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    NEC STACKED MCP Search Results

    NEC STACKED MCP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54242-808202350LF Amphenol Communications Solutions BERGSTIK STACKING Visit Amphenol Communications Solutions
    54112-101260800LF Amphenol Communications Solutions BERGSTIK STACKING Visit Amphenol Communications Solutions
    54112-801300800LF Amphenol Communications Solutions BERGSTIK STACKING Visit Amphenol Communications Solutions
    54112-802201300LF Amphenol Communications Solutions BERGSTIK STACKING Visit Amphenol Communications Solutions
    U95A100J104 Amphenol Communications Solutions QSFP28 STACKED CONN ASSY Visit Amphenol Communications Solutions

    NEC STACKED MCP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC semiconductor

    Abstract: NEC stacked MCP MC-242442 MC-242443 MC-242444 MC-242452 MC-242453 MC-242454 semiconductor quality assurance office organization
    Text: MC-2424xx Memory Description Features Stacked Multi-Chip Package with 32 Mb Flash Memory and 16 Mb Mobile-Specified RAM The MC-2424xx includes 32 Mb of dual-operation flash memory and 16 Mb of mobilespecified RAM in a single multi-chip package MCP . Memory Type


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    PDF MC-2424xx MC-2424xx MC-242442: MC-242452: MC-242443: MC-242453: MC-242444: MC-242454: 77xpressly 2002/Printed NEC semiconductor NEC stacked MCP MC-242442 MC-242443 MC-242444 MC-242452 MC-242453 MC-242454 semiconductor quality assurance office organization

    NEC stacked MCP

    Abstract: NEC MCP SRAM FLASH
    Text: MC-2222xx Memory Description Features Stacked Multi-Chip Package with 32 Mb Flash Memory and Low-Power SRAM The MC-2222xx includes 32 Mb of dual-operation flash memory and 4 Mb or 8 Mb of SRAM in a single multi-chip package MCP . Memory Type Flash Memory


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    PDF MC-2222xx MC-2222xx MC-222242A: MC-222262: MC-222243A: MC-222263: MC-222244A: MC-222264: 2002/Printed M16013EU1V0PB00 NEC stacked MCP NEC MCP SRAM FLASH

    AM 5888

    Abstract: SAMSUNG mcp Reliability SAMSUNG MCP PD23C32000A B12 nec diode cypress flash 370 SUNRISE TSOP 12 20 a85x E40/16/12 pd442
    Text: Through the latest technological advancements, we're developing new memory products to meet present and future needs. NEC Electronics is a market leader in memory products, continuously delivering products with the latest cutting-edge technology. Today, a new demand is


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    PDF M16000EJEV0SG00 AM 5888 SAMSUNG mcp Reliability SAMSUNG MCP PD23C32000A B12 nec diode cypress flash 370 SUNRISE TSOP 12 20 a85x E40/16/12 pd442

    NEC stacked MCP 1999

    Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
    Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a


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    FW7362

    Abstract: AM 5888 pittman DC Motor FW7362/15 power window motor 12v 3 phase motor soft starter circuit pittman power window motor pittman step Motor Dc motor power window circuits
    Text: User’s Manual Low-Voltage Starter Kit For Motor Control Document No. U18220EE1V0UM00 Date Published June 2006 NEC Electronics Corporation 2006 Printed in Germany CAUTION This is a Test- and Measurement equipment with possibility to be significantly altered by user through hardware enhancements/modifications


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    PDF U18220EE1V0UM00 89/336/EEC EEDT-ST-0005-10 FW7362 AM 5888 pittman DC Motor FW7362/15 power window motor 12v 3 phase motor soft starter circuit pittman power window motor pittman step Motor Dc motor power window circuits

    tc358720xbg

    Abstract: TC358720 toshiba tb6560 tc3587 TB6560FG TB6560HQ MDDI tb6560 TC35890XBG microcontroller sony
    Text: EYE 04 April 2006 TOSHIBA SEMICONDUCTOR BULLETIN EYE VOLUME 165 CONTENTS INFORMATION “COSMORAM Rev. 4” Common Pseudo SRAM Specifications for Mobile Devices .4 NEC Electronics, Sony, and Toshiba Announce Joint Development of


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    PDF 45-nanometer tc358720xbg TC358720 toshiba tb6560 tc3587 TB6560FG TB6560HQ MDDI tb6560 TC35890XBG microcontroller sony

    NEC stacked MCP

    Abstract: MC-22222361F9-D80X-CD5 MC-22222361F9-E85X-CD5 NEC MCP SRAM FLASH
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-22222361-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 64M-BIT PAGE MODE FLASH MEMORY AND 8M-BIT SRAM Description The MC-22222361-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-22222361-X 64M-BIT MC-22222361-X 85-pin -D80X -E85X NEC stacked MCP MC-22222361F9-D80X-CD5 MC-22222361F9-E85X-CD5 NEC MCP SRAM FLASH

    MC-222263F9-B85X-BT3

    Abstract: MC-222263-X NEC MCP SRAM FLASH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222263-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 8M-BIT SRAM Description The MC-222263-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 8,388,608 bits (BYTE mode : 1,048,576 words by


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    PDF MC-222263-X 32M-BIT MC-222263-X 77-pin MC-222263F9-B85X-BT3 NEC MCP SRAM FLASH

    MC-222264F9-B85X-BT3

    Abstract: MC-222264-X
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222264-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 8M-BIT SRAM Description The MC-222264-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 8,388,608 bits (BYTE mode : 1,048,576 words by


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    PDF MC-222264-X 32M-BIT MC-222264-X 77-pin MC-222264F9-B85X-BT3

