din 17410
Abstract: 17410 ndfeb DIN17410 plastic raw material disadvantages reed sensor sensormagnet low cost force sensor
Text: ABOUT MAGNETS MEDER electronic Magnets and Their Specifications Magnets are available in multiple specifications on the market. Almost all dimensions and geometries can be realized. To activate the reed switch a magnet magnet field is needed. The different magnet materials have
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din 17410
Abstract: magnetic flux density for different material ferrit Magnet ndfeb plastic raw material Magnetic resistance
Text: ABOUT MAGNETS MEDER electronic Magnets and their specifications Magnets are available in multiple specifications on the market. Almost all dimensions and geometries can be realised. To activate the reed switch a magnet magnet field is needed. The different magnet materials have
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INCOMING RAW MATERIAL specification
Abstract: INCOMING RAW MATERIAL INSPECTION RAW MATERIAL SPECIFICATION SHEET belt DOCTOR INCOMING RAW MATERIAL NTC Thermistor Quality Thermistor SENSOR plastic raw material back Tunnel diode
Text: INCOMING INSPECTION All raw materials, after being received in, are inspected to verify that their physical and electrical attributes are acceptable. A unique ID# is assigned and used for lot traceability. « Back RAW MATERIAL BLEND NTC thermistor manufacturing begins with the precise blending of raw materials into an organic
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termistor NTC
Abstract: Thermistor ntc termistor marking code Quality Thermistor SENSOR INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL specification NTC Thermistor termistor plastic raw material NTC Termistor
Text: NTC Thermistor Manufacturing Process INCOMING INSPECTION All raw materials, after being received in, are inspected to verify that their physical and electrical attributes are acceptable. A unique ID# is assigned and used for lot traceability. « Back RAW MATERIAL BLEND – BEGINNING OF THERMISTOR MANUFACTURING PROCESS
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
Text: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods
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DB81-10002-2E
CERAMIC PIN GRID ARRAY wire lead frame
BGA and QFP Package
TO metal package aluminum kovar
TSOP 2E
TSOP 54 Package
nail
qfp 32 land pattern
ceramic pin grid array package plating
ceramic pin grid array package lead finish
PGA wire bonding
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190721
Abstract: No abstract text available
Text: 2: As s emb ly M a te r i a l 2.10 Washers 2.10.1 Washer Description Material Ø Ø Ø Ø Steel, Steel, Steel, Steel, 2.8 3.2 4.3 4.3 / / / / 7.0 M2.5 7.0 (M3) 9.0 (M4) 12.0 (M4) zinc-plated zinc-plated zinc-plated zinc-plated Part-No. 1 pc. 5630-01 5630-02
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BC501
Abstract: BC transistor series
Text: BC 501 Battery Contacts Battery Contact Specifications Materials Contact Material: Phosphor Bronze #510 Alloy Finish: .00001 Gold over .00002 Nickel Package Size: 7"x12mm: 1000 pieces per reel Taping Specification: EIA-481 Electrical: Maximum Current: 2.0 amperes
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x12mm:
EIA-481
BC-501
2002/95/EC
BC501
BC transistor series
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Untitled
Abstract: No abstract text available
Text: ll a 3 4| V>| TOP VERSION NOTES: MATERIAL: 1 HOUSING: HIGH TEMP. PLASTIC , COLOR BLACK TERMINAL PHQSPHQR BRONZE BOTTOM VERSION 2 - PLATING CONTACT AREA: OPTIONAL SEE TABLE SOLDER TAIL: SnPb 90/10 2jun MIN ND RAW EDGES EXERT SOLDER T A ILS TIPS 3 - AREA FOR VACUUM PICK AND PLACE VENTURY
