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    LGA REWORK Search Results

    LGA REWORK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2350T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 20V 6.0A 35Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    LGA REWORK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE


    Original     		PDF

    eutectic 157

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter


    Original     		PDF C36000) ASTM-B-16 63Sn/37Pb

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


    Original     		PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate

    eutectic 157

    Abstract: advanced 94vo fr4
    Text: SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Website: www.bgasockets.com SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE BGA LGA ADVANCED


    Original     		PDF BGA-TECH04 eutectic 157 advanced 94vo fr4

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


    Original     		PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


    Original     		PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


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    LGA voiding

    Abstract: AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias
    Text: Application Note AN-1091 Recommended PCB Via Design for International Rectifier’s BGA and LGA Packages By Kevin Hu, International Rectifier Table of Contents Page Introduction . 2


    Original     		PDF AN-1091 AN-1028. AN-1029. LGA voiding AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    Ic 7289 bs

    Abstract: IP2003AP AN-1028 AN-1029 AN-1030 AN-1047 C3225X5R1C106KT EIA-541
    Text: NOT RECOMMENDED FOR NEW DESIGN REPLACE WITH iP2003APBF PD- 97071 iP2003PbF Synchronous Buck Multiphase Optimized LGA Power Block Integrated Power Semiconductors, Drivers & Passives Features: • • • • • • • • • Full function multiphase building block


    Original     		PDF iP2003APBF iP2003PbF iP2003PbF IRDCiP2003 iP2003A Ic 7289 bs IP2003AP AN-1028 AN-1029 AN-1030 AN-1047 C3225X5R1C106KT EIA-541

    IP2003AP

    Abstract: No abstract text available
    Text: PD-97051 iP2003APbF Synchronous Buck Multiphase Optimized LGA Power Block Features: • • • • • • • • • Integrated Power Semiconductors, Drivers & Passives Full function multiphase building block Output current 40A continuous with no derating up to


    Original     		PDF PD-97051 iP2003APbF x11mm iP2003APbF IP2003AP

    IP2003AP

    Abstract: tx2420 IP2003APBF AN-1028 AN-1030 AN-1047 C3225X5R1C106KT EIA-541 LGA rework PD-97051A
    Text: PD-97051A iP2003APbF Synchronous Buck Multiphase Optimized LGA Power Block Features: • • • • • • • • • Integrated Power Semiconductors, Drivers & Passives Full function multiphase building block Output current 40A continuous with no derating up to


    Original     		PDF PD-97051A iP2003APbF x11mm iP2003APbF IP2003AP tx2420 AN-1028 AN-1030 AN-1047 C3225X5R1C106KT EIA-541 LGA rework PD-97051A

    LGA 1207 socket F

    Abstract: pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing
    Text: SOCKET F 1207 Application Specification 114-5383 7 MAY ‘07 Rev.C 1. INTRODUCTION This specification covers the requirements for application of lever-actuated Socket F 1207 position onto printed circuit (pc) boards. These sockets accept 1207-position LGA package


    Original     		PDF 1207-position LGA 1207 socket F pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing

    LTM46XX

    Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
    Text: Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114f AN114-8 LTM46XX bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance

    BST-MAS-AN014-01

    Abstract: SMB380 ANA016 BOSCH marking code BST-BMA150-DS000-07 bma150 BOSCH cross reference bosch 5.3 BMA150 marking code bosch k line
    Text: BMA150 BMA150 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA150 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Data sheet version 1.7


    Original     		PDF BMA150 12-pin BST-BMA150-DS000-07 30-May-08 30-Oct-2008 BST-MAS-AN014-01 SMB380 ANA016 BOSCH marking code BOSCH cross reference bosch 5.3 BMA150 marking code bosch k line

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		PDF LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow

    Untitled

    Abstract: No abstract text available
    Text: Preliminary Data Sheet AKU440 Digital MEMS Microphone AKU440 Bottom Port, Digital MEMS Microphone Preliminary Data Sheet Preliminary Data Sheet Part number s AKU440 Package type 5-pin LGA bottom port Data sheet revision 0.90 Release date 13 July 2013 Document number


    Original     		PDF AKU440 DS31-0 AKU440 13Jul2013

    TAIYO PSR 4000

    Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
    Text: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600

    Untitled

    Abstract: No abstract text available
    Text: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email [email protected] • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications


    OCR Scan     		PDF CustomC36000) ASTM-B-16 63Sn/37Pb