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    QFN 44 PACKAGE FOOTPRINT 7X7 DIE SIZE Search Results

    QFN 44 PACKAGE FOOTPRINT 7X7 DIE SIZE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    QFN 44 PACKAGE FOOTPRINT 7X7 DIE SIZE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


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    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


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    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    DUAL ROW QFN leadframe

    Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This


    Original     		PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    PE33632

    Abstract: PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694
    Text: 2010 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS : The Green RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for


    Original     		PDF and940 10B-6 PE33632 PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694

    TAG 302-600

    Abstract: PE42924
    Text: Changing RF Design. Forever. TM 2013 Commercial Products Product Selection Guide First Edition Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor NASDAQ: PSMI is a fabless provider of high-performance radio-frequency (RF)


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    MIC33163

    Abstract: voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765
    Text: September 2014 Shortform Catalog Shortform Catalog September 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		PDF M0009-090514 MIC33163 voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765

    micrel shortform

    Abstract: MIC33163 SM802
    Text: February 2015 Shortform Catalog Shortform Catalog February 2015 2015 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		PDF M0009-022415 micrel shortform MIC33163 SM802

    mic3712

    Abstract: XGPON ONU
    Text: February 2014 Shortform Catalog Shortform Catalog February 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		PDF M0009-021414 mic3712 XGPON ONU

    mlag

    Abstract: A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
    Text: Shortform Catalog August 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog August 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		PDF M0009-081213 mlag A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS

    Temperature sensor DC fan based on PSOC 3 kit

    Abstract: "Digital Comparator" I2c cy8c29466-24pxi capacitive touch key sensor cypress MCU 12v and 5v regulated power supply circuit diagram QFN 7X7 32-pin CY8C20236 QFN 48 7x7 footprint qfn 32 5x5 footprint CYPRESS
    Text: CY8C20X36/46/66/96 CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Low Power CapSense Block ❐ Configurable Capacitive Sensing Elements ❐ Supports Combination of CapSense Buttons, Sliders, Touchpads, Touch Screens, and Proximity Sensor


    Original     		PDF CY8C20X36/46/66/96 CY8C20x36: CY8C20x46, CY8C20x96: CY8C20x66: Temperature sensor DC fan based on PSOC 3 kit "Digital Comparator" I2c cy8c29466-24pxi capacitive touch key sensor cypress MCU 12v and 5v regulated power supply circuit diagram QFN 7X7 32-pin CY8C20236 QFN 48 7x7 footprint qfn 32 5x5 footprint CYPRESS

    CY8C20236A

    Abstract: CY8C20436A CY8C27443A-24PXI CY8C20336A-24LQXI CY8C20646A-24LTXI 32 pins qfn 5x5 footprint CY8C20446A CY8C20236A-24LKXIT CY8C20536A CY8C20336A
    Text: CY8C20X36A/46A/66A/96A CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Low Power CapSense Block ❐ Configurable Capacitive Sensing Elements ❐ Supports Combination of CapSense Buttons, Sliders, Touchpads, Touch Screens, and Proximity Sensor


    Original     		PDF CY8C20X36A/46A/66A/96A CY8C20x36A: CY8C20x46A, CY8C20x96A: CY8C20x66A: CY8C20236A CY8C20436A CY8C27443A-24PXI CY8C20336A-24LQXI CY8C20646A-24LTXI 32 pins qfn 5x5 footprint CY8C20446A CY8C20236A-24LKXIT CY8C20536A CY8C20336A

    marking 18w sot23

    Abstract: marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG
    Text: Tape and Reel Packaging Specifications BRD8011/D Rev. 7, January−2007 SCILLC, 2007 Previous Edition @ 2006 “All Rights Reserved’’ http://onsemi.com Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated.


