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    PART 2 BA PRIVATE 2012 EXAM Search Results

    PART 2 BA PRIVATE 2012 EXAM Result Highlights (5)

    Part
    ECAD Model
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    MD28F020-12/B Rochester Electronics LLC 28F020 - 2048K (256K x 8) CMOS Flash Memory Visit Rochester Electronics LLC Buy
    MD28F020-12/R Rochester Electronics LLC 28F020 - 2048K (256K x 8) CMOS Flash Memory Visit Rochester Electronics LLC Buy
    20121C00BD Amphenol Communications Solutions Elite Backplane connectors, BMA 12pair, 8position, NiS Visit Amphenol Communications Solutions
    ME3220-123KLB Coilcraft Inc General Purpose Inductor, 12uH, 10%, 1 Element, Ferrite-Core, SMD, 1211, ROHS COMPLIANT Visit Coilcraft Inc
    SER2012-681MLD Coilcraft Inc General Purpose Inductor, 0.68uH, 20%, 1 Element, Ferrite-Core, SMD, 7674, ROHS COMPLIANT Visit Coilcraft Inc

    PART 2 BA PRIVATE 2012 EXAM Datasheets Context Search

    Catalog Datasheet
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    PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive


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    GS88237CB-xxx 119-Bump x18/x36 88237C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive


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    GS88237CB-xxx 119-Bump x18/x36 88237C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply


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    GS88237CB-xxxIV 119-Bump 882V37C 119-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable


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    GS88218/36CB/D-xxxI 165-Bump x18/x36 88218C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply


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    GS88237CB-xxxIV 119-Bump 882V37C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply


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    GS88237CB-xxxV 119-Bump 882V37C PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply


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    GS88237CB-xxxV 119-Bump 882V37C 119-BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS88218/36C 165-Bump x18/x36 882VxxC 882xxC PDF

    Untitled

    Abstract: No abstract text available
    Text: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS88218/36C 165-Bump x18/x36 882VxxC 882xxC PDF

    Untitled

    Abstract: No abstract text available
    Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS816218/36D x18/x36 165-bump 8162xxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS832218/36A x18/x36 8322xxA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS816218/36D x18/x36 165-bump 8162xxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS832218/36A x18/x36 8322xxA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan


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    GS816218/36D x18/x36 8162xxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation


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    GS8321E18/32/36AD-xxxV 165-Bump 165ete 8321ExxA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply


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    GS832118/32/36AD-xxxV 165-Bump 8321xxA PDF

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    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


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    GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C PDF

    GS816136DD-200IV

    Abstract: No abstract text available
    Text: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply


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    GS8161xxD 100-Pin 165-Bump 8161xxD GS816136DD-200IV PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


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    GS8161ExxD 100-Pin 165-Bump 8161ExxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


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    GS8161ExxD 100-Pin 165-Bump 8161ExxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation


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    GS8321E18/32/36AD-xxxV 165-Bump 8321ExxA PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


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    GS8161ExxD 100-Pin 165-Bump 8161ExxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply


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    GS8161xxD 100-Pin 165-Bump addresse35 8161xxD PDF

    Untitled

    Abstract: No abstract text available
    Text: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply


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    GS832118/32/36AD-xxxV 165-Bump 8321xxA PDF