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    OUTLINE PRO 408 Search Results

    OUTLINE PRO 408 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    OUTLINE PRO 408 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nec 16312 transistor

    Abstract: Nec K 872 cce 7100 nec 16312 BJT IC Vce bjt npn m03 AT 1004 S12 hfe 4793 Laser Diode 808 2 pin 1000 mw transistor KF 507
    Text: NEC's NPN SILICON TRANSISTOR NE851M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance • IDEAL FOR ≤ 3 GHz OSCILLATORS


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    PDF NE851M03 NE851M03 nec 16312 transistor Nec K 872 cce 7100 nec 16312 BJT IC Vce bjt npn m03 AT 1004 S12 hfe 4793 Laser Diode 808 2 pin 1000 mw transistor KF 507

    BF-104

    Abstract: NE687M03 2SC5436 NE687 NE687M03-A NE687M03-T1-A S21E BJT IC Vce
    Text: NEC's NE687M03 NPN SILICON TRANSISTOR FEATURES • • • OUTLINE DIMENSIONS Units in mm NEW M03 PACKAGE: • Smallest transistor outline package available • Low profile/0.59 mm package height • Flat lead style for better RF performance HIGH GAIN BANDWIDTH PRODUCT:


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    PDF NE687M03 NE687M03 BF-104 2SC5436 NE687 NE687M03-A NE687M03-T1-A S21E BJT IC Vce

    "scsi to usb"

    Abstract: nec V850e architecture manual inc850
    Text: Application Note V850E/ME2 32-Bit Single-Chip Microcontroller USB Function Drivers µPD703111A Document No. U17069EJ1V0AN00 1st edition Date Published May 2004 N CP(K) 2004 Printed in Japan [MEMO] 2 Application Note U17069EJ1V0AN NOTES FOR CMOS DEVICES 1


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    PDF V850E/ME2 32-Bit PD703111A U17069EJ1V0AN00 U17069EJ1V0AN usbf850 USBF850REG "scsi to usb" nec V850e architecture manual inc850

    scsi cable to usb

    Abstract: CA850 uPD703111A V850E1 RX850 Pro U16053E CDB 476 Midas Components nec V850e architecture manual
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF usbf850 U17069EJ1V0AN USBF850REG scsi cable to usb CA850 uPD703111A V850E1 RX850 Pro U16053E CDB 476 Midas Components nec V850e architecture manual

    outline pro 408

    Abstract: TEXTOOL 40 pin socket PIC16C54A PIC16C55 PIC16C56 AC144001 AC144002 AC164001 PLCC SOCKET 3M AC164015
    Text: PRO MATE/PRO MATE II DEVICE SUPPORT Socket Modules INTRODUCTION This document lists the part numbers for the socket modules that support each device and discusses the life expectancy and cleaning procedures for the different socket types. These sockets work on both PRO MATE


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    PDF DS30243C-page outline pro 408 TEXTOOL 40 pin socket PIC16C54A PIC16C55 PIC16C56 AC144001 AC144002 AC164001 PLCC SOCKET 3M AC164015

    Renesas uITRON OS help

    Abstract: SVC 210 RX850 RX850 Pro
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF G0706 Renesas uITRON OS help SVC 210 RX850 RX850 Pro

    GHS linker porting

    Abstract: green hills compiler v850 CCV850 E2108 ghs v850 compiler intstk CA850 RX850 V850E1 V850E/IA1
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF stdrx85p U17421EJ1V0UM GHS linker porting green hills compiler v850 CCV850 E2108 ghs v850 compiler intstk CA850 RX850 V850E1 V850E/IA1

    TDA 2377

    Abstract: ghs v850 compiler GHS linker porting RX850 user manual renesas v850e2 LED 315 pool manual CA850 ID850QB RX850 Pro GHS linker
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3V DIFFERENTIAL LVPECL-to-LVTTL TRANSLATOR ECL Pro SY100EPT21L FINAL FEATURES • ■ ■ ■ ■ ■ ■ 3.3V power supply 1.9ns typical propagation delay 275MHz fMAX Clock bit stream, not pseudo-random Differential LVPECL inputs 24mA LVTTL outputs


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    PDF 275MHz SY100EPT21L SY100EPT21L

    5.1 channel surround sound IC

    Abstract: Ic surround YM7306C 8.4672 prologic II 5.1 circuit diagram yamaha dolby yamaha ic circuit diagram "dolby digital" 2.1 channel surround sound IC 5.1 surround circuit
    Text: YAMAHA'L S I YM73QBC Dolby Pro Logic D ecoder D P LD • OUTLINE This LSI is a Dolby Pro Logic decoder based on latest Digital Signal Processing technology. The LSI is capable of digital signal processing for almost all functions needed in Pro Logic. This


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    PDF CA95112 5.1 channel surround sound IC Ic surround YM7306C 8.4672 prologic II 5.1 circuit diagram yamaha dolby yamaha ic circuit diagram "dolby digital" 2.1 channel surround sound IC 5.1 surround circuit