    Original     		PDF BRD8011/D January-2007 marking 18w sot23 marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG

    moving average filter

    Abstract: No abstract text available
    Text: CY8C20X36A/46A/66A/96A CapSense Applications Features 1.71 V to 5.5 V operating range Low power CapSense® block ❐ Configurable capacitive sensing elements ❐ Supports combination of CapSense buttons, sliders, touchpads, touchscreens, and proximity sensors


    Original     		PDF CY8C20x36A: CY8C20x46A, CY8C20x96A: CY8C20x66A: moving average filter

    "Digital Comparator"

    Abstract: CY8C20236-24LKXIT CY8C20x36 I2c cy8c29466-24pxi
    Text: CY8C20X36/46/66/96 CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Versatile Analog Mux ❐ Common Internal Analog Bus ❐ Simultaneous Connection of I/O ❐ High PSRR Comparator ❐ Low Dropout Voltage Regulator for All Analog Resources


    Original     		PDF CY8C20X36/46/66/96 16-Bit "Digital Comparator" CY8C20236-24LKXIT CY8C20x36 I2c cy8c29466-24pxi

    32 pins qfn 5x5 footprint

    Abstract: CY8C20236A CY8C20666A RID27
    Text: CY8C20X36A/46A/66A/96A CapSense Applications Features • 1.71V to 5.5V Operating Range ■ Versatile Analog Mux ❐ Common Internal Analog Bus ❐ Simultaneous Connection of I/O ❐ High PSRR Comparator ❐ Low Dropout Voltage Regulator for All Analog Resources


    Original     		PDF CY8C20X36A/46A/66A/96A 16-Bit 10-Bit 32 pins qfn 5x5 footprint CY8C20236A CY8C20666A RID27

    Untitled

    Abstract: No abstract text available
    Text: Shortform Catalog February 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog February 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		PDF M0009-021913

    IGBT 60A spice model

    Abstract: 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323 DFN 3.3X3.3 HTC Korea SPICE thyristor model 527 MOSFET TRANSISTOR motorola
    Text: Semiconductor Packages and Case Outlines Reference Manual CASERM/D Rev. 2, September−2006 SCILLC, 2006 Previous Edition © 2003 “All Rights Reserved’’ CASERM ChipFET is a trademark of Vishay Siliconix. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.


    Original     		PDF September-2006 IGBT 60A spice model 8 pin ic 3842 motorola an569 thermal IR 948P 0.65mm pitch BGA socket bt 2323 DFN 3.3X3.3 HTC Korea SPICE thyristor model 527 MOSFET TRANSISTOR motorola

    Untitled

    Abstract: No abstract text available
    Text: ISL6113, ISL6114 Data Sheet September 25, 2007 FN6457.0 Dual Slot PCI-E Hot Plug Controllers Features The ISL6113, ISL6114 both target the PCI-Express Add-in card hot swap application. Together with a pair of N-Channel and P-Channel MOSFETs, and two sense resistors per slot, either


    Original     		PDF ISL6113, ISL6114 FN6457 ISL6114 5m-1994.

    IRZ 40

    Abstract: pci-e 98 pins pcb layout PCI-Express 2.0 X8 connector Pinout IRZ 46 graphic card circuit diagram ISL6113 l48 diode marking x16 MOSFET marking -ddr -sdram -rimm -sram -fla ISL6112 ISL6114
    Text: ISL6113, ISL6114 Data Sheet September 25, 2007 FN6457.0 Dual Slot PCI-E Hot Plug Controllers Features The ISL6113, ISL6114 both target the PCI-Express Add-in card hot swap application. Together with a pair of N-Channel and P-Channel MOSFETs, and two sense resistors per slot, either


    Original     		PDF ISL6113, ISL6114 FN6457 ISL6114 5m-1994. IRZ 40 pci-e 98 pins pcb layout PCI-Express 2.0 X8 connector Pinout IRZ 46 graphic card circuit diagram ISL6113 l48 diode marking x16 MOSFET marking -ddr -sdram -rimm -sram -fla ISL6112