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    LED FLIP-CHIP HEATSINK Search Results

    LED FLIP-CHIP HEATSINK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC4013BP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, D-Type Flip-Flop, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC7WZ74FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), D-Type Flip-Flop, SOT-505 (SM8), -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC7WZ74FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), D-Type Flip-Flop, SOT-765 (US8), -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC7WH74FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), D-Type Flip-Flop, SOT-505 (SM8), -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC7WH74FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), D-Type Flip-Flop, SOT-765 (US8), -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation

    LED FLIP-CHIP HEATSINK Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4F01F SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: R:AlGaInP, Face up chip ;G:InGaN ;B:InGaN, Flip chip. 3. Emitted color: Red ;Green ;Blue. 4. High lumen output. 5. High flux density. 6. Low power consumption.


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    BWL-3A4F01F 350mA 350mA PDF

    BWL-2B1A01

    Abstract: No abstract text available
    Text: BRIGHT LED ELECTRONICS CORP. BWL-2B1A01 SINCE 1981 ● Features: 1. Input power: 1W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. Add extra heat sink is necessary.


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    BWL-2B1A01 350mA) BWL-2B1A01 PDF

    Untitled

    Abstract: No abstract text available
    Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4A04H SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. The emitting color meets SAE standard.


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    BWL-3A4A04H 700mA) PDF

    BWL-2B1G01

    Abstract: No abstract text available
    Text: BRIGHT LED ELECTRONICS CORP. BWL-2B1G01 SINCE 1981 ● Features: 1. Input power: 1W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: Green. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. Add extra heat sink is necessary.


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    BWL-2B1G01 350mA) BWL-2B1G01 PDF

    lm 1315

    Abstract: LM121
    Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4A04H-H1 SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. The emitting color meets SAE standard.


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    BWL-3A4A04H-H1 700mA) lm 1315 LM121 PDF

    marking code B1 inductor

    Abstract: VLF4012AT220MR51 led flip-chip
    Text: NCP5010 Product Preview 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device has been designed with high−efficiency for use in portable applications and is capable of


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    NCP5010 NCP5010/D marking code B1 inductor VLF4012AT220MR51 led flip-chip PDF

    Untitled

    Abstract: No abstract text available
    Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable


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    NCP5010 NCP5010 NCP5010/D PDF

    BC847BD

    Abstract: TDK TRACE CODE INFORMATION C1608X5R1E105MT
    Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable


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    NCP5010 NCP5010/D BC847BD TDK TRACE CODE INFORMATION C1608X5R1E105MT PDF

    C1608X5R0J475MT

    Abstract: GRM185R61A105KE36 A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT C1608X5R1E105MT
    Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable


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    NCP5010 NCP5010 NCP5010/D C1608X5R0J475MT GRM185R61A105KE36 A108B A114 A115 JESD22 JESD78 VLF4012AT C1608X5R1E105MT PDF

    0603 footprint IPC

    Abstract: C1608X5R0J475MT A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT led flip-chip
    Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable


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    NCP5010 NCP5010 NCP5010/D 0603 footprint IPC C1608X5R0J475MT A108B A114 A115 JESD22 JESD78 VLF4012AT led flip-chip PDF

    0603 footprint IPC

    Abstract: A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT DT1608C-223
    Text: NCP5010 Product Preview 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal


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    NCP5010 NCP5010 NCP5010/D 0603 footprint IPC A108B A114 A115 JESD22 JESD78 VLF4012AT DT1608C-223 PDF

    underfill

    Abstract: EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC
    Text: EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automated-bonding TAB technology in order to meet the requirement to put the watch IC into


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    1960s, Th-9/00 underfill EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC PDF

    Untitled

    Abstract: No abstract text available
    Text: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: BRIGHT LED ELECTRONICS CORP. SINCE 1981 DATA SHEET ●DEVICE NUMBER:BWL-3A3W01S-H1 SHEET DATE 1 2 3 4 5 CONTENTS 2005.05.20 1.0 1.0 1.0 1.0 1.0 Preliminary 2005.10.11 1.1 1.1 1.1 1.1 1.1 P1-P5 2006.02.10 2.0 2.0 2.0 2.0 2.0 P1-P5 佰鴻工業股份有限公司


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    NUMBERBWL-3A3W01S-H1 BWL-3A3W01S-H1 12VDC. 350mA) PDF

    L6372

    Abstract: IEC1131 L6372DP L6372FP SO20
    Text: L6372 OCTAL INDUSTRIAL INPUT INTERFACE PRODUCT PREVIEW INPUT STATUS MONITORING BY MEANS OF CURRENT LEVELS DETECTION EXTERNALLY PROGRAMMABLE UPPER CURRENT LEVEL INPUT OPEN LINE DETECTION INPUT PROTECTION BY MEANS OF INTERNAL DIODES CLAMPING TO GROUND AND SUPPLY VOLTAGE


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    L6372 L6372 L6372DP Powerdip16 L6372FP IEC1131 L6372DP L6372FP SO20 PDF

    GRM40X7R104K25

    Abstract: 68c11 MC68HC11 PLCC52 MC68HC811E9 GRM230Y5V106Z10 D206 DIP8 RS232 MAX232 rx led DB9RA 74HC259 motorola D213 user guide
    Text: AND8073/D Using the NCN6000 Smart Card Interface Demo Board V1.1 User Manual Prepared by: Michael Bairanzade Applications Engineering Thierry Caritoux Applications Engineering http://onsemi.com APPLICATION NOTE • Asynchronous type Smart card Synchronous cards are


