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    LEAD FRAME QFP Search Results

    LEAD FRAME QFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    LEAD FRAME QFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    LEAD FRAME SURFACE MOUNT

    Abstract: ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23
    Text: Package Characteristics External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Full name Symbol External outline Frame IC Package Description Pitch Lead type TO-92 Transistor Outline


    Original     		PDF O-220F OT-89 O-252 LEAD FRAME SURFACE MOUNT ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		PDF 16-pin MF202 160P6) 152P6T) 135S8) 42Alloy) leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES

    ic package

    Abstract: Cu Alloy 42 transistor outline package 3
    Text: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name External outline IC Package Description Frame Pitch TO-92 Transistor Outline Package


    Original     		PDF O-220F OT-89 O-252 ic package Cu Alloy 42 transistor outline package 3

    LEAD FRAME SURFACE MOUNT

    Abstract: Alloy 42 Cu Alloy 42 lead frame led lead frame
    Text: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name IC Package Description External outline Frame Pitch TO-220F Transistor Outline Package


    Original     		PDF O-220F OT-89 O-252 778mm LEAD FRAME SURFACE MOUNT Alloy 42 Cu Alloy 42 lead frame led lead frame

    QFP64-P-1414

    Abstract: No abstract text available
    Text: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999


    Original     		PDF QFP64-P1414-0 80-BK QFP64-P-1414

    QFP128-P-2828-0

    Abstract: No abstract text available
    Text: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP128-P-2828-0 80-DK

    QFP100-P-1420-0

    Abstract: No abstract text available
    Text: QFP100-P-1420-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.29 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP100-P-1420-0 65-BK

    QFP80-P

    Abstract: No abstract text available
    Text: QFP80-P-1414-0.65-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.85 TYP. 3/Nov. 28, 1996


    Original     		PDF QFP80-P-1414-0 QFP80-P

    QFP208-P-2828-0

    Abstract: QFP208-P
    Text: QFP208-P-2828-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.65 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP208-P-2828-0 50-BK4 QFP208-P

    QFP56-P

    Abstract: No abstract text available
    Text: QFP56-P-910-0.65-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.43 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP56-P-910-0 65-2K QFP56-P

    QFP160-P-2828-0

    Abstract: No abstract text available
    Text: QFP160-P-2828-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP160-P-2828-0 65-BK4

    QFP160-P-2828-0

    Abstract: No abstract text available
    Text: QFP160-P-2828-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP160-P-2828-0 65-BK

    QFP44-P-910-0

    Abstract: No abstract text available
    Text: QFP44-P-910-0.80-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.41 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP44-P-910-0 80-2K

    QFP128-P-2828-0

    Abstract: QFP128-P
    Text: QFP128-P-2828-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.58 TYP. 3/Nov. 28, 1996


    Original     		PDF QFP128-P-2828-0 80-BK QFP128-P

    Untitled

    Abstract: No abstract text available
    Text: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001


    Original     		PDF QFP64-P-1414-0 80-BK

    BK-4

    Abstract: qfp304 QFP304-P-4040-0
    Text: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP304-P-4040-0 50-BK4 BK-4 qfp304

    QFP128-P-1420-0

    Abstract: qfp128p
    Text: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP128-P-1420-0 qfp128p

    QFP80-P-1420-0

    Abstract: No abstract text available
    Text: QFP80-P-1420-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP80-P-1420-0 80-BK

    QFP100-P-1420-0

    Abstract: No abstract text available
    Text: QFP100-P-1420-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.54 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP100-P-1420-0 65-BK4

    QFP272-P-3636-0

    Abstract: No abstract text available
    Text: QFP272-P-3636-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 9.96 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP272-P-3636-0 50-BK4

    QFP240-P-3232-0

    Abstract: No abstract text available
    Text: QFP240-P-3232-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 7.82 TYP. 2/Nov. 28, 1996


    Original     		PDF QFP240-P-3232-0 50-BK4

    QFP208-P-2828-0

    Abstract: No abstract text available
    Text: QFP208-P-2828-0.50-EK4 Built-in PCB Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.35 TYP. 3/Nov. 28, 1996


    Original     		PDF QFP208-P-2828-0 50-EK4

    QFP208-P-2828-0

    Abstract: No abstract text available
    Text: QFP208-P-2828-0.50-CK4 Built-in heat spreader Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.70 TYP. 4/Nov. 28, 1996


    Original     		PDF QFP208-P-2828-0 50-CK4