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    PGA 132 PACKAGING Search Results

    PGA 132 PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    A82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, CPGA132, PGA-132 Visit Rochester Electronics LLC Buy
    EP1810GI-35 Rochester Electronics LLC UV PLD, 35ns, CPGA68, WINDOWED, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    MG8097BH/BZA Rochester Electronics LLC Microcontroller, 16-Bit, EPROM, 12MHz, NMOS, CPGA68, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    EP1810GC-35 Rochester Electronics LLC UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    MG80C186XL-20 Rochester Electronics LLC Microprocessor, 16-Bit, 20MHz, CMOS, CPGA68, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy

    PGA 132 PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PDF TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    A80960JD-33

    Abstract: A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75
    Text: 80960Jx 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of


    Original     		PDF 80960Jx 132-pin A80960JT-100 A80960JT-75 A80960JD-66 A80960JD-50 A80960JD-40 A80960JD-33 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75

    intel packaging handbook 240800

    Abstract: AD9132 AD27 AD30 AD1981
    Text: 80L960JA/JF Microprocessor 1.0 Packaging Information: 80L960JA/JF Processor The 80L960JA/JF will be offered in several speed and package types. The 132-pin Pin Grid Array PGA device will be specified for operation at VCC = 3.3 V ± 5% over a case temperature range of


    Original     		PDF 80L960JA/JF 132-pin A80L960JA/JF-25 A80L960JA/JF-16 NG80L960JA/JF-25 NG80L960JA/JF-16 intel packaging handbook 240800 AD9132 AD27 AD30 AD1981

    68851

    Abstract: W47B b9 39a 68881
    Text: WC32P020-XXM White Electronic Designs 68020 FEATURES „ Selection of Processor Speeds: 16.67, 20, 25 MHz „ Military Temperature Range: -55°C to +125°C „ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Flatpack, CQFP (Q2) „ Object-code compatible with earlier 68000


    Original     		PDF 32-Bit WC32P020-XXM 68851 W47B b9 39a 68881

    Wakefield Thermal Solutions TYPE 120

    Abstract: intel packaging handbook 240800 Diode Mark N10 f 6061 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75
    Text: 80960JA/JF/JD/JT 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of


    Original     		PDF 80960JA/JF/JD/JT 80960Jx 132-pin A80960JT-100 A80960JT-75 A80960JD-66 A80960JD-50 A80960JD-40 A80960JD-33 Wakefield Thermal Solutions TYPE 120 intel packaging handbook 240800 Diode Mark N10 f 6061 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75

    A80960JC-33

    Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40
    Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of


    Original     		PDF 80960JS/JC 132-pin A80960JC-66 A80960JC-50 A80960JC-40 A80960JC-33 A80960JS-33 A80960JS-25 A80960JC-33 A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40

    A80960JC-33

    Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66
    Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of


    Original     		PDF 80960JS/JC 132-pin A80960JC-66 A80960JC-50 A80960JC-40 A80960JC-33 A80960JS-33 A80960JS-25 A80960JC-33 A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    atmel 0945

    Abstract: atmel 428
    Text: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    Untitled

    Abstract: No abstract text available
    Text: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services FORESIGHT PROGRAM Introduction Foresight is Supertex’s rapid turnaround prototype service. It reduces engineering prototype costs by running several projects on a


    Original     		PDF

    TMS320C40

    Abstract: WB225 MiroTech Microsystems Spectrum Microsystems PG499 fpga radAR XILINX texas instruments qfp pga 132 packaging XC4013L
    Text: Our congratulations to the develop8 ment team at MiroTech Microsystems Inc. Montreal, Canada . MiroTech Microsystems has released a commercial product that uses reconfigurable computing to advance the state-of-the-art for DSP acceleration. At the most recent


    Original     		PDF TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 TMS320C40 WB225 MiroTech Microsystems Spectrum Microsystems PG499 fpga radAR XILINX texas instruments qfp pga 132 packaging XC4013L

    vhdl code for 8 bit barrel shifter

    Abstract: 16 bit single cycle mips vhdl MOTOROLA DSP56300 architecture pga 132 packaging architectural block diagram of motorola 563xx vhdl code for 16 bit barrel shifter TQFP112 563xx 32 bit single cycle mips vhdl 32 bit barrel shifter vhdl
    Text: Digital Signal Processing Division Introducing Motorola DSP’s 24-bit DSP56300 Architecture and Family The Industry’s Fastest & Most Robust DSP Solution Introduction Date: September 25, 1995 1 Digital Signal Processing Division DSP Core Families 563xx Video Decoding


