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    MAXIM PACKAGE MARKING Search Results

    MAXIM PACKAGE MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    MAXIM PACKAGE MARKING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    maxim CODE TOP MARKING

    Abstract: maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations
    Text: 1 Maxim Integrated Products Assembly and Packaging Group Application Notes Wafer-Level Ultra-Chip-Scale Package 1.0 Introduction to Ultra-Chip-Scale Package UCSP The packaging technology in the Ultra-Chip-Scale Package (UCSP) enables the integrated circuit


    Original     		enhan/198 maxim CODE TOP MARKING maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations PDF

    LT1460BCS3-10

    Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D


    Original     		20-Lead 20-Lead 28-Lead LT1613CS5 LT1615CS5 LT1615CS5-1 LT1617CS5 LT1617CS5-1 LT1761ES5-1 LT1761ES5-2 LT1460BCS3-10 marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS PDF

    sumitomo g770

    Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
    Text: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package


    Original     		DS2431 1024-Bit DS2432 DS28E01-100 com/an4132 AN4132, APP4132, Appnote4132, sumitomo g770 G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo PDF

    sumitomo g770

    Abstract: SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING
    Text: Maxim > App Notes > 1-Wire Devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electro-mechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment Methods for the Electro-Mechanical SFN Package


    Original     		com/an4132 DS2431: DS2432: DS28E01-100: AN4132, APP4132, Appnote4132, sumitomo g770 SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING PDF

    AN3397

    Abstract: marking pbsn usop recommended land pattern for soic 8pin 50K potentiometer maxim package marking APP3397 DS1804 118MIL potentiometer with DIP package
    Text: Maxim/Dallas > App Notes > AMPLIFIER AND COMPARATOR CIRCUITS WIRELESS, RF, AND CABLE DIGITAL POTENTIOMETERS Nov 11, 2004 Keywords: DS1804, digital potentiometer APPLICATION NOTE 3397 Clarification of DS1804 Ordering Information and Package Marking The DS1804 digital potentiometer is available in a wide variety of types, options, and package configurations.


    Original     		DS1804, DS1804 DS1804. 15-ball com/an3397 DS1804: AN3397, APP3397, AN3397 marking pbsn usop recommended land pattern for soic 8pin 50K potentiometer maxim package marking APP3397 118MIL potentiometer with DIP package PDF

    maxim CODE TOP MARKING

    Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
    Text: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and


    Original     		DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code PDF

    117450

    Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP


    Original     		20-Lead 20-Lead O-220 117450 TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83 PDF

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS BAS 16-02W Silicon Sw itching Diode Prelim inary data • For high-speed switching applications Type Marking Ordering Code Pin Configuration Package BAS 16-02W 3 Q 62702-A1239 1=A SCD-80 2 =C Maxim um Ratings Param eter Sym bol Diode reverse voltage


    OCR Scan     		6-02W 62702-A1239 SCD-80 100ns, PDF

    SMD marking Z12

    Abstract: marking CM smd Z12 Z33 SMD z39 smd bidirectional zener diodes zener smd marking 51 CMZ30 zener smd marking smd z13
    Text: • CM Z12 Series SMD Package Appearance Maxim um Ratings Characteristic Symbol Rating Unit Power Dissipation P 2 W Junction Temperature Tj 150 Storage Temperature Tstg -4 0 to 150 •c •c = 3^ I Zener Characteristics ¿ener impedance Measurement rd (O)


    OCR Scan     		CMZM16 SMD marking Z12 marking CM smd Z12 Z33 SMD z39 smd bidirectional zener diodes zener smd marking 51 CMZ30 zener smd marking smd z13 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product specification 1SV247 Features Very small-sized package facilitates high-density mounting and permits 1SV247-applied equipment to be made smaller. Small interterminal capacitance C=0.23pF typ . Small forward series resistance (rs=5 typ). Absolute Maxim um Ratings Ta = 25


    Original     		1SV247 1SV247-applied PDF

    maxim package marking

    Abstract: MARKING A3 1SS300
    Text: Diodes SMD Type ULTRA HIGH SPEED SWITCHING APPLICATIONS 1SS300 Features Small package Low forward voltage :VF 3 = 0.92 V(Typ) Fast reverse recovery time Small total capacitance :trr = 1.6 ns (Typ) :CT = 2.2 pF(Typ) Absolute Maxim um Ratings Ta = 25 Param eter


    Original     		1SS300 maxim package marking MARKING A3 1SS300 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product specification 1SS300 Features Small package Low forward voltage :VF 3 = 0.92 V(Typ) Fast reverse recovery time Small total capacitance :trr = 1.6 ns (Typ) :CT = 2.2 pF(Typ) Absolute Maxim um Ratings Ta = 25 Param eter Sym bol Rating Unit V RM 85 V


    Original     		1SS300 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product specification 1SS373 SOD-523 +0.05 0.3-0.05 Unit: mm 1.2 +0.1 -0.1 Features +0.05 0.8-0.05 Small Package + +0.1 0.6-0.1 - Low forward voltage :VF = 0.23V TYP. IF = 5mA +0.1 1.6-0.1 +0.05 0.1-0.02 0.07max 0.77max Absolute Maxim um Ratings Ta = 25 Characteristic


