cw DWDM laser 1610
Abstract: D2570H25 D2555 D2570 STM-16 agere photodiode D2526G910
Text: AdLib OCR Evaluation systems a ' e re 8 Data Sheet, Rev. 3 July 2001 132570, 132526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications . Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications :
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D2555
OC-48/STM-16
D2526G,
14-pin,
OC-48/STM-16
well0121
DS00-165OPTO-3
DS00-165OPTO-2)
cw DWDM laser 1610
D2570H25
D2570
STM-16
agere photodiode
D2526G910
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D2570H35
Abstract: D2570H36 D2570H909 D2526t D2526G910 D2570H33
Text: Data Sheet March 2001 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)
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D2570,
D2526,
D2555
OC-48/STM-16
D2526G,
14-pin,
D2570H
D2526G
D2570H35
D2570H36
D2570H909
D2526t
D2526G910
D2570H33
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Lucent D2526G910
Abstract: lucent laser D2526 D2526t Lucent D2570 D2526G21 532 nm laser diode D2526G24 D2526G910 LUCENT lucent DFB laser application d2526 lucent
Text: Data Sheet August 2000 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)
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D2570,
D2526,
D2555
OC-48/STM-16
nm--1610
OC-48/STM-16
DS00-165OPTO-1
DS00-165OPTO)
Lucent D2526G910
lucent laser D2526
D2526t
Lucent D2570
D2526G21
532 nm laser diode
D2526G24
D2526G910 LUCENT
lucent DFB laser application
d2526 lucent
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transistor tl 187
Abstract: d2526 triquint 532 nm laser diode 74HC138 MSI CMOS D2570H28 lb 1551 D2526t D2526G910 D257 D2570H34
Text: Data Sheet, Rev. 3 February 2003 TriQuint Optoelectronics D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • uint OR TSrEiMQICONDUCT 0H D257 ® t OR uOiNnDUCT G Q i TrSEMIC 2526 TriQ SE MIC uin O ND t D2
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D2570,
D2526,
D2555
OC-48/STM-16
D2570H
D2526G
D2555G
D2526G,
transistor tl 187
d2526 triquint
532 nm laser diode
74HC138 MSI CMOS
D2570H28
lb 1551
D2526t
D2526G910
D257
D2570H34
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Lucent D2570
Abstract: lucent laser D2526 Lucent D2526G910 D2526t D2526G910 LUCENT D2555-type OPTO ISOLATOR TL D2526 D2555 D2570H25
Text: Data Sheet February 2000 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)
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D2570,
D2526,
D2555
OC-48/STM-16
D2570H
D2526G
D2555G
D2526G,
Lucent D2570
lucent laser D2526
Lucent D2526G910
D2526t
D2526G910 LUCENT
D2555-type
OPTO ISOLATOR TL
D2526
D2570H25
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Agere D2570
Abstract: D2526t D2570H28 D2526 D2555 D2570 STM-16 D25* laser D2570H25 agere photodiode
Text: Data Sheet, Rev. 3 July 2001 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)
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D2570,
D2526,
D2555
OC-48/STM-16
D2570H
D2526G
D2555G
D2526G,
Agere D2570
D2526t
D2570H28
D2526
D2570
STM-16
D25* laser
D2570H25
agere photodiode
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"Air Flow Sensor"
Abstract: 101B SDT101 SDT101B air flow sensor
Text: THERMAL SENSORS / CIRCUIT PROTECTORS Thermal sensors Thin film platinum sensor AXIAL SDT101 STRUCTURE 1 2 3 4 5 6 Thin Pt film on ceramic core End caps Laser cuts Copper lead wire SnCu type A Ni (type B) Epoxy resin (type A) Polyimide resin (type B) Marking (only type A)
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SDT101
SDT101
D-25578
"Air Flow Sensor"
101B
SDT101B
air flow sensor
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RK73N
Abstract: 10K 103 variable resistor
Text: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination (SN 90% / Pb 10 %)
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RK73N
RK73N
10K 103 variable resistor
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Untitled
Abstract: No abstract text available
Text: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR
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RK73N
RK73N
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RK73N
Abstract: resistor trimmable transistor w2h RK73N2A
Text: FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR MARKING RK73N
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RK73N
RK73N
D-25578
resistor trimmable
transistor w2h
RK73N2A
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RK73N
Abstract: No abstract text available
Text: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR
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RK73N
RK73N
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Untitled
