XZ1002-BD
Abstract: XZ1002-BD-EV1 mmic core chip TA10C XZ100
Text: XZ1002-BD 8.5-11.0 GHz GaAs MMIC Core Chip Rev 11-Nov-10 Features General Description The XZ1002-BD is a highly integrated dual path transmit/receive 3 port core chip. It is designed for applications operating within the 8.5 to 11.0 GHz range. The core consists of integrated transmit/receive
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XZ1002-BD
11-Nov-10
MIL-STD-883
XZ1002-BD
XZ1002-BD-EV1
mmic core chip
TA10C
XZ100
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XZ1002-BD-000V
Abstract: xz1002-bd mmic core chip Z1002-BD XZ100 1521e Mimix Broadband m11
Text: 8.5-11.0 GHz GaAs MMIC Core Chip Z1002-BD March 2009 - Rev 11-Mar-09 Features General Description The XZ1002-BD is a highly integrated dual path transmit/receive 3 port core chip. It is designed for applications operating within the 8.5 to 11.0 GHz range. The core consists of integrated transmit/receive
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11-Mar-09
Z1002-BD
XZ1002-BD
MIL-STD-883
XZ1002-BD-000V
XZ1002-BD-000V
xz1002-bd
mmic core chip
XZ100
1521e
Mimix Broadband m11
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • +5dBm Input Third Order Intercept Point (IIP3) • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5142XZ
SMM5142XZ
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Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE - ACD SERIES ACD SERIES DOWNCONVERTER MMIC FOR CATV Preliminary Rev 1 Introduction The ACD downconverter MMIC is designed to be used as the second downconverter in double conversion cable television tuners. The chip, fabricated in gallium arsenide, incorporates a high degree of integration, which
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H5C2T
Abstract: VJ0805U osc-54
Text: APPLICATION NOTE - ACD SERIES ACD SERIES DOWNCONVERTER MMIC FOR CATV Preliminary Rev 1 Introduction The ACD downconverter MMIC is designed to be used as the second downconverter in double conversion cable television tuners. The chip, fabricated in gallium arsenide, incorporates a high degree of integration, which
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x-band mmic core chip
Abstract: x-band mmic phase shifter using lumped elements mmic core chip x-band microwave fet X band 5-bit phase shifter X-Band T/R digital phase shifter X band attenuator mmic A
Text: A GaAs X-Band Multifunction Control MMIC Using the MSAG Process Abstract This paper describes efforts to achieve first pass design success for an X-band control MMIC consisting of multi-bit phase shifter, multi-bit attenuator, amplifier and serial-to-parallel
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: ES/SMM5724XZ Preliminary 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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PDF
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
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Untitled
Abstract: No abstract text available
Text: ES/SMM5143XZ Preliminary 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm
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ES/SMM5143XZ
30GHz
-12dB
24dBm
ES/SMM5143XZ
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PDF
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JEP95 MS-028
Abstract: No abstract text available
Text: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
JEP95 MS-028
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