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EO0148
EI0165
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Untitled
Abstract: No abstract text available
Text: UNLESS OTHERWISE SPECIFIED THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. 2. ooodoooooodo: PLASTIC: THERMOSET PLASTIC MATERIAL WITH FLAMMABILITY RATING UL 9 4 V - 0 OR BETTER. SOLDERABILITY: CONFORMS TO A N S I/J - S T D - 0 0 2 ,
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J-STD-003A
HX1294FNL
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Untitled
Abstract: No abstract text available
Text: www.pulseelectronIcs.com NOTES: UNLESS OTHERWISE SPECIFIED NOTICE: THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. KoHii—b ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. @ Pulse s/ H1313FNL DATE CODE C T R Y MFG 2. PLASTIC: THERMOSET PLASTIC MATERIAL WITH FLAMMABILITY
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H1313FNL
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Untitled
Abstract: No abstract text available
Text: ¿rûPulse ^ Electronics www.pulseelectronics.com NOTES: UNLESS OTHERWISE SPECIFIED 1. NOTICE: R o H S -6 s / @ Pulse THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. H1313NL • 2. PLASTIC: THERMOSET PLASTIC MATERIAL WITH FLAMMABILITY
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H1313NL
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Untitled
Abstract: No abstract text available
Text: 85.75 14.00 - INNNER LIGHT NOTES: 1. MATERIAL: CONNECTOR * HOUSING: GLASS FILLED LIQUID CRYSTAL POLYMER LCP UL94V-0. BLACK. Z lA TERMINALS: PH O S-BRO N ZE t=0.2m m . A OVERMOLDED TERMINAL HOUSING: GLASS FILLED LIQUID CRYSTAL POLYMER(LCP) UL94V-0. BLACK.
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UL94V-0.
175mm.
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944F
Abstract: TAB-QFP10 QFP4 904f SLA9000F 441T 144 pin qfp
Text: SLA40000 seríes Available as of November, 1996 Part No. Double-layer metal Triple-teyer metal of pins Package code Pin length subcode 4078 4115 4162 4239 4318 4411 Raw gates 28.260 46.864 78,600 115.388 162j864 318,308 411,257 Usable gates 22.026 35,370 51,924
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SLA40000
162j864
QFP12
QFP17
QFP18
QFP21
QFP16
QFP20
944F
TAB-QFP10
QFP4
904f
SLA9000F
441T
144 pin qfp
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115B-AAA0-R01
Abstract: LGS25-200-IO/110/115B
Text: 10 MATERIAL AND SWITCH CIRCUIT Housing WHEN CARD IS EJECTED WHEN CARD IS INSERTED A LCP UL94V-0 Black B Cover LCP UL94V-0 Black Phosphor Bronze C5191,Gold Flash Over Nickel c Contact Solder Tail: Tin Plating FINISH AS BELOW E F G H SPECIFICATION: 1. ELECTRICAL
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UL94V-0
C5191
30mfi
1000MI2
500VAC
50PCS
DISK298
115B-XXXX-R01
115B-XXXX-
115B-AAA0-R01
LGS25-200-IO/110/115B
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65069
Abstract: 408-6927
Text: High Speed, Controlled Impedance Tw o-Piece Connectors MICTOR, M icro-Strip and Z-PACK Stripline 100 Interconnection System s A lV I F» Catalog 65194 Revised 8-97 Micro-Strip Right-Angle Receptacles with Guides (Board-to-Board) Material and Finish: H o using — High-temperature thermo
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Untitled
Abstract: No abstract text available
Text: 4 3 1 3.72 REC O M M EN D ED PA N EL CUTOUT 2 .2 9 D.51 r t 4 -0 1 .5 7 3 -0 3 .2 5 15.75 10 9 1 2 1 1 1.02 ^ 1 0 9 1 2 / i l _ 1 0 9 8- * f 4 & M # A 7 5 1!_3 „ 2.7 8 4 8 -0 0 .8 9 MATERIALS: PLASTIC HOUSING: ENGINEERING THERMOPLASTIC FLAMM BILITY RATING UL 9 4 V - 0 .
