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    PCB SUBSTRATE Search Results

    PCB SUBSTRATE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    RPI96B3TJ12P1LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    8609153004LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    10090929-H156VLF Amphenol Communications Solutions HIGH DENSITY PCB CONNECTORS Visit Amphenol Communications Solutions
    86092326314755V1LF Amphenol Communications Solutions DIN PCB STRAIGHT RECEPTACLE Visit Amphenol Communications Solutions
    86092326114768V1LF Amphenol Communications Solutions DIN PCB STRAIGHT RECEPTACLE Visit Amphenol Communications Solutions

    PCB SUBSTRATE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MAX8774

    Abstract: PCI8402 RTL8111B-GR PCI8412 MAX8774 pdf 2N7002E-LF AMD Athlon 64 X2 dual 4800 pin out AMD Athlon 64 X2 4800 pin diagram BT129 ALC262
    Text: 1 2 3 4 5 PCB P/N AND DESCRIPTION PCB ED5 MB 8L,309X218, REVA P/N: DA0ED5MB8A8 PCB ED5 USB/B(8L, 47.5X16.8, REVA) P/N: DA0ED5SB8A5 PCB ED5 MB(8L,309X218,REVB) P/N: DA0ED5MB8B6 ED5 PCB ED5 USB/B(8L,47.5X16.8,REVB) P/N: DA0ED5SB8B3 6 7 SATA ED5 SATA ASSY P/N


    Original     		309X218, 309X218 51ED5SS0018 41ED5CS0015 31ED5MB0012 4NED5SS0011 3NED5UB0011 51ED5SS0000 41ED5CS0007 31ED5MB0004 MAX8774 PCI8402 RTL8111B-GR PCI8412 MAX8774 pdf 2N7002E-LF AMD Athlon 64 X2 dual 4800 pin out AMD Athlon 64 X2 4800 pin diagram BT129 ALC262 PDF

    component data

    Abstract: avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED
    Text: ASMT-Bx20 PCB Based Subminiature Lamps PCB PolyLED Application Note 5333 Introduction The main benefits of these PCB PolyLEDs are: This series of top mount PCB PolyLED is designed with smaller footprint to achieve high density of components on board. They have the industry standard footprint of


    Original     		ASMT-Bx20 AV02-0393EN component data avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED PDF

    SMB1N-PCB

    Abstract: No abstract text available
    Text: SMB1N-PCB v 1.0 08.05.2014 Description SMB1N-PCB is a printed circuit board designed for easily soldering and mounting LEDs of SMB1N series. To install the PCB on a heat sink, it features 4 mounting holes Ø2 mm on each corner. The substrate is made of copper and the finishing of mating surface is gold plate.


    Original     		PDF

    SMB1W-PCB

    Abstract: No abstract text available
    Text: SMB1W-PCB v 1.0 08.05.2014 Description SMB1W-PCB is a printed circuit board designed for easily soldering and mounting LEDs of SMB1W series. To install the PCB on a heat sink, it features 4 mounting holes Ø2 mm on each corner. The substrate is made of copper and the finishing of mating surface is gold plate.


    Original     		PDF

    short distance rf tx ic

    Abstract: RF PCB Antenna micro strip line RF 2.4Ghz antenna 2.4Gh* microstrip patch antenna rectangular microstrip patch Antenna antenna matching calculation
    Text: 2.4GHz RF TX/RX PCB Guidelines 2.4GHz RF TX/RX PCB Guidelines D/N：HA0224E PCB Layout Notes The RF can be connected to a passive patch antenna or an antenna connector. The RF connection is on the PCB and connects the RF pin 2 & pin 3 with a matching and balun


    Original     		D/NHA0224E 2450MHz. 2450MHz/50 32MHz short distance rf tx ic RF PCB Antenna micro strip line RF 2.4Ghz antenna 2.4Gh* microstrip patch antenna rectangular microstrip patch Antenna antenna matching calculation PDF

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


    Original     		PDF

    micro strip line

    Abstract: 2.4GHz RECEIVER IC short distance rf tx ic DESIGN RULE CHECK PCB antenna matching calculation 2.4GHz amplifier layout RF PCB Antenna DESIGN RULE PCB pcb crystal layout balun differential to single
    Text: 2.4GHz RF TX/RX PCB Guideline 2.4GHz RF TX/RX PCB Guideline 文件編碼：HA0224T PCB Layout 時可能需注意事項 RF Part can be connected to a passive patch antenna or an antenna connector. The RF connection is on the PCB and connects the RF pin 2 & pin 3 with a matching and balun circuit, as shown in Fig.1.


