Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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15d060
Abstract: E1000S G100D 1000rr 15D-060
Text: FUJI IGBT & FWD 600 V 15 A 1MB 15D-060 Fuji Discrete Package IGBT Outline Drawing • Features >Square RBSOA Saturation Voltage <Less Total Pow er Dissipation >M inim ized Internal S tray Inductance > Low I Applications > High Pow er Switching M otor Controls
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15D-060
702708-Dallas,
15d060
E1000S
G100D
1000rr
15D-060
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Untitled
Abstract: No abstract text available
Text: 31 — 7 0 0 4 0 — 100T NDTES: REVISIONS DRAWING NO. 3. 4. MATERIALS DF CONSTRUCTION; BODY 8« RETAINING RING = BRASS, NICKEL PLATED. CONTACT = BERRYLLIUM COPPER, GOLD PLATED. INSULATDR = TFE, FLUORCARBON. PACKAGE THIS CONNECTQR IN ANTI-STATIC TRAYS, 30 PIECES PER TRAY,
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40-100T
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26000M
Abstract: No abstract text available
Text: VF Type Voltage Controlled Crystal Oscillator RoHS Compliant Optional FEATURE 1.Typical 20.4 x 12.8 x 7.8mm, standard package & 14-Pin dual in line. 2.Pulling range: ±150ppm max. 3.Aging: ±1ppm/year. 4.TTL/ CMOS output. 5.Packing: 25 pcs per Tube; 50pcs per Tray.
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14-Pin
150ppm
50pcs
10TTL
000MHzFo26
000MHz
000MHzFo45
Range100ppm
26000M
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10.000000MHZ
Abstract: No abstract text available
Text: VH Type Voltage Controlled Crystal Oscillator RoHS Compliant Optional FEATURE 1.Typical 12.8 x 12.8 x 5.0mm, standard package & 8-Pin dual in line. 2.Pulling range: ±150ppm max. 3.Aging: ±1ppm/year. 4.TTL/ CMOS output. 5. Packing: 40 pcs per Tube; 50pcs per Tray.
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150ppm
50pcs
10TTL
000MHzFo26
000MHz
000MHzFo45
Range100ppm
XO-0023-G
10.000000MHZ
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Untitled
Abstract: No abstract text available
Text: MCC Micro Commercial Components THROUGH HOLE - AXIAL LEADED Through Hole Package Quantity Case Style Box/Bag Qty Bulk Tube Qty Available Packaging pcs 13” Tape & Reel Tray Qty Qty 5000 Ammo Pack Qty A-405 DB-1 2500 50 DO-15 500 4000 3000 DO-201AD 500 1200
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DO-15
DO-201AD
DO-201AE
DO-35
DO-35G
DO-41
DO-41G
ITO-220AB
ITO220AC
MB-35
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Marking DB1. SOT-143
Abstract: ST191 sot-23 MARKING CODE 54 sot-89 marking A5 MP5050 GBJ 1005 marking code 604 SOT23
Text: MCC Micro Commercial Components THROUGH HOLE - AXIAL LEADED Through Hole Package Quantity Case Style Box/Bag Qty Bulk Tube Qty Available Packaging pcs 13” Tape & Reel Tray Qty Qty 5000 Ammo Pack Qty A-405 DB-1 2500 50 DO-15 500 4000 3000 DO-201AD 500 1200
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DO-15
DO-201AD
DO-201AE
DO-35
DO-35G
DO-41
DO-41G
ITO-220AB
ITO220AC
MB-35
Marking DB1. SOT-143
ST191
sot-23 MARKING CODE 54
sot-89 marking A5
MP5050
GBJ 1005
marking code 604 SOT23
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LY621024PL-70LL
Abstract: LY621024PL
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007
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LY621024
450mil
LY621024GL-70LLE
LY621024GL-70LLET
LY621024GL-70LLI
LY621024GL-70LLIT
LY621024PL-70LL
LY621024PL
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Untitled
Abstract: No abstract text available
Text: LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Rev. 0.6 Rev. 1.0 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package
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LY62L12916
LY62L12916GL-45SL
LY62L12916GL-70LLET
LY62L12916GL-70LLI
LY62L12916GL-70LLIT
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DAEWON tray tsop 48LD
Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures
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NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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IPC-J-STD-001
Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures
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Untitled
Abstract: No abstract text available
Text: LY6125616 5V 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.4 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Rev. 2.4 Description Initial Issue Revised VIL = 0.6V => 0.8V Revised Package Outline Dimension TSOP-II Added LL Spec.
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LY6125616
-12ns
-10ns
LY6125616GL-25E
LY6125616GL-25ET
LY6125616GL-25I
LY6125616GL-25LLI
LY6125616GL-25IT
LY6125616GL-25LLIT
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150PPS
Abstract: PEAK tray drawing
Text: Analog Resistive Touch Screen Controller TSC-40/IC product specification TSC-40/IC Product Specification Table of Contents 1. PRODUCTS OUTLINE . 2 1-1. Scope of Application .2
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TSC-40/IC
DER-S0026A
150PPS
PEAK tray drawing
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TSOP 48 thermal resistance
Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate
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MS-024
TSOP 48 thermal resistance
TSOP 48 stacked die package
MS-024
MO-142
TSOP 32 thermal resistance
TSOP 48 package tray
MO-183
marking code 56l
jedec ms-024
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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MC7884 S
Abstract: MC-7882 MC-7881 MC-7883 MC-7884 max 7882 7881 7883
Text: MC-7881 NEC's 870 MHz GaAs CATV MC-7882 POWER DOUBLER AMPLIFIER MC-7883 MC-7884 OUTLINE DIMENSIONS Units in mm FEATURES • GaAs ACTIVE DEVICES • LOW DISTORTION • HIGH LINEAR GAIN: MC-7881 - GL = 18 dB MIN at f = 870 MHz MC-7882 - GL = 20 dB MIN at f = 870 MHz
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MC-7881
MC-7882
MC-7883
MC-7884
MC-7881
MC-7882
MC-7883
MC-7884
MC7884 S
max 7882
7881
7883
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A84 diode
Abstract: PART NUMBER A04 IT1-168S-SV IT1-252S-SV IT1A-168S-SV IT1A-252S-SV
Text: NEW High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT1 Series Receptacle 2 required IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding
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IT1-168S-SV
Abstract: IT1-252S-SV IT1A-168S-SV IT1A-252S-SV
Text: High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT1 Series Receptacle 2 required IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding
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pin configuration of IC 1619
Abstract: pin diagram for IC 1619 30 pin PEAK tray drawing dmc touch screen
Text: Analog Resistive Touch Screen Controller TSC-30/IC product specification TSC-30/IC Product Specification Table of Contents 1. Products outline . 2
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TSC-30/IC
DER-S0052A
pin configuration of IC 1619
pin diagram for IC 1619 30 pin
PEAK tray drawing
dmc touch screen
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sop package tray
Abstract: 29754* intel weight of SOP package SOP JEDEC tray
Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.
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