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    PLASTIC PACKAGING AND THE EFFECTS OF SURFACE MOUNT Search Results

    PLASTIC PACKAGING AND THE EFFECTS OF SURFACE MOUNT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd
    BLM15PX330BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 33ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX600SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 60ohm POWRTRN Visit Murata Manufacturing Co Ltd

    PLASTIC PACKAGING AND THE EFFECTS OF SURFACE MOUNT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    200B

    Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 200B AN598 DK-2750 RG41 popcorn defect analysis to-220 PDF

    Moisture Sensitivity Levels MICROCHIP PIC Package

    Abstract: 78610 delamination leadframe barber excursion AN598
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 Moisture Sensitivity Levels MICROCHIP PIC Package 78610 delamination leadframe barber excursion AN598 PDF

    tm 1628 smd

    Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 DS00599B-page tm 1628 smd AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN PDF

    1n4733 smd

    Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 DS00599B-page 1n4733 smd moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on PDF

    SN63 PB37 alpha

    Abstract: No abstract text available
    Text: ^EDI Ceramic SOJ Electronic D#rign*lnc. Military Surface Mount Advances in the density ol Static SRAM and Dynamic Surface Mount Packages (DRAM) memory devices have resulted in increased die size Packaging of active devices for surface mount has been and elevated power requirements. With these issues, the


    OCR Scan     		PDF

    MT-092

    Abstract: MT092 TVS marking ED VISHAY 7506 Analog devices TOP marking Information IEC1000 IEC1000-4 IEC1000-4-1 IEC1000-4-2 IEC1000-4-3
    Text: MT-092 TUTORIAL Electrostatic Discharge ESD OUT-OF-CIRCUIT OVERVOLTAGE PROTECTION FROM ESD Linear ICs such as op amps, in-amps, and data converters be protected prior to the time that they are mounted to a printed circuit board. That is an out-of-circuit state. In such a condition, ICs are


    Original     		MT-092 MT-092 MT092 TVS marking ED VISHAY 7506 Analog devices TOP marking Information IEC1000 IEC1000-4 IEC1000-4-1 IEC1000-4-2 IEC1000-4-3 PDF

    MIL-R-55342

    Abstract: MIL-R-55342/07
    Text: SURFACE MOUNT _QJBC THE RESISTOR PEOPLE TANFILM PRECISION CHIP RESISTORS PFC SERIES • • • • • • • • Ultra stable Tantalum Nitride resistor film system Qualified to MIL-R-55342 Passivated TaNFilm element Wrap around termination Performance exceeds MIL-R-55342 characteristic E


    OCR Scan     		MIL-R-55342 MIL-R-55342 ---------W1206 MIL-R-55342/07 W0805 MIL-R-55342/06 RM1206 RM0705 MIL-R-55342/07 PDF

    SN62 PB36 ag2

    Abstract: powerflex TO220 land pattern land pattern for tvSOP powerflex ktp r-psfm-g2 TO-220 package thermal resistance JESD51-2 IPC-SM-782 SCBA009 kte 132
    Text: PowerFLEX  Surface-Mount Alternative for Through-Hole Power Packages SZZA015 April 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		SZZA015 SN62 PB36 ag2 powerflex TO220 land pattern land pattern for tvSOP powerflex ktp r-psfm-g2 TO-220 package thermal resistance JESD51-2 IPC-SM-782 SCBA009 kte 132 PDF

    822 smd

    Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


    Original     		PDF

    SMD codes databook

    Abstract: SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap manufacturing process calcium chloride ic shelf life MIL-STD-38510 QFP Shipping Trays
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


    Original     		PDF

    intel packaging handbook 240800

    Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
    Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and


    Original     		CH08WIP intel packaging handbook 240800 Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging PDF

    J-STD-020 MSL Rating

    Abstract: mil J-STD-020
    Text: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    Original     		2002/95/EC, 2005/618/EC. J-STD-020 MSL Rating mil J-STD-020 PDF

    Untitled

    Abstract: No abstract text available
    Text: KEMET Surface Mount Ceramic Revision H, 9 June 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    Original     		2002/95/EC, 2005/618/EC PDF

    90Sn10

    Abstract: No abstract text available
    Text: KEMET Surface Mount Ceramic Revision Nil, 01 November 2005 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    Original     		2002/95/EC, 2005/618/EC. 90Sn10 PDF

