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    LGA-16 LAND PATTERN Search Results

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    lga16 land pattern

    Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and


    Original     		TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97 PDF

    LGA16 footprint

    Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents


    Original     		TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land PDF

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


    Original     		AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework PDF

    SI8233BD-C-IS

    Abstract: SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8233BD-C-IS SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A PDF

    WBSOIC-16

    Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output


    Original     		Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 WBSOIC-16 LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS PDF

    Si8233BB-C-IS

    Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233 PDF

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale PDF

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate PDF

    SI8235

    Abstract: Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features   Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8235 Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236 PDF

    LGA land pattern

    Abstract: SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SOIC-16 SI8233AD-C-IS si8235
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 SOIC-16 LGA-14 LGA land pattern SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SI8233AD-C-IS si8235 PDF

    Si8235-BA-C-IS1

    Abstract: LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x Si8230/1/2/7 SOIC-16 Si8233/4/5/6/8 LGA-14 Si8235-BA-C-IS1 LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1 PDF

    Si8233

    Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 Si8233 LGA-24 land pattern LGA PACKAGE thermal resistance PDF

    Untitled

    Abstract: No abstract text available
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 PDF

    Si8237/8

    Abstract: SI8233BD
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 Si8237/8 SI8233BD PDF

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern PDF

    Untitled

    Abstract: No abstract text available
    Text: P R E L I M I N A RY QuietPower QPI-2L QPI-2, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-2 The QPI-2 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active


    Original     		02/04/10M PDF

    Untitled

    Abstract: No abstract text available
    Text: P R E L I M I N A RY QuietPower QPI-1 L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active


    Original     		7/03/10M PDF

    Untitled

    Abstract: No abstract text available
    Text: P R E L I M I N A RY QuietPower QPI-1 B&L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active


    Original     		9/03/10M PDF

    LGA land pattern

    Abstract: LGA resistance 12 pin lga
    Text: P R E L I M I N A RY QuietPower QPI-1L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active


    Original     		11/03/10M LGA land pattern LGA resistance 12 pin lga PDF

    Untitled

    Abstract: No abstract text available
    Text: P R E L I M I N A RY QPI-1 B&L QPI-1: 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active filtering provides superior differential attenuation


    Original     		48Vdc, 36-76Vdc) 7/03/10M PDF

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32 PDF

    photodiode dvd cd

    Abstract: photodetector IC dvd ic photodetector DVD PDIC dvd cd dvd laser pickup sony CD Laser pickup CXA2676GA PDIC dvd cd sony photodiode dvd cd photodetector
    Text: Optical Pickup Chipset with CD/DVD Recording Photodetector IC PDIC Supports High-Speed Writing to both CD and DVD Media CXA2677GA CXA2676GA The signal processing required for DVD is far more complex than that for CD. Sony has now developed an optical pickup chipset, the


    Original     		CXA2677GA CXA2676GA CXA2677GA CXA2676GA, 52-speed, CXA2676GA photodiode dvd cd photodetector IC dvd ic photodetector DVD PDIC dvd cd dvd laser pickup sony CD Laser pickup PDIC dvd cd sony photodiode dvd cd photodetector PDF

    MMA7450L

    Abstract: MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers
    Text: Document Number: MMA7450L Rev 2, 7/2007 Freescale Semiconductor Technical Data ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer The MMA7450L is a Digital Output I2C/SPI , low power, low profile capacitive micromachined accelerometer featuring signal conditioning, a low


    Original     		MMA7450L MMA7450L MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers PDF

    MARKING T6C

    Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
    Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change


    Original     		PX10051EJ35V0TN G0706 MARKING T6C lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin PDF