    Original     		HA0224T 50Matching 2450MHZ 2450MHZ/50 32MHz micro strip line 2.4GHz RECEIVER IC short distance rf tx ic DESIGN RULE CHECK PCB antenna matching calculation 2.4GHz amplifier layout RF PCB Antenna DESIGN RULE PCB pcb crystal layout balun differential to single PDF

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline PDF

    motorola 68020

    Abstract: No abstract text available
    Text: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 17.25mm[0.679"] Assembled 2 1 0.64mm typ. [0.025"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]


    Original     		FR4/G10 PC-PGA/QFP-68020-G-01 motorola 68020 PDF

    fbga Substrate design guidelines

    Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
    Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB


    Original     		AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195 PDF

    TMDS PCB design guidelines

    Abstract: DVI TMDS PCB design guidelines DVI PCB design guidelines AN-6064 FSHDMI311 DVI RECEIVER PCB design guidelines velocity of propagation of FR4 hdmi pcb layout
    Text: www.fairchildsemi.com AN-6064 — FSHDMI311 PCB Layout Guidelines DVI/HDMITM Repeater Introduction Applications Board Layout This application note provides guidelines for successful PCB layout techniques for Fairchild’s FSHDMI311 DVI/HDMITM Repeater. For additional information, review


    Original     		AN-6064 FSHDMI311 FSHDMI311 TMDS PCB design guidelines DVI TMDS PCB design guidelines DVI PCB design guidelines DVI RECEIVER PCB design guidelines velocity of propagation of FR4 hdmi pcb layout PDF

    CYC65632

    Abstract: CY7C65634 AN72332 CYC65642 AN1168 CY4602 CY4605 circuit diagram of usb repeater CY7C65642 physical layer design for USB 2.0
    Text: AN72332 Author: Vetrivel.P Associated Project: No Associated Part Family: HX2VL Software Version: None Associated Application Notes: None EZ-USB HX2VL PCB Design Recommendations Abstract AN72332 presents PCB recommendations for designing with the Cypress Semiconductor CY7C65642, CY7C65632,


    Original     		AN72332 AN72332 CY7C65642, CY7C65632, CY7C65634 CYC65632 CYC65642 AN1168 CY4602 CY4605 circuit diagram of usb repeater CY7C65642 physical layer design for USB 2.0 PDF

    BGA PACKAGE thermal profile

    Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.


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    Nelco 4000-13

    Abstract: MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg
    Text: PCB Stackup Design Considerations for Altera FPGAs AN-613-1.0 Application Note This application note presents an overview of the PCB stackup construction and material selection criteria. It discusses the important material parameters that influence the electrical


    Original     		AN-613-1 Mil-Std-275E) Nelco 4000-13 MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg PDF

    Untitled

    Abstract: No abstract text available
    Text: AN11180 UCODE I2C PCB antenna reference designs Rev. 1.0 — 24 October 2012 229310 Application note COMPANY PUBLIC Document information Info Content Keywords UCODE EPC Gen2, inter-integrated circuit, I²C, Antenna Reference Design, PCB Antenna Design Abstract


    Original     		AN11180 PDF

    screen emulsion

    Abstract: P8002355 P8002392 63Sn37Pb
    Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 14 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.


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    LM53

    Abstract: No abstract text available
    Text: FEATURES / BENEFITS LUMILIGHT Extremely long life of 50,000 hours at 55ºC PCB temperature LED LIGHT ENGINES SINGLE COLOR Extremely narrow construction for mounting in tight spaces Aluminium based PCB for easier heat dissipation and more efficient operation


    Original     		350mA LM53 PDF

    MMM7210

    Abstract: AN3585 L302 inductor C338 EUROPE C338 c341 transistor diode c341 transistor c341 FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET C342
    Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding


    Original     		AN3585 MC13853 QFN16 MMM7210 AN3585 L302 inductor C338 EUROPE C338 c341 transistor diode c341 transistor c341 FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET C342 PDF

    FBGA-484 datasheet

    Abstract: arria MS-034 AGX52014-1
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		152-pin FBGA-484 datasheet arria MS-034 AGX52014-1 PDF

    AN3585

    Abstract: c337 transistor C338 c341 transistor MMM7210 C337 C339 C340 C341 C342
    Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding


    Original     		AN3585 MC13853 QFN16 AN3585 c337 transistor C338 c341 transistor MMM7210 C337 C339 C340 C341 C342 PDF

    lt1085 linear

    Abstract: linear handbook LT1085-5 MOTOROLA linear handbook C51012-1 EP1S60 LT1573 MS-034 BGA956 Lt1649
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix devices. This section contains the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		EL7551C EL7564C EL7556BC EL7562C EL7563C lt1085 linear linear handbook LT1085-5 MOTOROLA linear handbook C51012-1 EP1S60 LT1573 MS-034 BGA956 Lt1649 PDF

    IPC-7711

    Abstract: JEDEC J-STD-033b IPC 7721 J-STD-033b.1 JEDEC J-STD-033b.1 paste profile IPC7711 IPC-7721 thermal pcb guidelines to48c
    Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 15 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.


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    FBGA-484 datasheet

    Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		Packa35 152-pin FBGA-484 datasheet MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90 PDF

    PL-PLCC44-S-01

    Abstract: PL-PLCC44-S-02
    Text: 18.42mm [0.725"] 13.31mm [0.524"] 1 0.61mm [0.024"] strain relief standoff 17.42mm [0.686"] 14.66mm [0.577"] 18.42mm [0.725"] 0.050" typ. Ø 3.18mm [Ø 0.125"] 8.71mm [0.343"] 10.16mm [0.400"] Recommended PCB layout Top, X-ray view of PCB solder side 16.15mm [0.636"]


    Original     		FR4/G10 PL-PLCC44-S-01) PL-PLCC44-S-02 PL-PLCC044-S-02 PL-PLCC44-S-01 PDF