QFN 5x5
Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
com/data/tb/TB389
dwg/plastic/P4171
QFN 5x5
qfn stencil
"exposed pad" PCB via
"thermal via"
solder mask
P4171
X-RAY INSPECTION
via diameter pitch
40-QFN
QFN "exposed die"
|
PDF
|
QFN 5X5
Abstract: "thermal via" qfn land pattern
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
com/data/tb/TB389
dwg/plastic/P4171
QFN 5X5
"thermal via"
qfn land pattern
|
PDF
|
TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
|
Original
|
TB389
|
PDF
|
J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
|
PDF
|
J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
|
PDF
|
qfn Substrate design guidelines
Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid
|
Original
|
TB389
qfn Substrate design guidelines
j-std-001d
IPC-SM-782
MO-220
|
PDF
|
J-STD-005
Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging
|
Original
|
TB389
J-STD-005
nozzle heater
paste profile
qfn 10mm land pattern
J-STD-001C
solder joint
IPC-SM-782
MO-220
MARK RAY QFN
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 16 LEAD QFN 3x3mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-16LD-PL-1 Rev A B ECN 102711HC04 102914PM02 Originator S. YEH E. dlSantos Change New release Update land pattern drawing UNIT MM Reason Per George C. Per George C.
|
Original
|
QFN33-16LD-PL-1
102711HC04
102914PM02
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A ECN 112111HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN55-32LD-PL-1
112111HC04
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 28 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-28LD-PL-9 Rev A ECN 010512HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN55-28LD-PL-9
010512HC04
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 16 LEAD QFN 3x3mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-16LD-PL-1 Rev A ECN 102711HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN33-16LD-PL-1
102711HC04
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 14 LEAD QFN 2.5x2.5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN2525-14LD-PL-1 Rev A ECN 042412HC07 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN2525-14LD-PL-1
042412HC07
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 20 LEAD QFN 3x4mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN34-20LD-PL-1 Rev A ECN 110311HC05 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN34-20LD-PL-1
110311HC05
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 24 LEAD QFN 4x4mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-24LD-PL-1 Rev A ECN 112111HC01 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN44-24LD-PL-1
112111HC01
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-2 Rev A ECN 022813HC08 Originator A. Kungo Change New Release UNIT MM Reason Replaces MLF55Q-32LD-PD-1
|
Original
|
QFN55-32LD-PL-2
022813HC08
MLF55Q-32LD-PD-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 16 LEAD QFN 4.0 x 4.0 mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-16LD-PL-1 Rev A ECN 041912HC36 Originator S. YEH Change New release UNIT MM Reason Per George C.
|
Original
|
QFN44-16LD-PL-1
041912HC36
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 24 LEAD QFN 3x3mm PACKAGE (Flip Chip) OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN33-24LD-PL-9 UNIT MM ° Rev A ECN 042412HC06 Originator S. YEH Change New release Reason Per George C.
|
Original
|
QFN33-24LD-PL-9
042412HC06
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.1204 LC5 – 5 x 5 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC5 PCB Land Pattern
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0106 LC3 – 3 x 3 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC3 PCB Land Pattern
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0806 LC4 – 4 x 4 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC4 PCB Land Pattern
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0108 LC3C – 3 x 3 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES Suggested LC3C PCB Land Pattern
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 28 LEAD QFN 5X6mm PACKAGE (Co-Package) OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN56-28LD-PL-2 Lead Frame NiPdAu Via size/Pitch Solder stencil opening/Pitch Comments 0.300-0.350mm/0.80mm 1.55x1.20mm/1.75mm Must be connected to GND plane
|
Original
|
QFN56-28LD-PL-2
350mm/0
20mm/1
11mm/1
113012HC25
HQFN56-28LD-PL-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A B ECN 112111HC04 091014HC05 Originator S. YEH E. dlSantos Change New release Update typo error on note #4 UNIT MM Reason Per George C. Typo error
|
Original
|
QFN55-32LD-PL-1
112111HC04
091014HC05
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 16 LEAD QFN 4.0 x 4.0 mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN44-16LD-PL-2 Lead Frame NiPdAu UNIT MM Lead Finish NiPdAu NOTE: 1. MAX PACKAGE WARPAGE IS 0.05mm. 2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.
|
Original
|
QFN44-16LD-PL-2
076mm
061913HC05
|
PDF
|
