MIL-STD-883 Method 2010
Abstract: MIL-STD-883 method 2003
Text: HOLT PLASTIC PACKAGE PROCESS OPTIONS I = Industrial Grade -40°C to +85°C T = High Temp Grade (-55 °C to +125°C) M = Military Grade (-55°C to +125°C) PROCESS FLOW PROCESS STEP I T M INCOMING WAFER INSPECTION X X X WAFER PROBE 100% 100% 100% SAW X X
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MIL-STD-883 Method 2010
MIL-STD-883 method 2003
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Mil-Std-883 Wire Bond Pull Method 2011
Abstract: mil-std-883 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge
Text: HOLT CERAMIC PACKAGE PROCESS OPTIONS I = Industrial Grade -40°C to +85°C M = Military Grade (- 55°C to +125°) T = High Temp Grade (-55°C to +125°C) DSCC = Mil-STD-883 Compliant PROCESS FLOW PROCESS STEP I T M DSCC COMMENTS X X X X INCOMING WAFER INSPECTION
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Mil-STD-883
MIL-STD-883,
Mil-Std-883 Wire Bond Pull Method 2011
mil-std-883 2015
MIL-STD883
MIL-STD-883 Method 2010
MIL-STD-883 method 2011
mil-std-883* 2015
centrifuge
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CS1D-PA207R
Abstract: No abstract text available
Text: PLC-based Process Control Series Programmable Controllers CS1W-LC Loop Control Boards/Units Ver. 3.0 Version Upgrade CS1D-CPU P CS1D Process CPU Units (for Duplex-CPU Systems) WS02-LCTC1-EV5 CX-Process Tool Ver. 5.0 (Version Upgrade) CS1W-P Process Analog I/O Units 8-input Models Added to Series
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WS02-LCTC1-EV5
16-input
NL-2132
CS1D-PA207R
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wafer fab control plan
Abstract: SPC3 SPC2 LINEAR TECHNOLOGY flowchart
Text: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area
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statistical process control
Abstract: wafer fab control plan pareto process control system spc data sheet SPC Technology TIONA wafer fab control SPC-2 SPC-3
Text: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area
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Untitled
Abstract: No abstract text available
Text: EMI Chip Filters 4.13 to 4.16 4.13 - Production process flowchart Ceramic powder preparation 4.15 - Tests conducted during batch manufacture Syfer reliability SM product group Electrode ink material Multilayer build wet process Fire Rumble DPA inspection
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MIL-STD-123)
AEC-Q200.
AN0009.
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Sample form for INCOMING Inspection of RAW MATERIAL
Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING PACKAGING MATERIAL INSPECTION form MATERIAL INSPECTION QUALITY QUANTITY inspection sampling plan
Text: Quality 1 Manufacturing process and quality assurance Manufacturing process Quality assurance Incoming goods Inspection of raw materials and parts Quality gate Preproduction Weighing Milling Specific surface, grain size Pre-sintering Powder release vis., mech., el. inspection
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thermistor ptc 10d
Abstract: INCOMING INSPECTION PROCEDURE thermistors book 28591
Text: Quality 1 Manufacturing process and quality assurance Manufacturing process Quality assurance Incoming goods Inspection of raw materials and parts Quality gate Preproduction Weighing Milling Specific surface, grain size Pre-sintering Powder release vis., mech., el. inspection
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visual inspection of raw materials
Abstract: quality control assurance and reliability
Text: QUALITY ASSURANCE FLOW CHART CHEMICALS, GASES, HARDWARE WAFERS RAW MATERIALS MASKS QUALITY ASSURANCE PROCUREMENT REVIEW VENDOR CONTROL INCOMING INSP. QA IN-PROCESS AUDIT QA IN-PROCESS AUDIT S.E.M. INSPECTION NEW PRODUCT DESIGNS AND CURRENT DESIGNS, NEW-CURRENT PROCESSES,
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OA-003
visual inspection of raw materials
quality control assurance and reliability
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in-process quality inspections
Abstract: process flow diagram
Text: 9 OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical and visual/mechanical
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sn63pb37 solder SPHERES
Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual
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AN-353-4
AN-353
AN-81.