Abstract: No abstract text available
Text: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR
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RK73N
RK73N
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Untitled
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP SURGE CURRENT THICK FILM SG73 STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni) Solder plating (Sn 90%/Pb 10%)
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D-25578
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MRGF16X
Abstract: No abstract text available
Text: NETWORKS Thick Film r-networks MINI FLAT PACKAGE MRGF16 STRUCTURE 2 1 2 3 4 5 1 Molded resin Ceramic substrate Resistive film Inner electrode Terminal 3 4 NETWORKS PASSIVE COMPONENTS 5 IDENTIFICATION COATING COLOR Black TYPE MRGF16 MARKING Products with Pb-free terminations
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MRGF16
MRGF16X
MRGF16D
MRGF16W
D-25578
MRGF16X
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Untitled
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)
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D-25578
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PDF
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Untitled
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)
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D-25578
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PDF
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Untitled
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)
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D-25578
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Thermal Fuse 125V 5A
Abstract: No abstract text available
Text: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm)
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D-25578
Thermal Fuse 125V 5A
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Thermal Fuse 125V 5A
Abstract: No abstract text available
Text: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm)
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D-25578
Thermal Fuse 125V 5A
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notebook Universal LCD inverter
Abstract: IEC60127-4 marking 1F 1f44 1f55
Text: CIRCUIT PROTECTORS CIRCUIT PROTECTORS universal modular fuse-links CCF-UM STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated All these products have Pb-free terminations and meet EU-RoHS and China-RoHS requirements IDENTIFICATION DIMENSIONS (mm)
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125Va
/125Vd
D-25578
notebook Universal LCD inverter
IEC60127-4
marking 1F
1f44
1f55
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593 60v
Abstract: UL248-14 E171 1N 50A marking ccf
Text: THERMAL SENSORS / CIRCUIT PROTECTORS CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm) TYPE COATING COLOR MARKING
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/160V
D-25578
593 60v
UL248-14
E171
1N 50A
marking ccf
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593 60v
Abstract: 1N 50A 1304H
Text: CIRCUIT PROTECTORS CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet EU-RoHS and China-RoHS requirements IDENTIFICATION TYPE DIMENSIONS (mm) COATING COLOR CCF 1 N
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/160V
D-25578
593 60v
1N 50A
1304H
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-20/lucent laser D2526
Abstract: No abstract text available
Text: Data Sheet September 1998 group Lucent Technologies Bell Labs Innovations D2570, D2526, D2555 Wavelength-Selected Laser 2000 Direct Modulated Isolated DFB Laser Module Applications • T h re e d irect-m odulated DW DM fam ilies available to m eet a num ber of O C -4 8 /S T M -1 6 applications
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D2570,
D2526,
D2555
2570H
2526G
2555G
14-pin,
D2570H59
D2570H60
D2570H61
-20/lucent laser D2526
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lucent laser D2526
Abstract: d2526 lucent Lucent D2570 d2526 -20/lucent laser D2526 2526G lucent tunable laser
Text: Data Sheet 1998 September m n i• c sa g r o u p ■ ■■i■c r■ov ce l■ec c t r■own y' Lucent Technologies Bell Labs Innovations D2570, D2526, D2555 Wavelength-Selected Laser 2000 Direct Modulated Isolated DFB Laser Module Applications ■ T hree d irect-m odulated DW DM fam ilies available
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D2570,
D2526,
D2555
-48/S
D2570H
D2526G
D2555G
S98-431LW
DS97-265LW
lucent laser D2526
d2526 lucent
Lucent D2570
d2526
-20/lucent laser D2526
2526G
lucent tunable laser
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