Untitled
Abstract: No abstract text available
Text: DIP Sockets ELECTRONICS flOK McKenzie Socket Division McKenzie Delivers Choices!! • Largest selection of Contact Options • Open or Closed frame • Disposable Plastic Pin Carrier Option • True Hi-Temp Options - IR and Vapor Phase compatible • End-to-End and Side-to-Side stackable
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mckenzie
Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
Text: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS
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CPPDC300C-118-
DC300P-090-FR50
DC600P-118-FR50
mckenzie
valox 420 salt
MIL-P-13949
DC600P-118-FR50
McKenzie socket division pga
zytel fr50
mil-m-24519 molding plastics
McKenzie technology sip
zytel fr 72
ASTM-B487-79
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McKenzie socket division
Abstract: No abstract text available
Text: DIP Sockets ELECTRONICS BMC McKenzie Socket Division McKenzie Delivers Choices!! • Largest selection of Contact Options B • Open or Closed frame • Disposable Plastic Pin Carrier Option • True Hi-Temp Options - IR and Vapor Phase compatible • End-to-End and Side-to-Side stackable
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JL222
McKenzie socket division
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Untitled
Abstract: No abstract text available
Text: Intel P6 Socket EL ECTRONI CS tHK McKenzie Socket Division • The socket body is injection molded PPS and features tabs to which a heat sink can be attached via a heat sink clip. •IDO TYP • The dimensions and placement of the heatsink : tabs match those detailed in Intel’s P6 socket
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Alloy172.
MIL-T-10727,
QQ-N-290.
MIL-G-45204,
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McKenzie socket division
Abstract: No abstract text available
Text: Specialty DIP Sockets ELECTRONICS MK McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environm ents • Designed to fit M cKenzie Technology's standard open or closed fram e DIP sockets DIP INSULATOR CENTERS THICKNESS
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DC300P-090-FR50
DC600P-118-FR50
McKenzie socket division
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Untitled
Abstract: No abstract text available
Text: e l e c t r o n i c Wire Jumpers s BMC McKenzie Socket Division Insulated and Bare Wire Jumpers • Available bare or with your choice of two insulation materials • PVC Insulator suitable for jumpering socket terminals • Teflon insulation for direct soldering to PCB or other Hi-Temp applications
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125-XXX-24
175-XXX-24
250-XXX-24
BR36G
BR36GR
BR16G
BR26G
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Untitled
Abstract: No abstract text available
Text: SIP Headers ELECTRONICS fflOK McKenzie Socket Division SST — Male to Male Header Options .0 1 8 0.46 .166 (*.22) i .018 — (0.46) Specify 884S PTH = Plating/Material 10p" Gold/Brass .024 ± .003 Specify 886S PTH = Plating/Material 10p" Gold/Brass .024 ± .003
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Untitled
Abstract: No abstract text available
Text: Pressfit Sockets ELECTRONI CS MOK McKenzie Socket Division Features • Pressfit eliminates soldering • Ideal for backplane applications • Retention force exceeds 12 pounds in .039" 0,99 plated Thru-Hole (PTH) • Sizes for .062" (1,57) and .125" (3,18) PCB thickness
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DPF320-970E-!