sn63pb37 solder SPHERES
J-STD-020 SAC305
JEDEC J-STD-020d.1
Altera Flip Chip BGA warpage
reflow profile SAC305 bga
ALTERA AN81
sn63pb37 solder wire
sn63pb37 solder wire shelf life
pcb warpage in ipc standard
J-STD-020D
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Untitled
Abstract: No abstract text available
Text: CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE ASSEMBLY OPERATION IN-PROCESS INSPECTION IN PROCESS 2 C3 TRIM STIFFENER C1, C2, C4 REVISION M NOTE: 1. C FJH-XX-X-XX.XX-X REPRESENTS A CRITICAL DIMENSION. LENGTH SPECIFY IN -XX INCHES .125 .0118 REF DO NOT
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002SPECIFY
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Abstract: No abstract text available
Text: CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE ASSEMBLY OPERATION IN-PROCESS INSPECTION IN PROCESS 2 C3 TRIM STIFFENER C1, C2, C4 REVISION N NOTE: 1. C REPRESENTS A CRITICAL DIMENSION. DO NOT SCALE FROM THIS PRINT FC-XX-0.5 STRIP LENGTH -4: 4MM .15748"
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Abstract: No abstract text available
Text: Application Report Accurate cutting process Precision up to the second decimal place Accurate guiding of label webs during the cutting process Label webs are guided through the cutting process at a speed of up to 200 meters per minute, which is far beyond the operator’s ability to capture
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termistor NTC
Abstract: Thermistor ntc termistor marking code Quality Thermistor SENSOR INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL specification NTC Thermistor termistor plastic raw material NTC Termistor
Text: NTC Thermistor Manufacturing Process INCOMING INSPECTION All raw materials, after being received in, are inspected to verify that their physical and electrical attributes are acceptable. A unique ID# is assigned and used for lot traceability. « Back RAW MATERIAL BLEND – BEGINNING OF THERMISTOR MANUFACTURING PROCESS
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Abstract: No abstract text available
Text: February 10, 2005 CN-502101 Product Change Notification Die Sales Production Process Change Dear Valued Customer: This notice is to inform you that Mindspeed Technologies has been notified of a process change by our die sales subcontract supplier. Reject die identified at the post-saw inspection
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CN-502101
mXX-PCN-001-A
E09-901
02XXX-PCN-001-A
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reliability data analysis
Abstract: No abstract text available
Text: 1 GENERAL INFORMATION Reliability INTRODUCTION Vantis’ and AMD’s Qualification Maintenance Program QMP is used to measure the reliability of all process technologies on a regular basis. This is an extensive effort that is aimed at providing generic fab process coverage for all fab process technologies. Typically about 30,000 devices per
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A -1123* test
Abstract: Family of Testability Products process flow diagram
Text: pASIC 1 FAMILY Quality Program OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical, visual/mechanical and check on the
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Abstract: No abstract text available
Text: Temperature & Process Controller Operator’s Manual NEWPORT Electronics, Inc. http://www.newportUS.com/i Additional products from ® NEWPORT Electronics, Inc. Counters Frequency Meters PID Controllers Clock/Timers Printers Process Meters On/Off Controllers
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1-800-NEWPORT
800-NEWPORTSM
D-75392
M3355/N/1102
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Surface Mounted Semiconductors General QUALITY • In-line quality assurance to m onitor process reproducibility during m anufacture and initiate any necessary corrective action. C ritical process steps are 100% under statistical process control
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MBB439
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INCOMING MATERIAL FLOW PROCESS
Abstract: outgoing quality
Text: QUALITY ASSURANCE ISO 9002 Approved Certificate No. QSC-4321 1. PROCESS QUALITY CONTROL C QUALITY INSPECTION INSTRUCTION E) PROCESS AUDIT A) FLOW CHART (B ) ENGINEERING SPEC. 2. OUTGOING QUALITY CONTROL (B ) QUALITY AUDIT (A)FINAL INSPECTION S 3. INCOMING QUALITY CONTROL
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QSC-4321
INCOMING MATERIAL FLOW PROCESS
outgoing quality
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corcom
Abstract: No abstract text available
Text: i Z A jBO UL RECOGNIZED CSA CERTIFIED VDE APPROVED 0 .7 8 0 MAX LIN E IN PROCESS IN PROCESS IN PROCESS OPERATING SPECIFICATIONS, LINE VOLTAGE/CURRENT, LINE FREQUENCY, MAX. LEAKAGE CURRENT. EACH LINE TO GROUND OPERATING AMBIENT TEMP. RANGE, 0 .B 8 9 ± .0 0 B
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AMP/40
50-60HZ
corcom
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MA4GM2
Abstract: No abstract text available
Text: GaAs FET MMIC Control Product Process Screening and Quality Procedures In processing G aAs FE T MMIC Control Products, consistency and reproducibility is ensured by measuring key electrical parameters on each wafer at the main steps and using the results for statistical process control. If a process goes out
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Abstract: No abstract text available
Text: Temic S e m i c o n d u c t o r s Quality Information TEMIC’s Continuous Improvement Activities • • T EM IC qualifies m aterials, processes and process changes • T EM IC uses Process FM EA Failure M ode and Effects Analysis for all processes. Process and
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