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    PCB WARPAGE AFTER REFLOW Search Results

    PCB WARPAGE AFTER REFLOW Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    1812PS-155KC Coilcraft Inc OBSOLETE Insert 'L' after 'K' for new part number. Part was always RoHS compliant; terminals never contained lead. Visit Coilcraft Inc Buy
    1812PS-155KB Coilcraft Inc OBSOLETE Insert 'L' after 'K' for new part number. Part was always RoHS compliant; terminals never contained lead. Visit Coilcraft Inc Buy
    1812PS-225KC Coilcraft Inc OBSOLETE Insert 'L' after 'K' for new part number. Part was always RoHS compliant; terminals never contained lead. Visit Coilcraft Inc Buy
    1812PS-225KB Coilcraft Inc OBSOLETE Insert 'L' after 'K' for new part number. Part was always RoHS compliant; terminals never contained lead. Visit Coilcraft Inc Buy
    1812PS-392JC Coilcraft Inc OBSOLETE when inventory is depleted. Insert 'L' after 'J' for new part number. Part was always RoHS compliant; terminals never contained lead. Visit Coilcraft Inc Buy

    PCB WARPAGE AFTER REFLOW Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LGA 1207 socket F

    Abstract: pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing
    Text: SOCKET F 1207 Application Specification 114-5383 7 MAY ‘07 Rev.C 1. INTRODUCTION This specification covers the requirements for application of lever-actuated Socket F 1207 position onto printed circuit (pc) boards. These sockets accept 1207-position LGA package


    Original     		1207-position LGA 1207 socket F pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing PDF

    BR1112H

    Abstract: DG1112H PG1112H PY1112H pcb warpage* in smt reflow pcb warpage after reflow BG1112H 1112H AA1112H AY1112H
    Text: Product Guide 1112H Series Thin Type SMT LED • Features ■ Applications • Meets industry standards for 2012 0806 footprint • 2.0mm (L) x 1.25mm (W) x 0.8mm (H) • 1112H is 50% thinner than the W series. • Membrane switch panels • Backlighting


    Original     		1112H BR1112H 1112H-0301 800-LED-LCD1 BR1112H DG1112H PG1112H PY1112H pcb warpage* in smt reflow pcb warpage after reflow BG1112H AA1112H AY1112H PDF

    pcb warpage after reflow

    Abstract: RD02MUS1 RD07MVS1 surge PCB layout AN-GEN-034-E
    Text: APPLICATION NOTE Silicon RF Power Semiconductors Document NO. AN-GEN-034-E Date : 5th Dec. 2003 Rev. date : 22th.Jun. 2010 Prepared : K.Nakamura Confirmed : S.Kametani Taking charge of Silicon RF by MIYOSHI Electronics SUBJECT: Recommended mounted & precaution for RD07&RD02 series with SLP package


    Original     		AN-GEN-034-E 507mm. pcb warpage after reflow RD02MUS1 RD07MVS1 surge PCB layout AN-GEN-034-E PDF

    pcb warpage after reflow

    Abstract: RD02MUS1 RD07MVS1
    Text: APPLICATION NOTE RF POWER SEMICONDUCTORS Document NO. AN-GEN-034-D Date : 5th Dec. 2003 Rev.date : 7th Jan. 2010 Prepared : N.Watanabe M.Wada Confirmed : S.Kametani Taking charge of Silicon RF by MIYOSHI Electronics SUBJECT: Recommended mounted & precaution for RD07MVS1&RD02MUS1


    Original     		AN-GEN-034-D RD07MVS1 RD02MUS1 RD02MUS1. AN-GEN-034 507mm. pcb warpage after reflow RD02MUS1 PDF

    DB1111C

    Abstract: DC1111C DG1111C pcb warpage after reflow d1111
    Text: Product Guide D_1111C Series, Ultra Compact InGaN/SiC SMT LED • Applications ■ Features • High brightness InGaN/SiC die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Wide 130 degree viewing angle • Reflow and dip soldering compatible


    Original     		1111C 525nm) 505nm) 470nm) DG1111C DC1111C DB1111C PGD1111C-0301 800-LED-LCD1 DB1111C DC1111C DG1111C pcb warpage after reflow d1111 PDF

    RD02MUS1

    Abstract: RD07MVS1 mitsubishi bipolar rf power pcb warpage after reflow MITSUBISHI APPLICATION NOTE RF POWER
    Text: MITSUBISHI APPLICATION NOTE RF POWER SEMICONDUCTORS Document NO. AN-GEN-034-C Date : 5th Oct. 2006 Prepared : E.Akiyama S.Kametani Confirmed : T.Ohkawa SUBJECT: Recommended mounting & precaution for RD07MVS1&RD02MUS1 SUMMARY: This application note shows recommendation device mount method & precaution for


    Original     		AN-GEN-034-C RD07MVS1 RD02MUS1 RD02MUS1. AN-GEN-034 507mm. RD02MUS1 mitsubishi bipolar rf power pcb warpage after reflow MITSUBISHI APPLICATION NOTE RF POWER PDF

    Senju M705

    Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
    Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT


    Original     		SWPA156 Senju M705 Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar PDF

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate PDF

    DB1112H

    Abstract: DC1112H DG1112H 1112H
    Text: Product Guide D_1112H Series, Thin Type InGaN/SiC SMT LED • Features ■ Applications • High brightness InGaN/SiC die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Wide 150 degree viewing angle • Reflow and dip soldering compatible


    Original     		1112H 525nm) 505nm) 470nm) DG1112H DC1112H DB1112H PGD1112H-0301 800-LED-LCD1 DB1112H DC1112H DG1112H PDF

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow PDF

    OMAP4

    Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
    Text: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .


    Original     		OMAP35xx OMAP4 LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera lf4300 solder dipping pop PDF

    BGA PROFILING

    Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile PDF

    csp defects

    Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
    Text: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented


    Original     		150um) 20mils x20mil csp defects handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    "0.4mm" bga "ball collapse" height

    Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA
    Text: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    BGA PROFILING

    Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		J-STD-020. AV02-0767EN BGA PROFILING pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte PDF

    CL580-3700-8-00

    Abstract: M705-221CM5
    Text: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission


    Original     		PDF

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208 PDF

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152 PDF

    Senju M705-GRN360-K2-V

    Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
    Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors


    Original     		31pos. Senju M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219 PDF