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    LAND PATTERN PQFP 208 Search Results

    LAND PATTERN PQFP 208 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BQ2052SN-A515 Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 Visit Texas Instruments Buy
    CSD87501L Texas Instruments 30V, N ch NexFET MOSFET™, dual common drain LGA, 5.5mOhm 10-PICOSTAR Visit Texas Instruments Buy
    CSD83325L Texas Instruments 12V, N ch NexFET MOSFET™, dual LGA, 5.9mOhm 6-PICOSTAR Visit Texas Instruments Buy
    CSD25480F3 Texas Instruments -20V, P ch NexFET MOSFET™, single LGA 0.6x0.7, 159mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy
    CSD17381F4 Texas Instruments 30V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 117mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy

    LAND PATTERN PQFP 208 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100 PDF

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100 PDF

    land pattern PQFP 132

    Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208 PDF

    m0-112

    Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112 PDF

    land pattern for TSOP 2 44 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
    Text: High perform ance 512KX32 CMOS SGRAM 16 Megabit CMOS synchronous graphic RAM Advance information • Organization - 131,072 words x 32 bits x 4 banks • Fully synchronous - All signals referenced to positive edge of dock • Four internal banks controlled by BA0/BA1 bank select


    OCR Scan     		512KX32 AS4LC512K32SG0 100-pin land pattern for TSOP 2 44 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208 PDF

    mp3 usb fm circuit with remote

    Abstract: lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 ES4810SAA samsung lcd panel circuit diagram free servo control PCB diagram
    Text: ES4810SAA Digital Audio Processor Product Brief PRELIMINARY ESS Technology, Inc. DESCRIPTION FEATURES The ES4810SAA Digital Audio Processor DAP 3 is an SOC chip designed for automotive audio applications. It integrates a servo controller, RF amplifier, servo DSP,


    Original     		ES4810SAA ES4810SAA ES4810 ISO9660, FAT32. SAM0660-080406 mp3 usb fm circuit with remote lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 samsung lcd panel circuit diagram free servo control PCB diagram PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    D2863-77

    Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
    Text: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these


    Original     		1970s D2863-77 Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208 PDF

    IEC 68-2-32

    Abstract: No abstract text available
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		lead-f99, IEC 68-2-32 PDF

    solder voids to263

    Abstract: IEC 68-2-32 R/Detector/"detectors+ic"/"CD"/solder voids to263
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		PDF

    land pattern PQFP 208

    Abstract: No abstract text available
    Text: HEVIS DONS DCN 29253 REV DO □E5CRP710N □ATE INITIAL RELEASE 00/20/96 1, 6147B 6162» D1 D2 ADD ‘DK PACKAGE OPTION ADD ’DR" PACKAGE OPTION 09/20/ W oi/JD/gg X vu EVEN LEAD SIDES APPROVED vu ODD LEAD SIDES @"E? ?!?!? r X HZÜ H = l' - A , B DR P-l H D


    OCR Scan     		6147B E5CRP710N 727-eHB land pattern PQFP 208 PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY PDF

    all ic data

    Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
    Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile


    Original     		PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    all ic data

    Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
    Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: HKVBD O NS DCN RE V □ E5C R P 71 0N □ ATE 0147Ö DO INITIAL R E L E A S E 0 9 / 2 0 /9Ö EVEN LEAD SIDES APPRO VED ODD LEAD SIDES @"E? ?!?!? r EXPOSED HEAT SINK X HZÜ H = l' -A, B DR P-l H D i i II II I I r- b KhJ- -A, B OR D - l V . DETAIL A @"M? ?!,?! >?!


    OCR Scan     		727-eH PDF

    JEDEC Matrix Tray outlines

    Abstract: IspLSI PCMCIA copper bond wire micro semi BGD35
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		JESD51, JEDEC Matrix Tray outlines IspLSI PCMCIA copper bond wire micro semi BGD35 PDF

    footprint jedec MS-026 TQFP

    Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		G46-88 footprint jedec MS-026 TQFP PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas PDF

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP PDF

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208 PDF

    Untitled

    Abstract: No abstract text available
    Text: R4761 ORION FAMILY SYSTEM CONTROLLER FEATURES • • • • • • • Direct interface to IDT o r io n R4640/R4650/R4700/R5000 RISC microprocessors - 64-bit interface support for R4650/R4700/R5000 - 32-bit interface support for R4640/4650 Available at 5V and 3.3V


    OCR Scan     		R4761 IDT79R4761TM R4640/R4650/R4700/R5000 64-bit R4650/R4700/R5000 32-bit R4640/4650 RS-232 79R4761TM IDT79 PDF