    MC-222242AF9-B85X-BT3

    Abstract: MC-222242A-X M14908EJ4V0DS NEC MCP SRAM FLASH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222242A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222242A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) Flash Memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222242A-X 32M-BIT MC-222242A-X 77-pin MC-222242AF9-B85X-BT3 M14908EJ4V0DS NEC MCP SRAM FLASH

    MC-222252AF9-B85X-BT3

    Abstract: MC-222252A-X NEC MCP SRAM FLASH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222252A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222252A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) Flash Memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222252A-X 32M-BIT MC-222252A-X 77-pin MC-222252AF9-B85X-BT3 NEC MCP SRAM FLASH

    MC-222243AF9-B85X-BT3

    Abstract: MC-222243A-X NEC MCP SRAM FLASH M15029E
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222243A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222243A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222243A-X 32M-BIT MC-222243A-X 77-pin MC-222243AF9-B85X-BT3 NEC MCP SRAM FLASH M15029E

    MC-222274F9-B85X-BT3

    Abstract: MC-222274-X NEC MCP SRAM FLASH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222274-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 8M-BIT SRAM Description The MC-222274-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 8,388,608 bits (BYTE mode : 1,048,576 words by


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    PDF MC-222274-X 32M-BIT MC-222274-X 77-pin MC-222274F9-B85X-BT3 NEC MCP SRAM FLASH

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-22222361-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 64M-BIT PAGE MODE FLASH MEMORY AND 8M-BIT SRAM Description The MC-22222361-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-22222361-X 64M-BIT MC-22222361-X 85-pin -D80X -E85X

    M1528

    Abstract: MC-222253AF9-B85X-BT3 MC-222253A-X NEC MCP SRAM FLASH
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222253A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222253A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222253A-X 32M-BIT MC-222253A-X 77-pin M1528 MC-222253AF9-B85X-BT3 NEC MCP SRAM FLASH

    M1531

    Abstract: MC-222244AF9-B85X-BT3 MC-222244A-X
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222244A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222244A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222244A-X 32M-BIT MC-222244A-X 77-pin M1531 MC-222244AF9-B85X-BT3

    MC-222273F9-B85X-BT3

    Abstract: MC-222273-X
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222273-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 8M-BIT SRAM Description The MC-222273-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 8,388,608 bits (BYTE mode : 1,048,576 words by


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    PDF MC-222273-X 32M-BIT MC-222273-X 77-pin MC-222273F9-B85X-BT3

    MC-22212361F9-D80X-CD5

    Abstract: MC-22212361F9-E85X-CD5 NEC MCP SRAM FLASH a810c
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-22212361-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 64M-BIT PAGE MODE FLASH MEMORY AND 4M-BIT SRAM Description The MC-22212361-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-22212361-X 64M-BIT MC-22212361-X 85-pin -D80X -E85X MC-22212361F9-D80X-CD5 MC-22212361F9-E85X-CD5 NEC MCP SRAM FLASH a810c

    MC-222254AF9-B85X-BT3

    Abstract: MC-222254A-X
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222254A-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 4M-BIT SRAM Description The MC-222254A-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) flash memory and 4,194,304 bits (BYTE mode : 524,288 words


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    PDF MC-222254A-X 32M-BIT MC-222254A-X 77-pin MC-222254AF9-B85X-BT3

    MC-222262F9-B85X-BT3

    Abstract: MC-222262-X
    Text: DATA SHEET MOS INTEGRATED CIRCUIT MC-222262-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND SRAM 32M-BIT FLASH MEMORY AND 8M-BIT SRAM Description The MC-222262-X is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode : 4,194,304 words by 8 bits, WORD mode : 2,097,152 words by 16 bits) Flash Memory and 8,388,608 bits (BYTE mode : 1,048,576 words


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    PDF MC-222262-X 32M-BIT MC-222262-X 77-pin MC-222262F9-B85X-BT3

    MC-2311100

    Abstract: MC-2311100F9-B10-BQ1 MC-2311100F9-B80-BQ1 MC-2311100F9-B90-BQ1
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-2311100 MCP MULTI-CHIP PACKAGE MOBILE SPECIFIED RAM AND SRAM 16M-BIT CMOS MOBILE SPECIFIED RAM AND 4M-BIT CMOS SRAM Description The MC-2311100 is a stacked type MCP (Multi-Chip Package) of 16,777,216 bits (1,048,576 words by 16 bits) Mobile


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    PDF MC-2311100 16M-BIT MC-2311100 61-pin I/O15) MC-2311100F9-B10-BQ1 MC-2311100F9-B80-BQ1 MC-2311100F9-B90-BQ1

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY PRODUCT INFORMATION MOS INTEGRATED CIRCUIT MC-24212361-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND MOBILE SPECIFIED RAM 64M-BIT FLASH MEMORY AND 16M-BIT MOBILE SPECIFIED RAM Description The MC-24212361-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-24212361-X 64M-BIT 16M-BIT MC-24212361-X 85-pin

    MC-24242311-X

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-24242311-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND MOBILE SPECIFIED RAM 64M-BIT FLASH MEMORY AND 64M-BIT MOBILE SPECIFIED RAM Description The MC-24242311-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-24242311-X 64M-BIT MC-24242311-X 93-pin

    MC-24222311F9-E85X-CD5

    Abstract: NEC MCP SRAM FLASH M1581
    Text: PRELIMINARY DATA SHEET MOS INTEGRATED CIRCUIT MC-24222311-X MCP MULTI-CHIP PACKAGE FLASH MEMORY AND MOBILE SPECIFIED RAM 64M-BIT FLASH MEMORY AND 32M-BIT MOBILE SPECIFIED RAM Description The MC-24222311-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)


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    PDF MC-24222311-X 64M-BIT 32M-BIT MC-24222311-X 85-pin MC-24222311F9-E85X-CD5 NEC MCP SRAM FLASH M1581