qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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si4730-d60-gu
Abstract: SI4735-D60-GU Si473x si4734 Si47XX si4735-d60 am sw fm radio PCB schematic diagram si4730d60gu Si470x SI4731 D60
Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features Ordering Information: See page 32. Pin Assignments Si473x QFN Applications NC Modules for consumer electronics Clock radios Mini HiFi and docking stations
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Si4730/31/34/35-D60
Si473x
si4730-d60-gu
SI4735-D60-GU
Si473x
si4734
Si47XX
si4735-d60
am sw fm radio PCB schematic diagram
si4730d60gu
Si470x
SI4731 D60
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RF5602
Abstract: RF5602SB 802.16e wimax chip RF5602WM33410 RF56023
Text: RF5602 RF56023.3 V to 5.0 V, 2.3 GHz to 2.7 GHz Linear Power Amplifier 3.3 V TO 5.0 V, 2.3 GHz TO 2.7 GHz LINEAR POWER AMPLIFIER Package Style: QFN, 16-Pin, 3 mm x 3 mm x 0.45 mm Features Single 3.3 V to 5 V Supply 32 dB to 34 dB Small Signal Gain
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RF5602
RF56023
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11b/g/n
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RF5602WM33410
RF5602WL50410
RF5602WL33410
RF5602WB50410
RF5602WB33410
RF5602SB
802.16e wimax chip
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24 leads qfn 5x5
Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some
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AN0017-8206
24 leads qfn 5x5
qfn 3X3 land pattern
JESD47D
28 leads qfn 4x5
QFN 20 5x5 "recommended PCB Layout"
JEDEC J-STD-033b
marking 8206
Jedec jesd47d
AN0017
qfn 5x5 thermal resistance
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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JEDEC Drawing MO-220 qfn
Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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MIL-STD-1686C
Abstract: 24L-QFN CHS2411-QDG AN0017 s2411 SP4T package 1686C
Text: CHS2411-QDG RoHS COMPLIANT 23-26GHz Reflective SP4T Switch GaAs Monolithic Microwave IC in QFN package Description The CHS2411-QDG is a monolithic reflective SP4T switch in K-Band. Positive supply voltage only is required. The circuit is manufactured with a standard
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CHS2411-QDG
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DSCHS2411-QDG8249
MIL-STD-1686C
AN0017
s2411
SP4T package
1686C
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marking 18w sot23
Abstract: marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG
Text: Tape and Reel Packaging Specifications BRD8011/D Rev. 7, January−2007 SCILLC, 2007 Previous Edition @ 2006 “All Rights Reserved’’ http://onsemi.com Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated.
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BRD8011/D
January-2007
marking 18w sot23
marking code 564 SC-74
BRD8011/D
sot23-6 marking code 561
QFN 64 8x8 footprint
On semiconductor date Code sot-143
24w cooler
tvs SMC MARKING
lg diode 923
SMA marking code LG
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AN0017
Abstract: CHS2411-QDG STD-020C MIL-STD-1686C
Text: CHS2411-QDG RoHS COMPLIANT 23-26GHz Reflective SP4T Switch GaAs Monolithic Microwave IC In QFN package Description n The CHS2411 is a monolithic reflective SP4T Switch in K-Band. Positive supply voltage only is required. The circuit is manufactured with a standard PHEMT process : 0.25µm gate
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CHS2411
DSCHS2411QDG6174
AN0017
CHS2411-QDG
STD-020C
MIL-STD-1686C
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s2083
Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder
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rf 4 mm PQFN
s2083 application
PQFN
jedec package MO-220 32 5x5
qfn 3X3 land pattern
PDFN
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pcb design of zigbee
Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor
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pcb design of zigbee
FBGA 17X17 DRAWING
AN3345
LGA71
an3553
lga 115
71-Contact
AN2731
AN3003
QFN-32
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AN4077
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade
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Si4705-D60-GU
Abstract: No abstract text available
Text: Si4704/05-D60 B ROADCAST F M R ADIO R ECEIVER WITH R D S / R B D S Features Applications Ordering Information: See page 30. Pin Assignments Table and portable radios Mini/micro systems CD/DVD and Blu-ray players
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EN55020
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AN4077
Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade
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AN4077
Freescale MMA845xQ
MMA8453Q
AN4071
MMA8451
mma8452q
MMA8451Q
78MG
MMA845x
MC9S08QE8
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SI4734
Abstract: No abstract text available
Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features Ordering Information: See page 31. Pin Assignments Si473x-D60 QFN DFS Seven selectable AM channel filters AM/FM/SW/LW digital tuning
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Untitled
Abstract: No abstract text available
Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features Ordering Information: See page 31. Pin Assignments Si473x-D60 QFN DFS Seven selectable AM channel filters AM/FM/SW/LW digital tuning
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200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
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200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
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Untitled
Abstract: No abstract text available
Text: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features Not recommended for new designs. For alternatives, see the Si533x family of products. Selectable output frequencies ranging from 19.44 to 1050 MHz
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Si533x
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Untitled
Abstract: No abstract text available
Text: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features Not recommended for new designs. For alternatives, see the Si533x family of products. Selectable output frequencies ranging from 19.44 to 1050 MHz
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note Document Number: AN4622 Rev. 4.0, 6/2013 MMPF0100 and MMPF0200 Layout Guidelines 1 Introduction This document describes good practices for the layout of PF0100 and PF0200 devices on printed circuit boards. Though the guidelines are applicable to PF0100 and PF0200,
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MMPF0100
MMPF0200
PF0100
PF0200
PF0200,
PF0100Z
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