MEMS pressure sensor
Abstract: mems sensor wafer sensors mems integrated sensor pressure mems sensor cost MEMS and IC advantage MEMS
Text: 14 Nov 2006 1 3 WHAT IS AHEAD IN THE PACKAGING ROADMAP OF MEMS? Packaging of ICs goes wafer level and 3D Wafer level packaging, WLP, and 3D-packaging are the major trends in packaging of semiconductor devices. WLP converts the whole packaging process to a wafer-level
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NEC stacked MCP 1999
Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a
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carrier chiller
Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
Text: CASERM/D Rev. 0, Sep-2000 Semiconductor Packaging and Case Outlines ON Semiconductor Reference Manual and Design Guide Semiconductor Packaging and Case Outlines Reference Manual and Design Guide CASERM/D Rev. 0, Sep–2000 SCILLC, 2000 “All Rights Reserved’’
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Sep-2000
r14525
carrier chiller
BRIDGE RECTIFIER SMD
oscilloscopes manual
SOT-353 Mark va
ECL Handbook
smd diode Cathode is indicated by a blue band mar
TO-204aa MICROSEMI PACKAGE OUTLINE
Microsemi Catalog 2000
RCA 559 TO3
MECL System Design Handbook
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oki qfp tray
Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
Text: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •
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30min
30min
1000H
100cyc
300cyc
500cyc
ED-4701
oki qfp tray
1000H
ED-4701
72 ball w-csp
SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
wcsp reliability
FBGA tray
mobile phone
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PCB design for very fine pitch csp package
Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers
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BGA and QFP Package mounting
Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Text: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density
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"0.4mm" bga "ball collapse" height
Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and
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SPRAA99
"0.4mm" bga "ball collapse" height
Modified Coffin-Manson Equation Calculations
65X65
nFBGA
SN 29733
TEXAS INSTRUMENTS, Mold Compound, CSP
12x12 bga thermal resistance
385Z
SPRAA99
72ZST
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power diode package
Abstract: No abstract text available
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT3300 Package Style 830 Suffix A, C PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT3300
power diode package
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PT6900
Abstract: PT6920
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT6900 PT6920 Package Style 1100 Suffix N PACKAGE INFORMATION AND DIMENSIONS Revised 12/21/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT6900
PT6920
PT6900
PT6920
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BGA and QFP Package mounting
Abstract: Packaging trends sop classifications DSA0051321
Text: 1. PACKAGE CLASSIFICATIONS 1-1. Packaging Trends In recent years, marked advances have been made in the electronics field. One such advance has been the progression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highly integrated into LSIs, VLSIs, and now, ULSIs.
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Power Trends
Abstract: PT6900 diehl
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT6900 Package Style 1100 Suffix N PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT6900
Power Trends
PT6900
diehl
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power diode package
Abstract: PT3320
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT3320 Package Style 850 Suffix A, C PACKAGE INFORMATION AND DIMENSIONS Revised 12/02/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT3320
power diode package
PT3320
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PT7770
Abstract: PT7746
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT7770 PT7746 Package Style 1020 Suffix N PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT7770
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power diode package
Abstract: PT7600 PT7705 PT7749
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT7600 PT7705 PT7749 Package Style 810 Suffix A, C PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT7600
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PT7749
power diode package
PT7600
PT7705
PT7749
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PT3100
Abstract: 107 diode A 107 transistor diode 107 power diode package
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT3100 PT4100 Package Style 700 Suffix A, C PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT3100
PT4100
PT3100
107 diode
A 107 transistor
diode 107
power diode package
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micro pitch BGA
Abstract: micro strip line
Text: “Super Intelligent Concepts”through Advanced Integrated Technologies. Combine proven core technologies to create highly multi-functional devices. Customer Needs High density Downsizing Environment Packaging technology Circuit design technology Environmentally friendly processes
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Untitled
Abstract: No abstract text available
Text: “Super Intelligent Concepts”through Advanced Integrated Technologies. Combine proven core technologies to create highly multi-functional devices. Customer Needs High density Downsizing Environment Packaging technology Circuit design technology Environmentally friendly processes
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power diode package
Abstract: PT6420
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT6420 Package Style 310 Suffix A, C, D, E, N, P PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT6420
power diode package
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PT78NR100
Abstract: power diode package PT78ST100 PT78HT200 PT79SR100
Text: For assistance or to order, call 800 531-5782 Product families using this package style: Package Style 500 Suffix V, S, H PT78ST100 PT78HT200 PT78NR100 PT79SR100 PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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PT78ST100
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PT78NR100
PT79SR100
PT78NR100
power diode package
PT78ST100
PT78HT200
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power diode package
Abstract: PT6100 PT6210 PT6300
Text: For assistance or to order, call 800 531-5782 Product families using this package style: PT6100 PT6210 PT6300 Package Style 200 Suffix A, C, D, E, N, P PACKAGE INFORMATION AND DIMENSIONS Revised 5/15/98 PACKAGING Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
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power diode package
PT6100
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displaytech 204 A
Abstract: PLDS DVD V7 cnc schematic ieee floating point multiplier vhdl future scope XCS20-3TQ144 cnc controller abstract on mini ups system Esaote n735 vhdl projects abstract and coding
Text: XCELL Issue 29 Third Quarter 1998 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS The Programmable Logic CompanySM Inside This Issue: PRODUCTS Editorial . 2 Chip-Scale Packaging . 3 New Spartan -4 Devices . 4-5
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XC95144
XC9500
XLQ398
displaytech 204 A
PLDS DVD V7
cnc schematic
ieee floating point multiplier vhdl future scope
XCS20-3TQ144
cnc controller
abstract on mini ups system
Esaote
n735
vhdl projects abstract and coding
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PowerPC 601 interface circuit
Abstract: 620t hotwire anemometer powerpc 620 advanced information
Text: Freescale Semiconductor, Inc. Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors Gary B. Kromann Freescale Semiconductor, Inc. Advanced Packaging Technology Semiconductor Products Sector
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603TM
604TM
21x21
133MHz
PowerPC 601 interface circuit
620t
hotwire anemometer
powerpc 620 advanced information
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STMicroelectronics bake time chart
Abstract: water pressure i2c
Text: APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions INTRODUCTION STMicroelectronics supports various package types to adapt MCUs to customer requirements. Beside the available mounting technology SMD or Throughhole , the choice is often
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mll34 footprint
Abstract: FI SOT-143 MLL34
Text: AR197 PACKAGING TRENDS IN DISCRETE SURFACE MOUNT COMPONENTS Prepared by Dave Hollander Semiconductor Products Sector Motorola Inc. Phoenix, AZ Reprinted by permission from the August 1987 issue of SURFACE MOUNT TECHNOLOGY. Copyright 1987, Lake Publishing Corporation,
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AR197
1990s
C68141
mll34 footprint
FI SOT-143
MLL34
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