    Original     		1SS373 OD-523 07max 77max PDF

    center tap voltage transformer

    Abstract: EPC3115S-3
    Text: Push-Pull Low Power Transformer EPC3115S-X ELECTRONICS INC. • Designed for use with Maxim Max253 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 350 KHz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3115S-X Max253 EPC3115S-1 EPC3115S-2 EPC3115S-3 EPC3115S-4 EPC3115S-5 EPC3115S-6 EPC3115S-7 EPC3115S-8 center tap voltage transformer EPC3115S-3 PDF

    Untitled

    Abstract: No abstract text available
    Text: Push-Pull Low Power Transformer ELECTRONICS INC. EPC3115S-X • Designed for use with Maxim Max253 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • 8 Pin SOIC PCMCIA Package • Very Low Core Loss


    Original     		EPC3115S-X Max253 EPC3115S-1 EPC3115S-2 EPC3115S-3 EPC3115S-4 EPC3115S EPC3115S-3/-4 CSC3115S PDF

    Untitled

    Abstract: No abstract text available
    Text: Push-Pull Low Power Transformer ELECTRONICS INC. EPC3117S-X • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • 8 Pin SOIC PCMCIA Package • Very Low Core Loss


    Original     		EPC3117S-X Max845 EPC3117S-3 EPC3117S EPC3117S-3/-4 CSC3117S PDF

    center tap voltage transformer

    Abstract: No abstract text available
    Text: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3117S-X Max845 EPC3117S-1 EPC3117S-2 EPC3117S-3 EPC3117S-4 EPC3117S-5 EPC3117S-6 EPC3117S-7 EPC3117S-8 center tap voltage transformer PDF

    Untitled

    Abstract: No abstract text available
    Text: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3117S-X Max845 EPC3117S-1 EPC3117S-2 EPC3117S-3 EPC3117S-4 EPC3117S-5 EPC3117S-6 EPC3117S-7 EPC3117S-8 PDF

    center tap transformer 11

    Abstract: center tap voltage transformer
    Text: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3117S-X Max845 EPC3117S-1 EPC3117S-2 EPC3117S-3 EPC3117S-4 EPC3117S-5 EPC3117S-6 EPC3117S-7 EPC3117S-8 center tap transformer 11 center tap voltage transformer PDF

    epc3115s-3

    Abstract: center tap voltage transformer
    Text: Push-Pull Low Power Transformer EPC3115S-X ELECTRONICS INC. • Designed for use with Maxim Max253/Max3535E • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 350 KHz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3115S-X Max253/Max3535E EPC3115S-1 EPC3115S-2 EPC3115S-3 EPC3115S-4 EPC3115S-5 EPC3115S-6 EPC3115S-7 EPC3115S-8 epc3115s-3 center tap voltage transformer PDF

    maxim package marking

    Abstract: maxim package "marking" 1ss373
    Text: Diodes SMD Type HIGH SPEED SWITCHING APPLICATION 1SS373 SOD-523 +0.05 0.3-0.05 Unit: mm 1.2 +0.1 -0.1 Features +0.05 0.8-0.05 Small Package + +0.1 0.6-0.1 - Low forward voltage :VF = 0.23V TYP. IF = 5mA +0.1 1.6-0.1 +0.05 0.1-0.02 0.07max 0.77max Absolute Maxim um Ratings Ta = 25


    Original     		1SS373 OD-523 07max 77max maxim package marking maxim package "marking" 1ss373 PDF

    center tap voltage transformer

    Abstract: No abstract text available
    Text: Push-Pull Low Power Transformer EPC3117S-X ELECTRONICS INC. • Designed for use with Maxim Max845 • Used in SMPS Push-Pull Topology • UL 94V-0 Recognized Components • UL 1446 Class B Insulation System • Switching Frequency : 250 KHz-1 Mhz • 8 Pin SOIC PCMCIA Package


    Original     		EPC3117S-X Max845 EPC3117S-1 EPC3117S-2 EPC3117S-3 EPC3117S-4 EPC3117S-5 EPC3117S-6 EPC3117S-7 EPC3117S-8 center tap voltage transformer PDF

    2SC1621

    Abstract: transistor marking 9D
    Text: SEC SILICON TRANSISTOR 2SC1621 EIJ BKmmvm » HIGH SPEED SW ITCHING NPN SILICON EPITAXIAL TRANSISTOR M IN I MOLD FEATURE PACKAGE DIMENSIONS in millimeters • High Speed : t stg = 2 0 ns M A X . 2.8 ±0.2 -8 do 0.65 ±8:j 1.5 +I o ABSOLUTE MAXIM UM RATINGS


    OCR Scan     		2SC1621 NECTOKJ22686 TC-1642 2SC1621 transistor marking 9D PDF

    ic ir 2103

    Abstract: 2SC4175 MARKING B2 TRANSISTOR MARKING 3D
    Text: DATA SHEET SILICON TRANSISTOR - - 2SC4175 'I „ • »' HIGH SPEED SWITCHING NPN SILICON EPITAXIALTRANSISTOR FEATURE PACKAGE DIMENSIONS • in m illim eters High Speed : t stg = 20 ns M A X . 2.1 + 0.1 1.25 + 0.1 ABSOLUTE MAXIM UM RATINGS M axim um Voltages and Current T a = 25 °C


    OCR Scan     		2SC4175 1987M ic ir 2103 2SC4175 MARKING B2 TRANSISTOR MARKING 3D PDF