BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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QFN 56 7x7 footprint
Abstract: QFN 56 7x7 0.5 TEXTOOL 56 qfn 7x7
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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NP364
Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.
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10mA/20mV
NP445
NP364
QFN11T040-005
QFN11T040-006
QFN11T048-005
QFN11T048-008
QFN11T048-008
A101121-001
NP364
QFN11T032-003
QFN11T040-006
QFN 56 7x7 0.5
NP445-048-001
NP445-064-002
NP364-01649
QFN11T032-004
NP445-032-003
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QFN 64 8x8 dimension
Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
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WA13062DQAET
WA13041DQAET
WA13028DQAET
WA13082DQAET
WA13088DQAET
WA13024DQAET
WA13063DQAET
WA13046DQAET
WA13083DQAET
WA13084DQAET
QFN 64 8x8 dimension
WA13072DQAET
QFN 64 9X9 dimension
qfn 64 9x9
qfn 3x3 socket
QFN 56 7x7
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QFN 64 8x8 dimension
Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
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WA13062DQAET
WA13041DQAET
WA13028DQAET
WA13082DQAET
WA13088DQAET
WA13024DQAET
WA13063DQAET
WA13046DQAET
WA13083DQAET
WA13084DQAET
QFN 64 8x8 dimension
56 qfn 7x7
2x2 dfn
qfn 52 6x6
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QFN 64 8x8 dimension
Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
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W13062
W13041
W13028
W13082
W13088
W13024
W13063
W13046
W13083
W13084
QFN 64 8x8 dimension
DFN 10 socket
qfn 52 6x6
3x2 DFN
7x5 qfn
venice
venice 6
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QFN 64 8x8 dimension
Abstract: No abstract text available
Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
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W13062
W13041
W13028
W13082
W13088
W13024
W13063
W13046
W13083
W13084
QFN 64 8x8 dimension
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QFN 64 8x8 dimension
Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
Text: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.
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W13062
W13041
W13028
W13082
W13088
W13024
W13063
W13046
W13083
W13084
QFN 64 8x8 dimension
W13028
QFN 7x5
2x2 dfn
Winslow
qfn 3x3 socket
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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DUAL ROW QFN leadframe
Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the
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1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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Unit2607
REJ01K0003-0300
1000-pin bga 0,8 mm
HQFP1414-64
HLQFP 176 Package
BGA and QFP Package mounting
HLQFP1414-100
MO-235 FOOTPRINT
QFN 64 8x8 footprint
footprint WSON
LFPAK footprint Renesas
"General Catalog"
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S1L50552
Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells
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S1L60173F00A000
S1L50552
tcon mini-lvds
EPSON tcon
S1X65263
tcon 17 epson
s1k500
SMART ASIC 197
S1K60000
S1L50062
UXGA tcon
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nec 44 pin LQFP
Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
nec 44 pin LQFP
BGA and QFP Package
256-pin BGA drawing
14 pin ic
28-pin QFP
nec 44-pin qfp
44-Pin QFN
65A1
nec 44-pin LQFP
ic packages
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JEDEC Drawing MO-220 qfn
Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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s1l50552
Abstract: encounter conformal equivalence check user guide circuit diagram of mini ips system S1L50062 RTC SL 5500 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory BGA and QFP Package epson lq 300
Text: ASIC Gate Array / Embedded Array / Standard Cell 2007/4- SEIKO EPSON CORPORATION Our goal is to be a true partner that strategically contributes to your product development through our concept of "saving technologies" that save power, time, and space. Gate Array / Embedded Array / Standard Cell
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S1L60843F00A000
ARM720T:
s1l50552
encounter conformal equivalence check user guide
circuit diagram of mini ips system
S1L50062
RTC SL 5500
S1K-7
S1X65263
512M x 8 Bit NAND Flash Memory
BGA and QFP Package
epson lq 300
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mlag
Abstract: A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
Text: Shortform Catalog August 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog August 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-081213
mlag
A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
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prt0
Abstract: No abstract text available
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB
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CY7C6431x
CY7C6434x,
CY7C6435x
prt0
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LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
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64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
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micrel shortform
Abstract: MIC33163 SM802
Text: February 2015 Shortform Catalog Shortform Catalog February 2015 2015 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-022415
micrel shortform
MIC33163
SM802
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MIC33163
Abstract: voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765
Text: September 2014 Shortform Catalog Shortform Catalog September 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents
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M0009-090514
MIC33163
voip ata soc
MICREL top marking for DSC557-0344FI0T
ksz8765
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Untitled
Abstract: No abstract text available
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB
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CY7C6431x
CY7C6434x,
CY7C6435x
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Untitled
Abstract: No abstract text available
Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features • ■ Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB
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CY7C6431x
CY7C6434x,
CY7C6435x
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