    8700 CJ

    Abstract: 1N5817 1N5818 1N5819 UMA5817 UMA5818 UMA5819 FOOTPRINT MELF BA 5818
    Text: UMA5817, UMA5818, and UMA5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UMA5817 thru UMA5819 UltraMite™ series offers small efficient surface mount packaging with the same electrical features as the popular


    Original     		UMA5817, UMA5818, UMA5819 UMA5817 UMA5819 1N5817, 1N5818, 1N5819 DO-214AC 8700 CJ 1N5817 1N5818 UMA5818 FOOTPRINT MELF BA 5818 PDF

    do-214ac footprint

    Abstract: BA 5818 5817 MICROSEMI Schottky melf 5818 1n5819 melf 8700 CJ 1N5817 1N5818 1N5819 UMA5817
    Text: UMA5817, UMA5818, and UMA5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UMA5817 thru UMA5819 UltraMite™ series offers small efficient surface mount packaging with the same electrical features as the popular


    Original     		UMA5817, UMA5818, UMA5819 UMA5817 UMA5819 1N5817, 1N5818, 1N5819 DO-214AC do-214ac footprint BA 5818 5817 MICROSEMI Schottky melf 5818 1n5819 melf 8700 CJ 1N5817 1N5818 PDF

    IC51-0562-1514

    Abstract: Yamaichi IC51-0644-807 footprint IC51-0562 socket tqfp 56 socket Yamaichi TQFP IC51-0804-808 IC51-0644-807
    Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology SCZA003A March 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		SCZA003A IC51-0562-1514 Yamaichi IC51-0644-807 footprint IC51-0562 socket tqfp 56 socket Yamaichi TQFP IC51-0804-808 IC51-0644-807 PDF

    Yamaichi IC51-0644-807 footprint

    Abstract: IC51-0562-1514 IC51-0804-808 IC51-0562 socket TQFP 80 PACKAGE footprint Yamaichi IC51-0804-808 footprint ssop 0.635 IC51-0562 IC51-0644-807 TQFP 256 PACKAGE footprint
    Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology Tom Jackson Advanced System Logic – Semiconductor Group SCZA003A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		SCZA003A Yamaichi IC51-0644-807 footprint IC51-0562-1514 IC51-0804-808 IC51-0562 socket TQFP 80 PACKAGE footprint Yamaichi IC51-0804-808 footprint ssop 0.635 IC51-0562 IC51-0644-807 TQFP 256 PACKAGE footprint PDF

    mar 618

    Abstract: MAR 618 transistor
    Text: KEMET Surface Mount Ceramic Array Revision C, 12 Mar 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    Original     		2002/95/EC, 2005/618/EC mar 618 MAR 618 transistor PDF

    JESD22a121

    Abstract: JESD201 JESD201 B
    Text: KEMET Surface Mount Ceramic Revision A, 1 Novembert 2011 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    Original     		2002/95/EC, 2005/618/EC JESD22a121 JESD201 JESD201 B PDF

    EIA-469

    Abstract: JESD22a121 JESD22-A121 MIL-PRF-55581 EIA-459 kemet COTS X5R 0402cog NC0402C
    Text: KEMET Surface Mount Ceramic Revision I, 22 Sept 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


    OCR Scan     		MIL-PRF-55581 L-PRF-55581 EIA459 EIA-469: 2002/95/EC, 2005/618/EC P/NC0402C 7S07PP EIA-469 JESD22a121 JESD22-A121 EIA-459 kemet COTS X5R 0402cog NC0402C PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    UPS840e3

    Abstract: EIA-481-2
    Text: UPS840e3 POWERMITE 3 SURFACE MOUNT 8 AMP 40 V SCHOTTKY RECTIFIER SCOTTSDALE DIVISION APPEARANCE The UPS840e3 offers a small and powerful surface mount package that is RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications


    Original     		UPS840e3 UPS840e3 EIA-481-2 PDF

    do-214ac footprint

    Abstract: pc f817 JANTX 1N5817 8700 CJ 1N5818 1N5819 UMAF5817 UMAF5818 UMAF5819 1N5817
    Text: UMAF5817, UMAF5818, and UMAF5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION ENVIRONMENTALLY LEAD-FREE APPEARANCE The UMAF5817 thru UMAF5819 UltraMite™ series offers a Lead-Free construction both internally and externally in a small efficient surface


    Original     		UMAF5817, UMAF5818, UMAF5819 UMAF5817 UMAF5819 1N5817, 1N5818, 1N5819 DO-214AC do-214ac footprint pc f817 JANTX 1N5817 8700 CJ 1N5818 UMAF5818 1N5817 PDF