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Untitled
Abstract: No abstract text available
Text: .6 9 8 NOTES: UNLESS OTHERWISE SPECIFIED [1 7 .7 3 ] OODDOOOBDDOOOOO: 1. THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. .6 4 0 [1 6 .2 6 ] Pulse .4 8 H5578NL HEADER: THERMOSET PLASTIC MATERIAL WITH FLAMMABILITY
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H5578NL
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PC241R
Abstract: No abstract text available
Text: Revision Rev. Description Date Approved 4 HOLES Dim range m m Tolerance (m m ) Qualtek E le c tro n ic s Corp. F A N -S DIVISION Q 9 1 5 0 -G Part Number: Description: 0 -1 0.15 1 -6 0.20 6 -1 8 0.30 Material: 1 8 -5 0 5 0 -1 2 0 1 2 0 -2 5 0 0.50 0.70
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PC241R
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PIC111
Abstract: No abstract text available
Text: AM P A M P L IM IT E Subm iniature D Connectors Catalog 82068 Revised 9-96 AMPLIMITE .050 Series, SCSI-2, -3, High Density Wide Terminators With Internal Shield, All-Plastic Cover, Low Profile, With Jackscrews Plug, 68-Position Material and Finish: S h e ll— Steel, plated .000200
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68-Position
7S7312
PIC111
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1N4148WS
Abstract: 1N4448WS Scans-00849
Text: C RECTRON 1N4448WS SEMICONDUCTOR TECHNICAL SPECIFICATION SURFACE MOUNT FAST SWITCHING DIODE Features High Conductance Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Application Plastic Material - UL Recognition Flammability
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1N4448WS
OD-323,
MIL-STD-202,
OD-323
1N4148WS,
1N4148WS-BAV16WS
1N4148WS
1N4448WS
Scans-00849
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sonion
Abstract: No abstract text available
Text: II ^ □ LO °ì O 2- Mïïïïiï MOM. □ 13.8 raw flflM 6.7 24.2 35.8 48.8 i l f /NOTE: 1 . m /SAFETY: 1-1. M /RATING: 100V AC MAX or 12V DC 2A MAX 1-2. /INSULATION RESISTANCE: 50M ohm MIN at 250V DC 1-3. /WITHSTANDING: 250V AC at 1 MINUTE 2- ^M/MATERIAL:
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QC0361
sonion
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E338653
Abstract: BF303
Text: NOTES: 1. MATERIAL: HOUSING : NYLON 6, UL 94V-2, FILE NO. E338653 2. LEAD WIRE IN LOOP: 16AWG, UL-CSA, 105°C, UL1015, 600V, TOTAL LENGTH 8.125" 3. MAXIMUM CURRENT: 10A 4. MELTING POINT: 200°C 5. INSULATION RESISTANCE AT 500V DC: 100MQ MIN 6. CONTACT RESISTANCE: 5MQ AT 1A DC
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E338653
16AWG,
UL1015,
100MQ
BF303
BF303
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Untitled
Abstract: No abstract text available
Text: A 1012 SERIES DIN SOCKETS/MINIATURE CONNECTORS WITH FULL SHIELD MATERIAL HOUSING: THERM< PLASTIC UL94V-0) HOUSING COLOR: SEE ORDER INFORMATION TERMINAL: COPPER ALLOY TERMINAL PLATING: SEE ORDER INFORMATION SHELL: COPPER ALLOY SHELL PLATING: SEE ORDER INFORMATION
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UL94V-0)
A1012â
2705C
2715C)
3385C
3395C)
P1014
A1012-
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Untitled
Abstract: No abstract text available
Text: REV. DESCRIPTION DATE — RELEASE Mur. 01, 2002 2 E= N0, OF POSITION PER (NO. OF POSITION PER F=(NO. OF POSITION PER (NO. OF POSITION PER El El H IBI Bl IBI Bl 13 IBI H Bl Q Q MATERIALS w r 1. HOUSING 2. TERMINAL HI.-TEMP. PLASTIC (UL 94V-D , BLACK. S.Q. 0.40m m COPPER ALLOY.
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5000M
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