    5.1 channel surround sound IC

    Abstract: yamaha dolby YM7306C
    Text: YAMAHA L S I Y M 7 3 0 B C Dolby Pro Logic Decoder DPLD • OUTLINE This LSI is a Dolby Pro Logic decoder based on latest Digital Signal Processing technology. The LSI is capable of digital signal processing for almost all functions needed in Pro Logic. This


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    PDF CA95112 5.1 channel surround sound IC yamaha dolby YM7306C

    5.1 channel surround sound IC

    Abstract: No abstract text available
    Text: YAMAHAL Si YSS215 Audio & Visual Surround Processor A V S P • OUTLINE YSS215 is digital sound field processor with Dolby Pro Logic decoder based on D igital Signal Pro­ cessing technology. The LSI has A/D & D/A Converter and uses digital signal processing for alm ost all functions needed


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    PDF YSS215 YSS215 CA95112 5.1 channel surround sound IC

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M03 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE681M03 NE681 681M03 07e-12 08e-12 12e-9 10e-9 12e-9 24-Hour

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE687M03 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE687M03 24-Hour

    e856

    Abstract: outline pro 408
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M03 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE856M03 NE856M03 24-Hour e856 outline pro 408

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M03 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE681M03 NE681 24-Hour

    Harris Semiconductor 286

    Abstract: 7106-10p
    Text: HMM-10610 GaAs Monolithic Microwave Integrated Circuit 2 - 6 GHz MMIC Amplifier PRELIM INARY PRO DUCT DATA NOVEMBER 1987 HARRIS MICROWAVE SEMICONDUCTOR DEVICE OUTLINE FEATURES O Broadband Performance □ 100 mW Output Power Capability O Submicrometer Gate Length for High Gain and


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    PDF HMM-10610 HMM-10610 7-10610-P Harris Semiconductor 286 7106-10p

    outline pro 408

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NEC NPN SILICON TRANSISTOR NE680M03 FEATURES • OUTLINE DIMENSIONS Units in mm PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE680M03 24-Hour outline pro 408

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NEC NPN SILICON TRANSISTOR NE687M03 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE687M03 687M03 26e-12 19e-12 08e-12 12e-9 10e-9 12e-9 24-Hour

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M03 OUTLINE DIMENSIONS U n its FEATURES in m m PACKAGE OUTLINE M03 NEW M03 PACKAGE: • S m allest tra n sisto r o u tlin e pa ckag e ava ila ble • Low pro file /0 .5 9 mm package height • Flat lead style fo r be tte r RF p e rfo rm an ce


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    PDF NE685M03 24-Hour

    P115A

    Abstract: No abstract text available
    Text: TLP115A GaAÔAs IRED a PHOTO-IC T L P115A HIGH SPEED, LONG DISTANCE ISOLATED LINE RECEIVER M IC RO PRO C ESSO R SYSTEM INTERFACES DIGITAL ISOLATION FOR A / D , D / A CONVERSION C O M PU TER-PERIPH ERA L INTERFACES G RO UN D LOOP ELIM INATIO N The T O S H IB A M IN I F L A T C O U P L E R T L P 1 1 5 A is a sm all outline


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    PDF TLP115A P115A P115A

    Untitled

    Abstract: No abstract text available
    Text: TLP113 GaAÆAs IRED & PHOTO-IC U P 113 ISO LATED LINE RECEIVER S IM P L E X / M U L T IP L E X DATA TRA N SM ISSIO N CO M PUTER-PERIPH ERA L INTERFACE M IC RO PRO C ESSO R SYSTEM INTERFACE DIGITAL ISOLATION FOR A / D , D / A CO NVERSIO N The T O S H IB A M IN I F L A T C O U P L E R T L P1 1 3 is a sm all outline


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    PDF TLP113

    CD 4039 AE

    Abstract: FLASH PRO CD 4039 e
    Text: PACKAGE TSSOP DIAGRAM O U T L IN E S PACKAGE TSSO P DIAGRAM O U T L IN E S C o n t in u e d REVISIONS DWG § S048-2 JEDEC VARIATION DWG # N MIN NOM MAX T E NOM MAX 1.10 - - 1.10 - - .05 - .15 .05 - .15 A2 .85 1.00 1.05 .85 1.00 1.05 D 12.40 12.50 12.60


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    PDF S048-2 CD 4039 AE FLASH PRO CD 4039 e

    27645

    Abstract: vu 725
    Text: ^ - 1 . 0 0 7 | C ACD BCD - AA - 3A ii n n n n n n n n n n n n n n n d & N A A S A i 1 = e ! i i i ! / - INDEX AREA .225 MAX A1 1 I A 1 1 U Lu u u u u u u u u u u u u u 1 2 3 .150 MAX .01 5/.020 t —— /— WITH PLATING 1 REF


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    PDF s-027, PSC-4033 27645 vu 725