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    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC Search Results

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet PDF

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER PDF

    DS810

    Abstract: No abstract text available
    Text: data sheet CERAMIC / HERMETIC LCC Leadless Chip Carrier Package LCC Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized


    Original     		DS810 DS810 PDF

    Untitled

    Abstract: No abstract text available
    Text: SUPERTEX INC 01 Dif| 07735^5 OOGlfiD? 8773295 SUPERTEX INC OtE 01807 &• D HV02 une -O S 16-Channel Matrix TFEL Panel Display Row Driver Ordering Information Package Options Device 40-Pin Ceramic DIP 36-Pin Leadless Chip Carrier 36-Pin Leaded Chip Carrier


    OCR Scan     		16-Channel 40-Pin HV02C 36-Pin HV02LC HV02CF HV02CS PDF

    36 pin CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 64 CERAMIC LEADLESS CHIP CARRIER LCC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 CERAMIC LEADLESS CHIP CARRIER
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC To Top / Package Lineup / Package Index LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal


    Original     		LCC-36C-F01 WQFN036-G-S550-1 36-pad LCC-36C-F01) C36001SC-1-2 36 pin CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 64 CERAMIC LEADLESS CHIP CARRIER LCC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 CERAMIC LEADLESS CHIP CARRIER PDF

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC To Top / Package Lineup / Package Index LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal


    Original     		LCC-16C-F01 QFN016-G-S250-1 16-pad LCC-16C-F01) C16003SC-2-2 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER PDF

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal


    Original     		LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15T010 15TYP PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01 PDF

    LCC-48C-A01

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFN048-C-S560-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC To Top / Package Lineup / Package Index LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal


    Original     		LCC-48C-A01 QFN048-C-S560-1 48-pad LCC-48C-A01) C48001SC-4-2 LCC-48C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFN048-C-S560-1 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC64 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 LCC-64C-A01 QFN064-C-S720-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC To Top / Package Lineup / Package Index LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal


    Original     		LCC-64C-A01 QFN064-C-S720-1 64-pad LCC-64C-A01) C64001SC-5-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC64 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 LCC-64C-A01 QFN064-C-S720-1 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal


    Original     		LCC-32C-A06 WQFN032-C-S420-1 32-pad LCC-32C-A06) C32007SC-4-3 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal


    Original     		LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32 PDF

    LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
    Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 50mil 650mil 44-pad LCC-44C-F01) C44001SC-2-2 LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
    Text: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)


    Original     		LCC-36C-F01 WQFN036-G-S550-1 50mil 550mil 36-pad LCC-36C-F01) C36001SC-1-2 CERAMIC LEADLESS CHIP CARRIER c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal LCC-64C-A01 64-pad ceramic LCC (LCC-64C-A01)


    Original     		LCC-64C-A01 QFN064-C-S720-1 64-pad LCC-64C-A01) C64001SC-5-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: tSENSITRON UC1625L SEMICONDUCTOR DATASHEET 4062 PART NUMBER: UC1625L REV. ENG. BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS


    Original     		UC1625L UC1625L PDF

    Untitled

    Abstract: No abstract text available
    Text: SENSITRON SEMICONDUCTOR UC1625L DATASHEET 4062 PART NUMBER: UC1625L REV. A BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS


    Original     		UC1625L UC1625L PDF

    LCC28

    Abstract: UC1625L
    Text: tSENSITRON UC1625L SEMICONDUCTOR DATASHEET 4062 PART NUMBER: UC1625L REV. ENG. BRUSHLESS DC MOTOR CONTROLLER DESCRIPTION: INTEGRATED CIRCUIT ELECTRICALLY EQUIVALENT TO Unitrode UC1625L PACKAGE: HERMETIC CERAMIC 28 PIN LEADLESS CHIP CARRIER ABSOLUTE MAXIMUM RATINGS


    Original     		UC1625L UC1625L LCC28 LCC28 PDF

    36 pin CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)


    Original     		LCC-36C-F01 WQFN036-G-S550-1 36-pad LCC-36C-F01) C36001SC-1-2 36 pin CERAMIC LEADLESS CHIP CARRIER LCC transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600 PDF

    WQFN032-C-R450-1

    Abstract: C038
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)


    Original     		LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 WQFN032-C-R450-1 C038 PDF

    WQFN032-G-R450-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)


    Original     		LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15TYP WQFN032-G-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32 PDF

    QFN048-C-S560-1

    Abstract: LCC-48C-A01
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal LCC-48C-A01 48-pad ceramic LCC (LCC-48C-A01)


    Original     		LCC-48C-A01 QFN048-C-S560-1 48-pad LCC-48C-A01) C4800( C48001SC-4-2 QFN048-C-S560-1 LCC-48C-A01 PDF

    QFN016-G-S250-1

    Abstract: LCC-16C-F01 R030
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)


    Original     		LCC-16C-F01 QFN016-G-S250-1 16-pad LCC-16C-F01) C16003S4 C16003SC-2-2 QFN016-G-S250-1 LCC-16C-F01 R030 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC 44 WQFN044-G-S650-1 LCC44 PDF