board Mounting Guidelines by: Laura Salhuana ACRONYMS PCB: Printed Circuit Board DFN: Dual Flat No-Lead Cl: Chlorine Br: Bromine RoHS: Restrictions on Hazardous Substances Sn: tin Pb: lead
|
Original
|
AN3839
MMA7660FC
MMA7660
SURFACE MOUNT CAPACITORS footprint land pattern
AN3839
accelerometer sensor
land pattern for DFN
|
PDF
|
land pattern for DFN
Abstract: dual flatpack
Text: v00.0506 LP2 E – 2 x 2 mm DUAL FLATPACK NO-LEAD (DFN) PLASTIC PACKAGE PACKAGE OUTLINES LP2 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. PAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
|
Original
|
|
PDF
|
|
|
s2083
Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder
|
Original
|
S2083
s2083
qfn 32 5x5 STENCIL
rf 4 mm PQFN
s2083 application
PQFN
jedec package MO-220 32 5x5
qfn 3X3 land pattern
PDFN
STQFN-14
MO-220
|
PDF
|
package
Abstract: alpha solder paste PROFILE
Text: Document No. DSMT-0001 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Sawn Package Introduction DFN2x5 package is a plastic encapsulated package with a copper lead frame substrate. It offers good thermal and electrical performance, near chip scale footprint, thin profile and low
|
Original
|
DSMT-0001
package
alpha solder paste PROFILE
|
PDF
|
AA112A
Abstract: IPC-7351A
Text: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10
|
Original
|
AP02002)
AP02001)
IPC-7351A)
DFN0402â
DFN0603â
DFN0606â
IPC-7351A,
AA112A
IPC-7351A
|
PDF
|
dfn3020
Abstract: mlx90248 AH1801 AH1802 AH1803 AH1822 DFN2020-3 DFN2020-6 DFN3020-6 SC59
Text: Diodes, Inc.’s New Product Announcement, May 9, 2008 Micro-power Omnipolar Hall Effect Sensor Switch AH1822 with Ultra Thin DFN Package for the Portable Consumer Electronics Markets
|
Original
|
AH1822
DFN3020-6
40Typ.
50Typ.
15Typ.
dfn3020
mlx90248
AH1801
AH1802
AH1803
DFN2020-3
DFN2020-6
SC59
|
PDF
|
1750mW
Abstract: No abstract text available
Text: 2008/03/12 Step Dow n DC/DC converter w ith LDO and Reset RP901series OUTLINE The RP901K is CMOS based PWM step-down DC/DC converter combined with a 600mA LDO and a voltage detector VD , with low supply current. Because of DFN(PLP)2527-10 package, high density mounting on boards is possible.
|
Original
|
RP901series
RP901K
600mA
400mA
1750mW
|
PDF
|
RP111N
Abstract: RP111H Z X C SOT-89-5 RP111L voltage regulator sot-89-5 RP111X
Text: RP111x Series PRELIMINARY ULTRA SMALL 1ch 500mA REGULATOR NO.EA-241-100911 OUTLINE The RP111x Series are positive voltage regulator ICs, which have been developed using the CMOS process technology, with high ripple rejection, low dropout voltage, high output voltage accuracy, and low-supply current.
|
Original
|
RP111x
500mA
EA-241-100911
10pcs
1300mW
900mW
500mW
RP111N
RP111H
Z X C SOT-89-5
RP111L
voltage regulator sot-89-5
|
PDF
|
CPC7583
Abstract: GR-1089-CORE
Text: CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching
|
Original
|
CPC7583
20-pin
28-pin
CPC7583
10-pole
DS-CPC7583
GR-1089-CORE
|
PDF
|
Untitled
Abstract: No abstract text available
Text: UM5079/Q Single Line ESD Protection Diode Array UM5079/Q FBP2 1.0x0.6 /DFN2 1.0×0.6 General Description The UM5079/Q ESD protection diode is designed to replace multilayer varistors MLVs in portable applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional area
|
Original
|
UM5079/Q
UM5079/Q
|
PDF
|
FBP02
Abstract: No abstract text available
Text: UM5059/Q Single Line ESD Protection Diode Array UM5059 UM5059Q FBP02 1.0x0.6 DFN2 1.0×0.6 General Description The UM5059/Q ESD protection diode is designed to replace multilayer varistors MLVs in portable applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional area
|
Original
|
UM5059/Q
UM5059
UM5059Q
FBP02
UM5059/Q
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Description Features • • • • • Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8 at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package
|
Original
|
PA2011
SC70-6
PA2011
|
PDF
|
