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    LAYOUTS AND PIN COUNTS Search Results

    LAYOUTS AND PIN COUNTS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TB67H481FTG Toshiba Electronic Devices & Storage Corporation Stepping and Brushed Motor Driver /Bipolar Type / Vout(V)=50 / Iout(A)=3.0 / IN input type / VQFN32 Visit Toshiba Electronic Devices & Storage Corporation
    TLP3406SRH4 Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 30 V/0.9 A, 300 Vrms, S-VSON16T Visit Toshiba Electronic Devices & Storage Corporation
    TLP5702H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-Topr / IGBT driver, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TLP3407SRA Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T Visit Toshiba Electronic Devices & Storage Corporation
    TLP3407SRH Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T Visit Toshiba Electronic Devices & Storage Corporation

    LAYOUTS AND PIN COUNTS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    177-140H

    Abstract: MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS27469 MS3440 MS27478
    Text: INDEX Hermetic Connectors Product Index PRODUCT INDEX MIL-DTL-38999 Series I, II, III and IV Type Hermetic Connectors MIL-DTL-38999 Hermetic Connector Product Features B-1 MIL-DTL-38999 Series I, II, III and IV Hermetic Class Insert Arrangements B-2 MIL-DTL-38999 Series I, II, III and IV Hermetic Class Layouts and Pin Counts


    Original     		MIL-DTL-38999 MS27469 231-100-H0 177-140H MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS3440 MS27478 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


    Original     		F-212 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


    Original     		F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


    Original     		F-212 charge69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-210-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


    Original     		F-210-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


    Original     		F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


    Original     		F-211 charg69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


    Original     		F-211-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


    Original     		F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


    Original     		F-212 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


    Original     		F-211-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


    Original     		F-212 PDF

    LPAF

    Abstract: No abstract text available
    Text: F-210-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


    Original     		F-210-1 LPAF PDF

    Untitled

    Abstract: No abstract text available
    Text: SEAF8–30–05.0–S–06–2–K SEAF8–30–05.0–S–04–2–K 0,80 mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 ™ For complete specifications and recommended PCB layouts see


    Original     		PDF

    d38999 22d

    Abstract: D38999 5D-18 D38999 series I II d38999 d97 D3899
    Text: D38999 QPL Hermetics MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements MS Series I B MS Series II 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19


    Original     		D38999 MIL-DTL-38999 d38999 22d 5D-18 D38999 series I II d38999 d97 D3899 PDF

    SEAM8

    Abstract: SEAM8-30-S02 Seaf SEAF8
    Text: F-210-1 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


    Original     		F-210-1 SEAM8 SEAM8-30-S02 Seaf SEAF8 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


    Original     		F-211-1 PDF

    Seaf

    Abstract: SEAM8 SEAF8
    Text: F-210-1 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


    Original     		F-210-1 Seaf SEAM8 SEAF8 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


    Original     		F-211-1 cha69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F213 Rev 8AUG13 SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K (0,80 mm) .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see


    Original     		8AUG13) PDF

    Layouts and Pin Counts

    Abstract: No abstract text available
    Text: D38999 QPL Hermetics MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements MS Series I B MS Series II 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19


    Original     		D38999 MIL-DTL-38999 Layouts and Pin Counts PDF

    Untitled

    Abstract: No abstract text available
    Text: SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Up to 500 I/Os Mates with: SEAF8 7 mm and 10 mm Stack Heights For complete specifications and recommended PCB layouts see


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: F-213 SEAM8–30–S02.0–S–06–2–K–TR SEAM8–30–S05.0–S–04–2–K–TR 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see


    Original     		F-213 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS M ates with: LPAF For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: Black LCP 4 or 6 row Terminal Material: Copper Alloy Plating: Au or Sn over 50p“ 1,27pm Ni


    OCR Scan     		PDF