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Untitled
Abstract: No abstract text available
Text: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS
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Gold/200p"
old/200
old/10pâ
old/200p
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011B
Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
Text: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory
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CONTACT-160B
011B
MIL-P-13949
MIL-STD-109
Brass per QQ-B-626, Alloy 360
McKenzie
IEC-68-2-14
410B
zytel fr50
HT2004
dip molding machine
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Untitled
Abstract: No abstract text available
Text: Surface Mount PLCC Sockets electronics HOK McKenzie Socket Division | r .060 TYP -T p l—i- a ,5 2 .175 4.45) Optional Alignment Peg C160n*J. TRAILER 11 PCB Pad Layout 060 TYP (1.52) • Center pad provides area for pick-and-place (40Dnn). LEADER -6.39 HIM.-(160rtn>
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C160n
40Dnn)
160rtn>
S011b44
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Untitled
Abstract: No abstract text available
Text: Extended SIP Headers E L E C T R O N I C S McKenzie Socket Division SHS — Extended Header Options .030 — 0.76 .170 (4.32) _1 .600 .315 (15.24) (8 .00) .021 (0 ,53) .115 (2 .92) SST: Male-to-Male SIP Headers Specify Plating Specify Plating Specify Plating
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Untitled
Abstract: No abstract text available
Text: .070" Progression Shrink DIP e l e c t r o n i c s OBK McKenzie Socket Division Insulator Options -c - - T I fO D G tl -LI A B loooooooooooooooooooooooooooooooc J L .070 0 .7 8 TYP OPEN FRAME Features • High Density .070" 1,78 ) progression
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McKenzie socket division
Abstract: No abstract text available
Text: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold
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Gold/200
Gold/10p"
Gold/200p"
Gold/10p
McKenzie socket division
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ASTM-B487-79
Abstract: McKenzie socket division pga b3910 McKenzie socket division valox 420 salt McKenzie 7344-A McKenzie technology sip 157B C130
Text: Ultra Low Profile DIP Sockets E L E C T R O N I C S MX McKenzie Socket Division Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking ULTRA LOW PROFILE OPTIONS
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Gold/200^
Tin/200ti
ASTM-B487-79
McKenzie socket division pga
b3910
McKenzie socket division
valox 420 salt
McKenzie
7344-A
McKenzie technology sip
157B
C130
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QQ-B-750
Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
Text: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force
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Gold/200
Gold/200^
Gold/10
QQ-B-750
alloy 25 BeCu
McKenzie technology sip gold
400B
401B
402B
403B
410B
411B
ASTM-B487-79
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Untitled
Abstract: No abstract text available
Text: SIP Sockets E L E C T R O N I C S BMC McKenzie Socket Division Features • Hi-Temp Options — IR and Vapor Phase Compatible • X and Y Stackable • Disposable Plastic Pin Carrier PPC System Option • Hi-Rel multifinger contact • Insulators are notched for convenient cut down
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McKenzie
Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
Text: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing
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Untitled
Abstract: No abstract text available
Text: DIP Headers E L E C T R O N I C S OMK McKenzie Socket Division Insulator Options Specify Plating Specify Plating 922H 10p" Gold 935H 10p” Gold PTH = .027 ± .003 PTH = .027 ± .003 OPEN FRAME .021 0,53 r TYP .030 — (0.76) l TYP f .600 I (15,24) .315 1
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94-VO
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MIL-T-10727
Abstract: SN200 AU015 McKenzie
Text: BERG MicroShunts E L E C T R O N I C S fMK McKenzie Socket Division MICROSHUNT™ BOX CONTACT ¡e T=e3 .153 ( 3 ,89 ) D .193 ( 4 ,90 ) u .0 5 6 — 1 ( 1,42 ) MICROSHUNT™ BLOCK .230" (5,84) HIGH (W*)“ How To Order .230 y. .200 ^ (V » ) OJJ) I-.1 0 0
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Au015
Au030
30p750
Sn200
SN200
AU015
Au030
MIL-T-10727
McKenzie
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Untitled
Abstract: No abstract text available
Text: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell
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Gold/200nâ
Tin/200p"
Gold/200p"
Gold/10M
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Untitled
Abstract: No abstract text available
Text: .025" Post Extended Headers e l e c t r o n i c s BMC McKenzie Socket Division Features PHS-H1 Single row Extended header • Ideal board-to-board interconnection • Tin or Gold Plating • E xtended headers a re also available in 2 m m progression • Available up to 4 0 positions in single
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100-J
10pHGold/50
Tin/50M"
Gold/50
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BERG strip 40 pin single row
Abstract: E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79
Text: SIP Sockets E L E C T R O N I C S flMK McKenzie Socket Division SHORTER SOLDER TAIL — NO TRIMMING .1 6 5 4 ,1 9 , .265 1 (6.73) .100 .0 2 0 - OUR MOST POPULAR CONTACT .165 (4,19) .230 (5,84) .030 (0,76) .020 — (0,51) (2 .5 4 ) (0.51) f .290 (7.37) .125
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Tin/200M"
Gold/200M"
Gold/10M"
35nts
BERG strip 40 pin single row
E 877 11 94V-0
ASTM-B567
BERG 6 pin dual row
ASTM-B487-79
solder tail sip socket
McKenzie technology sip gold
TEFZEL
McKenzie technology pga
ASTM-A-754-79
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McKenzie socket division
Abstract: No abstract text available
Text: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions
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Gold/200
Gold/10
Gold/200n,
Tin/200p"
McKenzie socket division
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