Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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BGA PACKAGE thermal profile
Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
Text: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series
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XC73108.
BGA PACKAGE thermal profile
225-pin BGA
X3365
fine BGA thermal profile
XC73108
TEXTOOL zif
capacitance in BGA package
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O
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518-77-NNNMXX-XXX105
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX135 PGA Interstitial interconnect pin socket, solder tail SERIES 550 Pin grid array sockets with intersitial contact rows, interconnect pin. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability
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550-PP-NNN-XX-XXX135
PCT-GF30-FR
CuZn36Pb3
C36000)
19x19
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX101 PGA Interconnect pin solder tail SERIES 550 Pin grid array sockets, interconnect pin TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-PP-NNN-XX-XXX101
PCT-GF30-FR
CuZn36Pb3
C36000)
17x17
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX144 PGA Interstitial carrier socket SERIES 614 Pin grid array sockets with intersitial contact rows, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR
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614-PP-NNN-XX-XXX144
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX154 PGA Interstitial socket, Surface mount SERIES 514 Pin grid array sockets with interstitial contact rows, surface mount floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR
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514-PP-NNN-XX-XXX154
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX147 PGA Interstitial socket, Solderless compliant press-fit SERIES 546 Pin grid array sockets with interstitial contact rows, solderless compliant pins. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR
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546-PP-NNN-XX-XXX147
PCT-GF30-FR
C54400)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX112 PGA Carrier SERIES 614 Pin grid array sockets, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact
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614-PP-NNN-XX-XXX112
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 517-PP-NNN-XX-XXX111 PGA Interstitial socket, Solder tail SERIES 517 Pin grid array sockets with interstitial contact rows, solder tails. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve
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517-PP-NNN-XX-XXX111
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX117 PGA Surface mount SERIES 514 Pin grid array sockets, surface mount with floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000
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514-PP-NNN-XX-XXX117
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX136 PGA Solderless compliant press-fit SERIES 546 Pin grid array sockets, with compliant press-fit terminations. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Bronze CuSn4Pb4Zn4 C54400
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546-PP-NNN-XX-XXX136
PCT-GF30-FR
C54400)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200)
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510-PP-NNN-XX-XXX101
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200)
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510-PP-NNN-XX-XXX101
PCT-GF30-FR
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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35x35 bga
Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169
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PREC68
35x35 bga
C17200
C54400
540-88-084-17-400
CuSn4Pb4Zn4
MO-052 footprint
157 BGA socket
51877
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PDF
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PCT-GF30
Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount
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Preci-Dip Durtal SA
Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin
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CH-2800
540-PP-020-24-000-1
540-PP-028-24-000-1
540-PP-032-24-000-1
540-PP-044-24-000-1
540-PP-052-24-000-1
540-PP-068-24-000-1
540-PP-084-24-000-1
Preci-Dip Durtal SA
C17200
510-91-168-17
pga 132 packaging
CuSn4Pb4Zn4
94vo fr4
Durtal
SMD 2.54 90 Header
514-PP-NNNMXX-XXX148
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60068-2-14Na
Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 [email protected] The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.
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E174442.
16x16
19x19
20x20
60068-2-14Na
13x13
C17200
pin grid array ppm
IEC, cyclic moisture resistance test
510-PP-NNN-XX-XXX101
17x17 bga thermal resistance
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PDF
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Actel a1280
Abstract: VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
Text: Military Field Programmable Gate Arrays Features ACT 3 Features • Highly Predictable Performance with 100 Percent Automatic Placement and Routing • Device Sizes from 1200 to 10,000 gates up to 25,000 PLD equivalent gates • Up to 4, Fast, Low-Skew Clock Networks
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20-pin
Actel a1280
VKS FPGA CQFP 172
actel 1020
A1020 smd TRANSISTOR
5962-9215601MXA
5962-9096503MTC
equivalent transistor A1020 y 7 b
Actel A1020
ACTEL A1010
actel 1020 datasheet
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PDF
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XC68307
Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604
Text: High-Performance Internal Product Portfolio Overview Issue 10 Fourth Quarter, 1995 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MOS11
MOS13
BR729/D,
XC68307
toshiba Motherboards laptop layout
MC68230P
XC68834
B47K
PPC860
XC68836
XC68040
XCF5102
XPC604
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PDF
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
Text: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002 Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or
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Untitled
Abstract: No abstract text available
Text: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929
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