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    PQFN 5 LEADS Search Results

    PQFN 5 LEADS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    PQFN 5 LEADS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5823DC FDMF5823DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5822DC FDMF5822DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5823DC FDMF5823DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5822DC FDMF5822DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5823DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5823DC FDMF5823DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5822DC – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture Description The SPS family is Fairchild’s next-generation, fully


    Original     		FDMF5822DC FDMF5822DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5833 com/dwg/PQ/PQFN31B PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5833 com/dwg/PQ/PQFN31B PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5826DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5826DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5821DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5833 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 50 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5833 com/dwg/PQ/PQFN31B PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5820DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5820DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5839 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 35 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5839 com/dwg/PQ/PQFN31B PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5821DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5820DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5820DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5826DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5826DC com/dwg/PQ/PQFN31A PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5839 – Smart Power Stage SPS Module with Integrated Thermal Warning and Thermal Shutdown Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET •   High Current Handling: 35 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5839 com/dwg/PQ/PQFN31B PDF

    Untitled

    Abstract: No abstract text available
    Text: FDMF5821DC – Smart Power Stage SPS Module with Integrated Temperature Monitor Features • Ultra-Compact 5 mm x 5 mm PQFN Copper-Clip Package with Flip Chip Low-Side MOSFET and Dual Cool Architecture •   High Current Handling: 60 A  Auto DCM (Low-Side Gate Turn Off) Using


    Original     		FDMF5821DC com/dwg/PQ/PQFN31A PDF

    AP070G

    Abstract: MAAP-000070-TR0500 AP070 500 watt RF amplifier GHz MAAP-000070-PKG003 MAAP-000070-SMB003 S2083 VD12
    Text: MAAP-000070-PKG003 Rev. B Amplifier, Power, 1.6W 10.0—13.25 GHZ PIN 1 N/C N/C RF IN N/C The 5 mm PQFN package has a lead-free finish of leads that are RoHS compliant and is compatible with a 260oC reflow temperature. The package also features low lead inductance and an


    Original     		MAAP-000070-PKG003 260oC MAAP-000070-PKG003 AP070G MAAP-000070-TR0500 AP070 500 watt RF amplifier GHz MAAP-000070-SMB003 S2083 VD12 PDF

    PQFN package power freescale

    Abstract: PQFN 5 leads PQFN 180901 g
    Text: DETAIL G P IN 1 INDEX DETAIL M 1. 00 0. 82 0 . 1 C A B rh 0. 0 5 ® C FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. t i t l e THERMALLY VIEW MECHANICAL OUTLINE ENHANCED POWER QUAD FLAT N O N -LE A D E D PACKAGE PQFN 16 TERMINAL, 0 .8 PITCH (5 X 5 X 2 .1 )


    OCR Scan     		98ARL10604D 5M-1994. PQFN package power freescale PQFN 5 leads PQFN 180901 g PDF

    MAAP-000070-PKG003

    Abstract: AP070G MAAP-000070-MCH000 MAAP-000070-SMB003 MAAP-000070-SMB004 S2083 VD12 im339
    Text: RoHS Compliant MAAP-000070-PKG003 Amplifier, Power, 1.6W 10.0-13.25 GHz PIN 1 N/C N/C N/C VGG Each device is 100% RF tested to ensure performance compliance. The part is fabricated using M/A-COM’s GaAs Multifunction Self-Aligned Gate (MSAG) Process. The 5 mm PQFN package has a lead-free finish of leads that


    Original     		MAAP-000070-PKG003 260oC MAAP-000070-PKG003 ful03 MAAP-000070-SMB003 AP070G MAAP-000070-MCH000 MAAP-000070-SMB003 MAAP-000070-SMB004 S2083 VD12 im339 PDF

    PQFN

    Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
    Text: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN


    Original     		AN2467/D AN2467/D PQFN PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5 PDF

    PQFN

    Abstract: DUAL ROW QFN leadframe PQFN footprint "exposed pad" PCB via JESD51-5 AN2467 PQFN package power freescale PQFN 8 leads
    Text: Freescale Semiconductor Application Note AN2467 Rev. 4.0, 4/2007 Power Quad Flat No-Lead PQFN Package 1 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance attributes such as Moisture Sensitivity


    Original     		AN2467 PQFN DUAL ROW QFN leadframe PQFN footprint "exposed pad" PCB via JESD51-5 AN2467 PQFN package power freescale PQFN 8 leads PDF