NCSM Search Results
NCSM Price and Stock
HUBER+SUHNER 33_TNC-SMA-50-1-1--_UE33_TNC-SMA-50-1/1--_UE |
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33_TNC-SMA-50-1-1--_UE | Bulk | 8 | 1 |
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HUBER+SUHNER 31_BNC-SMB-50-2-1--_UE31_BNC-SMB-50-2/1--_UE |
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31_BNC-SMB-50-2-1--_UE | Bulk | 5 | 1 |
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HUBER+SUHNER 33_BNC-SMA-50-1-1--_UE33_BNC-SMA-50-1/1--_UE |
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33_BNC-SMA-50-1-1--_UE | Bulk | 2 | 1 |
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HUBER+SUHNER 34_BNC-SMA-50-2-1--_UE34_BNC-SMA-50-2/1--_UE |
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34_BNC-SMA-50-2-1--_UE | Bulk | 1 |
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HUBER+SUHNER 32_BNC-SMA-50-1-1--_UE32_BNC-SMA-50-1/1--_UE |
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32_BNC-SMA-50-1-1--_UE | Bulk | 1 |
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NCSM Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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TI BINARY DATE CODE
Abstract: BQ20Z80-V101 BQ2940
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bq20z80-V101 SLUS625C bq29312 TI BINARY DATE CODE BQ2940 | |
LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
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AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework | |
LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
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AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale | |
PL10SMS-12C
Abstract: 1402ma
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PL10SMS-12C 3-14Vin, 010in) PL10SMS-12C 1402ma | |
PL20S-W12C
Abstract: w12c 14BTYP Fuse 250V T 2,5A PL20SMS-W12C
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PL20S-W12C, PL20SMS-W12C 0-14Vin, PL20S-W12C PL20S-W12C w12c 14BTYP Fuse 250V T 2,5A PL20SMS-W12C | |
9416A
Abstract: No abstract text available
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PL16S-12C, PL16SMS-12C 0-14Vin, PL16S-12C PL16S 010in) PL16SMS 9416A | |
AMD-756
Abstract: AMD-756AC AMD-756AC B Date Code c AMD 1998 AMD-751 Northbridge AMD756AC
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AMD-756 AMD-751TM AMD-756TM AMD-756 AMD-756AC AMD-756AC B Date Code c AMD 1998 AMD-751 Northbridge AMD756AC | |
VPOL16A-12-SIP
Abstract: No abstract text available
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VPOL16A-12-SIP UL/C-UL60950 VPOL16A-12-SIP | |
soc fuse
Abstract: SLUS681
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bq20z80-V102 SLUS681 bq29312A soc fuse SLUS681 | |
LGA voiding
Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
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AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D | |
BQ20Z80-V101
Abstract: No abstract text available
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bq20z80-V101 SLUS625D bq29312A | |
TDA 11136
Abstract: SLUA379 SLUU265A bq20z70-V150 SLUA359 SLUA372 0x2673 TDA 1343 code BQ voltage protection for n cell lion battery SBS 15 battery
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bq20z70-V150 bq29330 bq20z75 SLUU265A TDA 11136 SLUA379 SLUU265A SLUA359 SLUA372 0x2673 TDA 1343 code BQ voltage protection for n cell lion battery SBS 15 battery | |
TDA 12110
Abstract: TDA 3116 BQ20Z65-R1
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bq20z60-R1/bq20z65-R1 SLUU386 SLUU386 TDA 12110 TDA 3116 BQ20Z65-R1 | |
BQ20Z80-V101
Abstract: No abstract text available
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bq20z80-V101 SLUS625D bq29312A | |
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AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
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AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate | |
HUmiseal 1B73
Abstract: CLD-AP25 Dow Corning 1-2577 HUmiseal Dow corning 3-1953 nc-smq92 SN62 PB36 ag2 pliobond 1B73 NC-SMQ92J
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-AP25 CLD-AP25 HUmiseal 1B73 Dow Corning 1-2577 HUmiseal Dow corning 3-1953 nc-smq92 SN62 PB36 ag2 pliobond 1B73 NC-SMQ92J | |
NC-SMQ92J solder paste
Abstract: NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram
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CLD-AP36 NC-SMQ92J solder paste NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram | |
HUmiseal 1B73
Abstract: HUmiseal NC-SMQ92J CLD-AP25 1b73 Solder Paste, Indium, Type 3 cree led Cree optics hydrocarbon polymeric arctic silver alumina
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CLD-AP25 HUmiseal 1B73 HUmiseal NC-SMQ92J 1b73 Solder Paste, Indium, Type 3 cree led Cree optics hydrocarbon polymeric arctic silver alumina | |
pliobond 20
Abstract: Dow Corning 1-2577 1B73 Dow corning 3-1953 HUmiseal HUmiseal 1B73 Loctite 4105 NC-SMQ92J Loctite sumo radio shack led
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XL4550xx-xx-xxxx XR7090xx-xx-xxxx CLD-AP16 pliobond 20 Dow Corning 1-2577 1B73 Dow corning 3-1953 HUmiseal HUmiseal 1B73 Loctite 4105 NC-SMQ92J Loctite sumo radio shack led | |
D2061 transistor
Abstract: B1ABCF000176 C1BA00000407 r2003 TRANSISTOR c5536 C1BB00000732 C2068 B0BC7R500001 B1BACD000018 B1AACF000064
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MD0604120A3 SA-VK650GCP SA-VK650GC/GN/GS/GCS/GCT-S, MD0604118C3] SC-VK650 SA-VK650 SB-VK650 SB-WVK650 0A072 F2G0J470A031 D2061 transistor B1ABCF000176 C1BA00000407 r2003 TRANSISTOR c5536 C1BB00000732 C2068 B0BC7R500001 B1BACD000018 B1AACF000064 | |
Lead Free reflow soldering profile BGA
Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
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EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181 | |
KVM SWITCH schematic
Abstract: iC-XU-PDIP22 motortreiber ic-xu KVM SWITCH IC
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OCR Scan |
D-55294 KVM SWITCH schematic iC-XU-PDIP22 motortreiber ic-xu KVM SWITCH IC | |
Untitled
Abstract: No abstract text available
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OCR Scan |
LAN83C175 LAN83C175 10Base-T 10Mbps | |
Untitled
Abstract: No abstract text available
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OCR Scan |
CD54/74AC373, CD54/74AC533 CD54/74ACT373, CD54/74ACT533 CD54/74AC/ACT373 CD54/74AC/ACT533 92CS-4242I 54/74AC373 CD54/74ACT373 |