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    AND8073/D NCN6000 NCN6000. NCN6000 NCN6000/D, r14525 GRM40X7R104K25 68c11 MC68HC11 PLCC52 MC68HC811E9 GRM230Y5V106Z10 D206 DIP8 RS232 MAX232 rx led DB9RA 74HC259 motorola D213 user guide PDF

    Untitled

    Abstract: No abstract text available
    Text: Adafruit Motor Shield V2 for Arduino Created by Ladyada Last updated on 2014-03-26 11:15:07 AM EDT Guide Contents Guide Contents 2 Overview 4 FAQ 6 Install Headers & Terminals 11 Installing Standard Headers 11 Installing Terminal Blocks and more 13 Installing with Stacking Headers


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    unipolar stepper motor 5v

    Abstract: No abstract text available
    Text: Adafruit Motor Shield V2 for Arduino Created by lady ada Last updated on 2014-04-14 05:15:09 PM EDT Guide Contents Guide Contents 2 Overview 4 FAQ 7 Install Headers & Terminals 12 Installing Standard Headers 12 Installing Terminal Blocks and more 14 Installing with Stacking Headers


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    subwoofer 1000 watts amplifier

    Abstract: 12v subwoofer amp circuits 500w mosfet based pulse width modulation inverter high subwoofer 1000 watts amplifier LX1585 lx1691 350w power amplifier stereo subwoofer pcb 1722 12v class d amplifier 40W high subwoofer 100 watts amplifier
    Text: VOLUME New product guide Subwoofer Center Channel 11 Left Front LX1722 Right Front The LX1721 / LX1722 is a high performance Class-D stereo controller IC targeted for high efficiency audio requirements. Ideal for battery powered products, portable systems or space


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    LX1722 LX1721 LX1722 subwoofer 1000 watts amplifier 12v subwoofer amp circuits 500w mosfet based pulse width modulation inverter high subwoofer 1000 watts amplifier LX1585 lx1691 350w power amplifier stereo subwoofer pcb 1722 12v class d amplifier 40W high subwoofer 100 watts amplifier PDF

    MC68B21CP

    Abstract: xcm916x1cth16 transistor marking code 12W SOT-23 sg379 MC68B54P XC68HC805P18CDW mc68b50cp MC2830 NE555N CHN NE555N
    Text: SG379/D REV 7 Semiconductor Products Sector NORTH AMERICA SALES AND DISTRIBUTION PRICE LIST THIS BOOK IS IN COMPUTER SORT PRODUCT CLASSIFICATION – Please see General Information Section 1.3 EFFECTIVE DATE: JANUARY 10, 1998 General Information 1 Cross References


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    SG379/D 1N965BRL ZEN15V 1N751AS 1N967BRL ZEN18V 1N751ASRL 1N968BRL ZEN20V MC68B21CP xcm916x1cth16 transistor marking code 12W SOT-23 sg379 MC68B54P XC68HC805P18CDW mc68b50cp MC2830 NE555N CHN NE555N PDF

    BGA heatsink compressive force

    Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
    Text: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014


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    64-bit BGA heatsink compressive force BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga PDF

    logos 4012B

    Abstract: 1LB553 Rauland ETS-003 Silec Semiconductors MCP 7833 4057A transistor sr52 74c912 1TK552 74S485
    Text: L p i > « , * S E m Ic O N VOLUM E 3 INTERNATIONAL INTEGRATED CIRCUITS INDEX 5th EDITION 1985 Revised June 1985 COMPILED AND PUBLISHED BY S E M IC O N IN D E X E S L IM IT E D THE SEMICON INDEX SERIES CONSISTS OF VOLUME 1 TRANSISTOR INDEX VOLUME 2 DIODE & SCR INDEX


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    TDA1510 TDA1510A logos 4012B 1LB553 Rauland ETS-003 Silec Semiconductors MCP 7833 4057A transistor sr52 74c912 1TK552 74S485 PDF

    80500 TRANSISTOR

    Abstract: Vo 80500 TRANSISTOR HE 80500 HE 80500 TRANSISTOR CT 80500 80500+TRANSISTOR GR-900 double slug tuner varactor diode q factor measurement Silicon Power Cube
    Text: Application Note 80500: Tuning Diodes L introduction In recent years continuous development of tuning varactors - voltage controlled capacitors - together with an increased commercial and military use has led to sub­ stantial improvement in Q, reproducibility, and reliability.


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    Figure81sketches DKV6550B DVH6791, 80500 TRANSISTOR Vo 80500 TRANSISTOR HE 80500 HE 80500 TRANSISTOR CT 80500 80500+TRANSISTOR GR-900 double slug tuner varactor diode q factor measurement Silicon Power Cube PDF

    ELC-1300-25

    Abstract: 6605 SP EPD-550 EPD-660-5 SMD A1W ultraviolet sensor flame 2x430 elj-660-225 ELJ-810-248 ELC-630-13
    Text: Chips ♦ visible ♦ infrared ♦ special design AutoSelective Photodiodes ♦ ultraviolet ♦ visible ♦ infrared LEDs, SMDs in different designs ♦ visible ♦ infrared ♦ high-power ♦ high-speed Type Designation System LED Chips: L C 1234 Light emitting


    OCR Scan
    ELC-660-199 ELC-1300-25 6605 SP EPD-550 EPD-660-5 SMD A1W ultraviolet sensor flame 2x430 elj-660-225 ELJ-810-248 ELC-630-13 PDF