    Original     		PDF 24-bit DSP56300 563xx 56xxx PQFP/132 56xxx 6001A vhdl code for 8 bit barrel shifter 16 bit single cycle mips vhdl MOTOROLA DSP56300 architecture pga 132 packaging architectural block diagram of motorola 563xx vhdl code for 16 bit barrel shifter TQFP112 563xx 32 bit single cycle mips vhdl 32 bit barrel shifter vhdl

    EB420

    Abstract: DSP56001 users manual PB3102 DSP56000 DSP56001 DSP56002 DSP56L002 DSP56002 instruction set DSP56000 users manual
    Text: Order this document by EB420/D Rev.1 MOTOROLA SEMICONDUCTOR ENGINEERING BULLETIN EB420 Converting DSP56001-Based Designs to the DSP56002 This document details the differences between the DSP56001 and DSP56002 that need to be taken into consideration when redesigning a system based on the DSP56001 to use the DSP56002. The differences fall


    Original     		PDF EB420/D EB420 DSP56001-Based DSP56002 DSP56001 DSP56002 DSP56002. EB420 DSP56001 users manual PB3102 DSP56000 DSP56L002 DSP56002 instruction set DSP56000 users manual

    MC68EC030FE40C

    Abstract: MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030
    Text: MOTOROLA Order this document by MC68EC030/D SEMICONDUCTOR TECHNICAL DATA MC68EC030 Technical Summary Second-Generation 32-Bit Enhanced Embedded Controller The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for the requirements of embedded control applications. The MC68EC030 is optimized to maintain


    Original     		PDF MC68EC030/D MC68EC030 32-Bit MC68EC030 MC68030 MC68020, MC68030, MC68040 MC68EC030FE40C MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030

    UM61256FK-15

    Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
    Text: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch


    Original     		PDF 74F257, 74FCT257, 74FCT257T QS32257 QS3257 QS32257 UM61256FK-15 YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624

    EPM7128SLC84-15

    Abstract: EPF10K10LC84-4 EPM7064SLC44-10 ALTERA MAX 5000 programming vhdl code for booth encoder PLMQ7192/256-160NC bga 208 PACKAGE EPM7160 Transition EPF10K70RC240-4 teradyne flex
    Text: Newsletter for Altera Customers ◆ Third Quarter ◆ August 1997 Altera Ships the New, Low-Cost FLEX 6000 Family Altera recently began shipping the new, low-cost FLEX 6000 programmable logic device family, which offers die size and cost that are directly comparable to


    Original     		PDF

    n03n

    Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
    Text: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,


    OCR Scan     		PDF DSP56002/D DSP56002 24-Bit DSP56002 DSP56001 n03n ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors

    pga 132 packaging

    Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
    Text: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar­ ranged 0.100 inch (2.54mm) center-to-center, In a


    OCR Scan     		PDF l386TM Intel386 132-pin pga 132 packaging 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket

    Untitled

    Abstract: No abstract text available
    Text: WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ M ilita ry Temperature Range: -55 °C to + 1 2 5 °C ■ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Ratpack, CQFP (Q2) ■ High-Performance Asynchronous Bus Is Nonmultiplexed and


    OCR Scan     		PDF WC32P020-XXM 32-Bit

    c034

    Abstract: C045 GA08 ga01
    Text: N E C ELECTRONICS I NC 7S Ï Ë | b42752S % DODflni S |~" T - 4 2 - 11-Ï3 //P B 6 3 0 0 1 0 K H S ER IES B IPO LA R ECL GATE A R R A YS 1 N E C Electronics Inc. ( • December 1984 Description //PB6311 Specifications The //PB6300 (10KH) series consists of three ultrahigh-speed ECL gate arrays, compatible with an


    OCR Scan     		PDF b42752S uPB6300 ECL-10KH uPB6311 uPB6321 and//PB6330 208-Pln 132-Pin /uPB6321 juPBG330 c034 C045 GA08 ga01

    Untitled

    Abstract: No abstract text available
    Text: c a WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ ■ M ilitary Screened ■ Packaging High-Performance Asynchronous Bus Is Nonmultiplexed and Full 32-Bits ■ Temperature Range: -55°C to +125°C


    OCR Scan     		PDF WC32P020-XXM 32-Bits 8-/16-/32-Bit 32-Bit