PACKAGE CSP Search Results

PACKAGE CSP Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

PACKAGE CSP Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" Text: Package Information file:///D\|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)	Original	PDF
SLB16A Abstract: PACKAGE CSP SLC100A SLC48A SLC64A chip express Text: Chip Scale Package CSP 8 Lead Chip Scale Package NS Package Number SWA08A 2000 National Semiconductor Corporation MS101162 www.national.com Chip Scale Package (CSP) May 1999 Chip Scale Package (CSP) 16 Lead Chip Scale Package NS Package Number SLB16A	Original	PDF	SWA08A MS101162 SLB16A SLB24A SLB28A SLB48A SLC48A SLB16A PACKAGE CSP SLC100A SLC48A SLC64A chip express
transistor b 1238 Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
28F160 Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
transistor b 1238 Abstract: 15 ball CSP thermal analysis on pcb uBGA device MARKing intel air conditioning bumper 28F008SC IR 126 D 24 Text: 7.0 QUALITY AND RELIABLITY ENGINEERING PACKAGE CERTIFICATION 7.1 Introduction The µBGA package is a chip-scale package CSP , which utilizes a polyimide tape with eutectic solder balls. The µBGA package offers an application in smaller form factors with	Original	PDF
QFN 76 9x9 footprint Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses	Original	PDF
signetics Abstract: No abstract text available Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content	Original	PDF	696hr, 192hr, C/-65 C/100% 15PSIG, 168hrs signetics
BGA 64 PACKAGE thermal resistance Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect	Original	PDF	63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
SPARTAN XC2S50 Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15 Text: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher	Original	PDF
DUAL ROW QFN leadframe Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This	Original	PDF
Untitled Abstract: No abstract text available Text: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The	Original	PDF
microwave transmitter circuit diagram Abstract: Fiber Optic Transmitters "Fiber Optic Transmitters" "Fiber Optic transmitter" block diagram for optical fiber receiver fiber transmitter and receiver circuit diagram 2DSTXRX004-CSP Text: TX004-CSP RX004-CSP Broadband Chip Scale Package Fiber Optic Transmitter and Receiver 100 Mbps to 4.25 Gbps PART NUMBER DESCRIPTION TX004-CSP Broadband Chip Scale Package Fiber Optic Transmitter (100 Mbps to 4.25 Gbps) Broadband Chip Scale Package Fiber Optic Receiver	Original	PDF	TX004-CSP RX004-CSP TX004-CSP RX004-CSP microwave transmitter circuit diagram Fiber Optic Transmitters "Fiber Optic Transmitters" "Fiber Optic transmitter" block diagram for optical fiber receiver fiber transmitter and receiver circuit diagram 2DSTXRX004-CSP
communication transmitter and receiver circuit diagram Abstract: Fiber Optic Transmitters microwave transmitter circuit diagram teledyne Microelectronics TX004-CSP "Fiber Optic transmitter" block diagram for optical fiber receiver "Fiber Optic Transmitters" Text: TX004-CSP RX004-CSP Broadband Chip Scale Package Fiber Optic Transmitter and Receiver 100 Mbps to 4.25 Gbps PART NUMBER DESCRIPTION TX004-CSP Broadband Chip Scale Package Fiber Optic Transmitter (100 Mbps to 4.25 Gbps) Broadband Chip Scale Package Fiber Optic Receiver	Original	PDF	TX004-CSP RX004-CSP TX004-CSP RX004-CSP communication transmitter and receiver circuit diagram Fiber Optic Transmitters microwave transmitter circuit diagram teledyne Microelectronics "Fiber Optic transmitter" block diagram for optical fiber receiver "Fiber Optic Transmitters"
E700G Abstract: No abstract text available Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	PDF	DS577G E700G

HL832N Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	PDF
land pattern for TSOP 2 86 PIN Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730 Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS	Original	PDF
SMD MARKING CODE 071 A01 Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods	Original	PDF	LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
116-Pin Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size	Original	PDF	C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
10C2 Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension	Original	PDF	12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
LGA240 Abstract: LGA48 LGA92 BGA48 LGA300 SUPER CHIP Text: Super CSP Super Chip Scale Package SCSP is a wafer level package that is a true chip size package. It provides a potential solution for “known good die”, or one test point operation as compared to two. In single chip packaging, it is customary to have testing at the wafer probe and again after	Original	PDF	LGA48 LGA92 LGA240 LGA300 RH/48 LGA240 LGA48 LGA92 BGA48 LGA300 SUPER CHIP
CY62128-SC Abstract: mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22 Text: Cypress Semiconductor Package Qualification Report QTP# 002605 VERSION 1.0 December, 2000 32.45-lead Plastic Small Outline Package SOIC Level 3 Cypress Philippines (CSPI-R) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	45-lead CY62148 CY62128-SC 619922743M CY62128-SC mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22
MS-034-AAn-1 Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Abstract: No abstract text available Text: TYPES OF PACKAGES 1C PACKAGE MANUAL SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL CSP Chip Size Package	OCR Scan	PDF
fbga 12 x 12 thermal resistance Abstract: FBGA160-P-1212 Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the	OCR Scan	PDF	developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212

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PACKAGE CSP Search Results

PACKAGE CSP Result Highlights (5)

PACKAGE CSP Datasheets Context Search

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

SLB16A

transistor b 1238

28F160

transistor b 1238

QFN 76 9x9 footprint

signetics

BGA 64 PACKAGE thermal resistance

SPARTAN XC2S50

DUAL ROW QFN leadframe

Untitled

microwave transmitter circuit diagram

communication transmitter and receiver circuit diagram

E700G

HL832N

land pattern for TSOP 2 86 PIN

SMD MARKING CODE 071 A01

116-Pin

10C2

LGA240

CY62128-SC

MS-034-AAn-1

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

fbga 12 x 12 thermal resistance