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    LFBGA Search Results

    LFBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UPD70F3134AF1-EN4-A Renesas Electronics Corporation 32-bit Microcontrollers, LFBGA, / Visit Renesas Electronics Corporation
    D6417709SBP100BV Renesas Electronics Corporation 32-bit Microcontrollers, LFBGA, / Visit Renesas Electronics Corporation
    UPD703131BYF1-XXX-EN4-A Renesas Electronics Corporation 32-bit Microcontrollers, LFBGA, / Visit Renesas Electronics Corporation
    UPD703134BYF1-XXX-EN4-A Renesas Electronics Corporation 32-bit Microcontrollers, LFBGA, / Visit Renesas Electronics Corporation
    UPD703132BYF1-XXX-EN4-A Renesas Electronics Corporation 32-bit Microcontrollers, LFBGA, / Visit Renesas Electronics Corporation
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    LFBGA Price and Stock

    NXP Semiconductors LFBGAMS1A

    256 PIN 1.0MM PGA SOCKET SPACER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LFBGAMS1A Bulk 1
    • 1 $251.34
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    • 100 $251.34
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    Mouser Electronics LFBGAMS1A
    • 1 $203.18
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    • 100 $203.18
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    Newark LFBGAMS1A Bulk 1
    • 1 $218.79
    • 10 $212.67
    • 100 $200.43
    • 1000 $200.43
    • 10000 $200.43
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    NXP Semiconductors LFBGAMS1A
    • 1 $180
    • 10 $180
    • 100 $180
    • 1000 $180
    • 10000 $180
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    NXP Semiconductors LFBGADAWA

    DEVELOPMENT 1.0MM SKT 416-BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LFBGADAWA Box 1
    • 1 $856.8
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    Newark LFBGADAWA Bulk 1
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    NXP Semiconductors LFBGADAWA
    • 1 $840
    • 10 $840
    • 100 $840
    • 1000 $840
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    NXP Semiconductors LFBGAMU2A

    330 PIN 1.0MM PGA SOCKET SPACER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LFBGAMU2A Bulk 1
    • 1 $171.91
    • 10 $171.91
    • 100 $171.91
    • 1000 $171.91
    • 10000 $171.91
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    Avnet Americas LFBGAMU2A Box 1
    • 1 $125.46
    • 10 $123.42
    • 100 $117.3
    • 1000 $117.3
    • 10000 $117.3
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    Mouser Electronics LFBGAMU2A
    • 1 $150.63
    • 10 $150.63
    • 100 $150.63
    • 1000 $150.63
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    Newark LFBGAMU2A Bulk 1
    • 1 $145.86
    • 10 $141.78
    • 100 $133.62
    • 1000 $133.62
    • 10000 $133.62
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    NXP Semiconductors LFBGAMU2A
    • 1 $120
    • 10 $120
    • 100 $120
    • 1000 $120
    • 10000 $120
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    NXP Semiconductors LFBGADAZA

    DEVELOPMENT 1.0MM SKT 516-BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LFBGADAZA Box 1
    • 1 $856.8
    • 10 $856.8
    • 100 $856.8
    • 1000 $856.8
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    Newark LFBGADAZA Bulk 1
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    NXP Semiconductors LFBGADAZA
    • 1 $840
    • 10 $840
    • 100 $840
    • 1000 $840
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    NXP Semiconductors LFBGAML2A

    156 PIN 1.0MM PGA SOCKET SPACER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey LFBGAML2A Bulk 1
    • 1 $131.3
    • 10 $131.3
    • 100 $131.3
    • 1000 $131.3
    • 10000 $131.3
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    Mouser Electronics LFBGAML2A
    • 1 $112.97
    • 10 $112.97
    • 100 $112.97
    • 1000 $112.97
    • 10000 $112.97
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    Newark LFBGAML2A Bulk 1
    • 1 $113.22
    • 10 $107.1
    • 100 $97.92
    • 1000 $97.92
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    Find more LFBGA price and stock on Findchips.com

    LFBGA Datasheets (9)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    LFBGA114 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA144 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA40 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA48 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA56 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA64 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA84 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA96 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA-H STATS ChipPAC Fine Pitch Ball Grid Array Original PDF

    LFBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    STA2500D

    Abstract: 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500
    Text: STA2500D Bluetooth V2.1 + EDR "Lisbon" for automotive applications Features • Based on Ericsson technology licensing baseband core (EBC) LFBGA48 (6x6x1.4mm; 0.8mm Pitch) ■ Bluetooth™ specification compliance: V2.1 + EDR (“Lisbon”) – Point-to-point, point-to-multipoint (up to 7


    Original     		PDF STA2500D LFBGA48 STA2500D 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA208 OT631-2 OT631-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area


    Original     		PDF LFBGA208: OT966-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA169 OT1024-2 OT1024-2

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316

    AD5532-2

    Abstract: AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon
    Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 mm ؋ 12 mm LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Read-Back Capability DSP/Microcontroller Compatible Serial Interface


    Original     		PDF 32-Channel, 14-Bit AD5532* 32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, AD5532-2 AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11


    Original     		PDF LFBGA141: OT1079-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13


    Original     		PDF LFBGA169: OT1024-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11


    Original     		PDF LFBGA72: OT856-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-1 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b M M C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e


    Original     		PDF LFBGA487: OT1077-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area ∅v ∅w b 1/2 e


    Original     		PDF LFBGA228: OT821-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C V e U T R P N M L K e2 J H 1/2 e G F E D C


    Original     		PDF LFBGA216: OT715-1 MO-205

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm A B D SOT893-1 ball A1 index area A E A2 A 1 detail X e1 e V T P M K H F D B C 1/2 e ∅v ∅w b M M y y1 C C A B C U e R N L e2 J 1/2 e G E C


    Original     		PDF LFBGA240: OT893-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls B D SOT1019-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 3


    Original     		PDF LFBGA208: OT1019-1

    C3744

    Abstract: No abstract text available
    Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Readback Capability DSP-/Microcontroller-Compatible Serial Interface Output Impedance


    Original     		PDF 32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, 32-Channel, C3744

    sot751

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J


    Original     		PDF LFBGA80: OT751-1 sot751

    Untitled

    Abstract: No abstract text available
    Text: MAS 3587F Short Information MAS 3587F MPEG 1/2 Layer 3 Encoder/Decoder PLQFP64 or LFBGA81 Package The MAS 3587F is a single-chip MPEG layer 3 audio encoder/decoder designed for use in portable memory-based recording/playback applications. The MAS 3587F contains the DSP engine with embedded


    Original     		PDF 3587F PLQFP64 LFBGA81 3587F encoder/de61-517-0 6251-542-1SI Oct/2000

    AD5517

    Abstract: AD5517-1 AD5517-2 AD5517-3
    Text: PRELIMINARY TECHNICAL DATA a 16-Channel 14-Bit Voltage-Output DAC AD5517-1/AD5517-2/AD5517-3* Preliminary Technical Data FEATURES High Integration: 16-channel DAC in 12x12 mm 2 LFBGA Guaranteed Monotonic Low Power, SPI TM, MICROWIRETM and DSP-Compatible 3-Wire Serial Interface


    Original     		PDF 16-Channel 14-Bit AD5517-1/AD5517-2/AD5517-3* 12x12 AD5517-1) AD5517-2) AD5517-3) -40oC AD5517 AD5517-1 AD5517-2 AD5517-3

    sot894

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors LFBGA280: plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm B D SOT894-1 A ball A1 index area A E A2 A1 detail X e1 e C 1/2 e ∅v ∅w b M M y1 C C A B C y Y W V e U T R P N M L e2


    Original     		PDF LFBGA280: OT894-1 sot894

    sot862

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D


    Original     		PDF LFBGA336: OT862-1 sot862

    LFBGA324

    Abstract: MO-205
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U


    Original     		PDF LFBGA324: OT571-1 MO-205 LFBGA324 MO-205

    MO-205

    Abstract: LFBGA180
    Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U


    Original     		PDF LFBGA180: OT697-1 MO-205 MO-205 LFBGA180

    Untitled

    Abstract: No abstract text available
    Text: 3.3V CMOS 32-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 96 balls


    OCR Scan     		PDF 32-BIT 250ps MIL-STD-883, 200pF, ALVCH32374: IDT74ALVCH32374 32-bit F96-1

    Untitled

    Abstract: No abstract text available
    Text: 3.3V CMOS 36-BIT UNIVERSAL BUS TRANS­ CEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FEATURES: - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 114 balls


    OCR Scan     		PDF 36-BIT 250ps MIL-STD-883, 200pF, ALVCH32501: IDT74ALVCH32501